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DesignAdvance Systems announced the latest release of  CircuitSpace, its user-assisted PCB component placement software.
 
This version expands on the tool’s hierarchical approach to PCB design through enhanced auto-clustering and replication technologies. Can expedite the design process by expanding on its capabilities in the areas of template libraries, automatic bypass capacitor assignments, double-sided board placement and intelligent channel and/or port duplication.
 
“Having seen unsuccessful attempts, I was skeptical of any company claiming to have a product that automates component placement. My opinion on the subject changed since I started using CircuitSpace,” said Mark Dills, 20+ year veteran of the PCB business and a Senior PCB Designer with SofTEQ. “The auto-clustering and replication features alone can save hours, days, even weeks of time off of a design cycle.”
 
This release adds features to address the challenges associated with managing frequent board design modifications.
 
The tool guides users through the concurrent board design by:
    * Automatically identifying changes to a board design as they arrive through successive netlist imports
    * Producing addendum clusters for newly added parts
    * Assessing the impact of design changes on component placement and reporting part loss or gain and part type changes
    * Reporting on detailed changes from current board design, to quickly adapt to the new requirements and to facilitate feedback to the hardware engineer
 
DesignAdvance Systems, www.designadvance.com
Photo Stencil aquired the AMTX E-Blade electroformed squeegee blade from Xerox. It is said to improve printdeposition, quality, uniformity and consistency. With a rigid, low-friction, hard-nickel edge, the blade provides cleaner prints, reduced stencil wear and less material waste.

 
"The electroformed E-Blade demonstrated the lowest squeegee pressure of any other squeegee blade I have tested for both SMT and wafer bumping printing," said Rick Lathrop, technical service manager of surface-mount materials at Heraeus. Heraeus recently completed a study on squeegee blades. "With lower print pressures come all of the benefits of reduced understencil wiping frequency and increased stencil life. The lack of paste scooping in large apertures for wafer bumping can only enhance bump coplanarity for automotive and WLCSP applications."

 
The blade also addresses issues caused by Pb-free printing. Pb-free solder paste requires higher squeegee pressures for a clean wipe of the stencil. The E-Blade prints at 33% of the squeegee pressure of other popular squeegee blades. High squeegee pressures result in "smear mode" printing whereas low squeegee pressure allows "sheer mode" printing.

 
Photo Stencil, www.photostencil.com

Almit Technology will debut a new Pb-free paste at Nepcon UK this April, created specifically for printing at up to four-times the normal printer excursion speed. LFM-48 TM HP solder paste reportedly enables increased productivity, allowing European assemblers to bid successfully against competitors in low labor cost countries.

The paste is said to exhibit good wetting, high definition printing with long screen and tack life. It is approved and adopted by major manufacturers worldwide for open blade printing and enclosed print head systems.

For through-hole assembly and rework, Almit has also introduced cored solder wire featuring 96.5%Sn-3%Ag-0.5%Cu alloy. KR-19SH RMA wire retains the benefits of the original product to deliver wetting, high reliability and low residue. It is available in diameters from 0.3 to 1.6 mm on 0.5Kg reels – and in selected sizes on anti-static Handy Reels.

Almit Technology Ltd., almit.com

Visit Stand C2 at Nepcon UK

Page 1786 of 2023

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