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SEFAR PCF is a pre-coated mesh engineered for the stencil parameters and frame sizes of the CD/DVD market segment. Said to provide consistent coating tolerances, stencil durability, wide exposure window and optimal emulsion thickness (EOM) to surface roughness (Rz) combination.
 
Sefar is now launching a fully-coated version, “SEFAR PCF FC” (Pre-Coated Fabric, Fully-Coated). The addition allows additional screen printing market segments access to the benefits of the stencil system. In addition to improving print quality, it also offers process improvement by removing degreasing, coating, block-out and multiple drying steps that are required to prepare a screen.
 
By providing a fully-coated mesh, customers with virtually any size frame can use it: bottle and container manufacturers, pen printers, tube manufacturers, ad specialty companies, membrane switch or industrial product printers, and any small format graphics printer concerned with image quality. Currently available in fine mesh specifications (ie. 305 threads/in. and higher). The coated fabric can be purchased as a roll to stretch in-house, or as a stretched screen from a screen fabrication location.
 
Sefar Printing Solutions, sefar.us
Aqueous Technologies will exhibit StencilWasher-ECO semi-automatic stencil cleaner for solder paste removal at the upcoming Nepcon East exhibition and conference on May 10-11 in Boston.
 
Part of the ultrasonic technology that uses precisely controlled sound waves to remove un-reflowed solder paste and uncured adhesives from stencils, screens and misprints. Ultrasonic energy is gentle, will not damage delicate parts, but is effective in removing even dried pastes on fine-pitch stencils. 
 
Smi-automatic ultrasonic stencil cleaning system can accommodate stencils, screens or misprinted assemblies up to 29 x 29" (736 x 736 mm), and it features a 25" (63.5 cm) immersion depth.
 
Said to provide fast, efficient solder paste removal. Removes solder paste and provides wash, rinse and dry functions. Features a stainless steel wash and rinse tank, and a stainless steel deck.
 
Has a programmable wash cycle timer for consistent operation. Equipped with a handheld rinse wand and airknife.
 
Multiple side-mounted 40 kHz transducers target effective cleaning power onto the stencil or misprint.
 
Aqueous Technologies Corp., aqueoustech.com
Nepcon East booth 3004
JPSA has begun shipping IX-1100 C2C UV 193nm excimer laser wafer processing systems equipped with cassette to cassette automated wafer loading/unloading systems and JPSA advanced factory automation software. These systems can process more than 80 wafers per hour, and are suited for a variety of materials such as: GaAs, silicon and sapphire.
 
Applications include flash-on-the-fly lithography, thin film patterning, annealing, doping, micromachining, microvia drilling, patterning, and more, down to 1 micron resolution. Includes fully automated machine vision alignment and inspection, sub-micron accuracy air bearing stages and large field of view (FOV) homogenized beam delivery systems.
 
IX-1100 is an industrial excimer workstation, a compact integrated UV processing system with a built-in high- power excimer laser. Features automated mask control, step and scan and high-resolution imaging and workpiece viewing using the Chromacel line. Optional modules include beam attenuators and homogenizers and dielectric laser masks.

 
IX-1100 C2C includes an industrial robot that can interface with a variety of cassette modules per customer requirements. Includes JPSA factory automation software, machine vision for fully automatic wafer alignment and automated laser calorimetry of multiple power and energy meters, plus multiple beam profilometers for laser beam size and shape, data archiving and QC. 
 
Available with optional SQL database connectivity.  Typical applications include tracking of process data by part number. 
 
JPSA, www.jpsalaser.com
 

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