Aquanox A4520T Aqueous Chemistry for Flush Mounted and Fine-pitch Components is designed to clean under low standoffs and in the tight spaces caused by smaller, more heavily populated devices. The chemistry has reportedly proven effective on all Pb-free, no-clean and eutectic materials available today, while providing a low cost of ownership.
Works at low temperatures and low concentrations while exceeding industry standards for people and environmental safety. Easy to use, is effective without sump side additives and is said to provide brilliant joints. Features a long bath life, and is RoHS compliant.
Cleans numerous soils including lead-free flux, tacky flux, reflowed paste, no-clean flux, RMA flux, OA paste, oils, fingerprints, light oxides and polymerized soils. Is multi-metal safe for use on yellow metals, aluminum, ferrous, composites and most precious metals. The biodegradable aqueous solution contains no CFCs or HAPs. Is non-flammable and non-corrosive.
Available commercially in one, five and 55 gallon containers.
Optilia Flexia BGA/SMT Video Inspection Microscope is an ESD-protected video microscope for look-down or look-under visual inspection of solder joints on assembled PCBs components, solder/flux mixtures, bare circuit cards/pads, cables/connectors, wire bonds and stencils.
Can be set up in seconds with either a "look-down" macro zoom lens (1-60X) or "look-under" (4X zoom) side-viewing BGA lens. Can be connected directly to a hand held monitor, PC or Laptop via high speed USB 2.0 frame grabber (included). Imaging applications include digital image capture, video recording and optical measurements. Optimized for Pb-free inspection and provides data management and documentation tools.
The side viewing lens offers the capability to look-under and inspect BGAs, µBGAs, CSP and flip-chip packages with minimal package stand-off. The BGA lens captures sharp images of the soldered balls under the BGA package up to 12 mm deep (~15-20 rows) and down to a 0.05 mm stand off. The lens allows users to perform failure analysis and confirm solder ball shape, reflow compression, wetting and flux conditions, and other visual characteristics of SMT/BGA components.
Model 1550 features large board x-ray inspection with automated motion control, measurement and analysis. Has advanced solid-state detector-based inspection for Pb-free assembly, choice of Image Intensifier and CMOS-based high-resolution detectors, full programmability with integrated motion control and image measurement analysis, and simple set up of program using 1-2-GO Interface.
Offers a 130 kV X-ray source, with a continuously variable field of view (up to 1.8" with zoom). Is reportedly easy to learn, use and maintain. Features large-board handling area (18 x 24"), magnification 700X, high MTBF, fully integrated compact system and image archiving in popular file formats.
The set-up program allows users to characterize the entire process with one solution. Has onscreen representation of boards for easy maneuvering.
Incorporates three innovations: A manipulator design provides fast, accurate, repeatable sample positioning; Nexus 300 software with 1-2-GO interface offers maneuverability; CMOS-based 12 bit solid-state detectors for high-contrast resolution x-ray inspection.