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Merit Sensor has received its first Alphasem EasyLine 8088 “Sensor Bonder.” The machine will play a role in the ramp-up of its new production site in Utah. The sensors to be produced at this site are mainly for medical applications (such as blood pressure sensors.)
 
According to a press release, the process control and high throughput of the machine were decisive selling points, as were the handling of ceramic substrates and the die technology. The machine enables Merit to boost pressure sensor output.
 
The equipment is based on the EasyLine platform and features high-speed air bearing pick-and -place, closed-loop linear motor pick tool for bond line thickness control and fully automatic wafer handling system. To meet demands in the field of MEMS and sensors, an active Theta control of the bond head has been implemented.
 
Merit Sensor Systems, www.merit-sensor.com
Alphasem AG, alphasem.com

Ultrasonic Systems will demonstrate the Prism System coating microBGA and flip chip substrates at Semicon West. The system uses ultrasonic technology with a 60 khz titanium spray head and digitally controlled liquid delivery system.  The flux coating thickness ranges from sub-micron to 3 microns.
 
Includes a XYZ gantry with ball screw drives and closed loop servo controls.  Windows XP software allows for easy programming and operator interface to the machine.  Available as batch mode or conveyorized configuration.
 
Ultrasonic Systems, ultraspray.com
Semicon West Booth 8007
Ultrasonic Coating Module is a modular system design for integration into robotic work cells or semiconductor integrated processing systems.
 
Features the CAT 35 ILDS (Integrated Liquid Delivery System) coating head, micro-valve control and PLC controller for integration into work cell software.  This coating head reportedly provides a superior alternative to conventional spin coating, dispensing and other coating technologies.
 
Ultrasonic Systems, ultraspray.com
Booth 8007

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