Products
Omnify 3.0 enables efficient collaboration in product development and helps companies meet RoHS compliance. Meets compliance objectives for such companies as LuminentOIC, Agfa and Mangrove Systems.
The newest version provides a means of identifying the complete material composition of a part. It classifies compliant and non-compliant parts, provides searching and reporting features, and performs analysis at any level of a product’s structure. Allows manufacturers to store all of the materials declarations/certificates of compliance from suppliers.
Incorporates customer-requested enhancements that accelerate and streamline product development. Customers can achieve faster performance in searching, bill of material loading and engineering change releases in addition to easier importing and exporting of data through XML capabilities.
Improvements include:
Accelerated performance for faster BOM loading, saving, releasing changes and searching;
Vendor part composition fields allowing unlimited vendor attributes;
Enhanced permissions offering extended field/attribute and project level permissions;
Improved document vaulting and new caching options;
Attribute Groups for easy field navigation;
New BOM fields including: balloon/find numbers, alternate items fields and user-defined attribute fields;
Condition-based dynamic workflows to define generic workflows/stages and user assignments based on various field parameters;
XML file formats enabling easy importing and exporting of item and database schema information.
Omnify Software, www.omnifysoft.com
The newest version provides a means of identifying the complete material composition of a part. It classifies compliant and non-compliant parts, provides searching and reporting features, and performs analysis at any level of a product’s structure. Allows manufacturers to store all of the materials declarations/certificates of compliance from suppliers.
Incorporates customer-requested enhancements that accelerate and streamline product development. Customers can achieve faster performance in searching, bill of material loading and engineering change releases in addition to easier importing and exporting of data through XML capabilities.
Improvements include:
Accelerated performance for faster BOM loading, saving, releasing changes and searching;
Vendor part composition fields allowing unlimited vendor attributes;
Enhanced permissions offering extended field/attribute and project level permissions;
Improved document vaulting and new caching options;
Attribute Groups for easy field navigation;
New BOM fields including: balloon/find numbers, alternate items fields and user-defined attribute fields;
Condition-based dynamic workflows to define generic workflows/stages and user assignments based on various field parameters;
XML file formats enabling easy importing and exporting of item and database schema information.
Omnify Software, www.omnifysoft.com
Promation introduced its latest multi-level belt conveyors, the “SM” series.
Is available in widths from 6 to 24" and lengths from 2 to 20'. Variable speed drives may be left to right or right to left, offering different flow directions for each level.
Side guides prohibit products from falling off, and stopper bars may be used at exit points.
Promation, pro-mation-inc.com
Visitors to DEK’s booth at Semicon West show will see live demonstrations of the company’s DirEKt Ball Placement process. Utilizing two in-line Micron-class platforms, this technology enables the placement of solder balls as small as 0.3 mm in diameter onto substrates or wafers at repeatable first-pass yields better than 99%. The first in-line system, a Europa, uses flux imaging technology to deposit flux precisely at each interconnect site. The second machine, a Galaxy, then uses a fully enclosed ball transfer head capable of holding up to 50 million solder balls to guide each solder ball directly to the surface of the stencil and seat each ball in the flux. Process cycle time is fast, regardless of I/O count.
The platform is not limited to ball placement and wafer bumping processes. It hosts a variety of advanced packaging applications such as backside wafer coating, thermal interface materials (TIM) deposition and encapsulation. Some applications include high-speed backside wafer coating of die attach materials, epoxies and protective coatings as thin as 25 microns and singulated substrate printing that allows for the individual alignment and imaging of multiple substrates or components down to 20mm.
DEK, dek.com
Semicon West Booth #7139
The platform is not limited to ball placement and wafer bumping processes. It hosts a variety of advanced packaging applications such as backside wafer coating, thermal interface materials (TIM) deposition and encapsulation. Some applications include high-speed backside wafer coating of die attach materials, epoxies and protective coatings as thin as 25 microns and singulated substrate printing that allows for the individual alignment and imaging of multiple substrates or components down to 20mm.
DEK, dek.com
Semicon West Booth #7139
Press Releases
- Aegis Software Expands its Presence in France and Partners with STPGroup
- Altus Adds Breakthrough Automated Inline Laser Depaneling System to its Line-Up
- Fuji America Promotes Chris Dayney to Technical Marketing Manager, Expanding Focus on Premium Technical Content
- BTU International Announces Strategic Manufacturing Expansion in Singapore to Strengthen Global Supply Chain