Products
MINNEAPOLIS, MN – As part of SMTA International – co-located with ATExpo in September in Rosemont, IL – the SMTA has organized its Emerging Technologies Summit to address the latest trends in electronics manufacturing and assembly. The ET Summit, which consists of three paper sessions and a concluding panel discussion, will take place on Sept. 25.
The first session, Packaging Space: Nano to Outer, will feature papers on Emerging Trends Overview, Bonding Techniques in Wafer Fabrication, Flip-Chip Integration of a Large Format Array of MOEMS Devices for Space Infrared Astronomy, Multiscale Assembly and Packaging System for MOEMS, and Nanotechnology and Room Temperature Assembly.
The next session, Wireless Technology, will feature papers on Emerging Opportunities and Challenges for High Frequency Broadband Communications, Connecting the Unconnected – Broadband Wireless Access Technologies, and Network, WiFi, WiMax, WiMedia, WiMe? What Wireless Standards Can Bring to Sensing and Controls.
The last session, Using RFID to Add Value to Your Products and Services, will feature a presentation and demonstration of high frequency and ultra high frequency technology and their application in PCB product environments.
Moderated by Reza Ghaffarian, Ph.D., of Jet Propulsion Laboratory, the panel discussion will feature key industry participants who will respond to audience and moderator questions.
For event registration, visit smta.org/smtai.
The first session, Packaging Space: Nano to Outer, will feature papers on Emerging Trends Overview, Bonding Techniques in Wafer Fabrication, Flip-Chip Integration of a Large Format Array of MOEMS Devices for Space Infrared Astronomy, Multiscale Assembly and Packaging System for MOEMS, and Nanotechnology and Room Temperature Assembly.
The next session, Wireless Technology, will feature papers on Emerging Opportunities and Challenges for High Frequency Broadband Communications, Connecting the Unconnected – Broadband Wireless Access Technologies, and Network, WiFi, WiMax, WiMedia, WiMe? What Wireless Standards Can Bring to Sensing and Controls.
The last session, Using RFID to Add Value to Your Products and Services, will feature a presentation and demonstration of high frequency and ultra high frequency technology and their application in PCB product environments.
Moderated by Reza Ghaffarian, Ph.D., of Jet Propulsion Laboratory, the panel discussion will feature key industry participants who will respond to audience and moderator questions.
For event registration, visit smta.org/smtai.
NEW YORK -- Investors may want to be cautions when approaching shares of Sanmina-SCI, said Cowen and Company analysts Louis R. Miscioscia told Forbes. Apparently the company has had some suspicious timing of its stock options awards.
At a time when more and more technology companies are coming under investigation by the Securities and Exchange Commission for irregular stock options granting practices, Miscioscia said Sanmina's story is the "most interesting" out of all the EMS companies he covers.
LPKF recently released the bench-top ProtoFlow Oven for Pb-free reflow soldering. The new design has been influenced by the stringent process requirements of Pb-free technology, and by the prior oven model, the ZelFlow R04.
Maximum process temperature is 320°C/608°F; it incorporates four internal temperature sensors and a multiprocessor controller board, which ensure even heat distribution over PCBs up to 9 x 12”. Has several software zones between preheating and final reflow to process most reflow profiles, as well as prototyping, technology research and even pre-production testing.
An optional four additional sensors can also be freely mounted on the PCB by the operator, enabling on-board temperature to be recorded and displayed in real time on a PC through a standard USB connection. Reflow process can be observed through a large window.
Has pre-programmed process profiles, which can be easily selected using four navigation keys. Custom profiles may also be created on your PC and uploaded to the oven. Includes an LCD display and intuitive software interface. Process parameters can be exchanged with a PC, managed and archived. Microsoft Excel can be used monitor and document progress parameters for complete quality management documents.
LPKF Laser & Electronics, lpkfusa.com
Maximum process temperature is 320°C/608°F; it incorporates four internal temperature sensors and a multiprocessor controller board, which ensure even heat distribution over PCBs up to 9 x 12”. Has several software zones between preheating and final reflow to process most reflow profiles, as well as prototyping, technology research and even pre-production testing.
An optional four additional sensors can also be freely mounted on the PCB by the operator, enabling on-board temperature to be recorded and displayed in real time on a PC through a standard USB connection. Reflow process can be observed through a large window.
Has pre-programmed process profiles, which can be easily selected using four navigation keys. Custom profiles may also be created on your PC and uploaded to the oven. Includes an LCD display and intuitive software interface. Process parameters can be exchanged with a PC, managed and archived. Microsoft Excel can be used monitor and document progress parameters for complete quality management documents.
LPKF Laser & Electronics, lpkfusa.com
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