Products
El Segundo, CA – Spansion LLC in the first quarter retained its position as the world’s leading supplier of NOR-type flash memory, according to preliminary market-share data from iSuppli Corp.
The U.S.-based company achieved NOR sales of $562 million in the first quarter, down 6.5% sequentially. Intel held onto second place with revenue of $537 million, down 10.5% from $600M in the fourth quarter. Europe’s STMicroelectronics remained in third place with revenue of $327 million, a 2.4% decline from Q4.
The U.S.-based company achieved NOR sales of $562 million in the first quarter, down 6.5% sequentially. Intel held onto second place with revenue of $537 million, down 10.5% from $600M in the fourth quarter. Europe’s STMicroelectronics remained in third place with revenue of $327 million, a 2.4% decline from Q4.
Woodinville, WA – PCB manufacturer UMC (Universal Manufacturing Corp.) has acquired additional advanced technology processing equipment, including two Pluritec auto loading CNC drilling machines, a Lohr Herman CNC jump scoring machine, an X-ray registration/ verification system, a thin core/fine line copper etching system, an advanced fine line laser photo plotter and an RoHS-compliant immersion silver/gold plating line.
UMC also announced that Ken Stowers, former owner of Velie Circuits Inc. (Costa Mesa, CA), joined UMC as VP of marketing. Rob Newton and Shaun Salas, also formerly of Velie Circuits, joined as direct sales people.
PHOENIX, AZ – FlipChip International and Engent have formed an alliance to accelerate the development and deployment of 3-D Wafer Level CSP (WLCSP) technologies for highly integrated stacked die packaging applications. This technology may enable packaging solutions that are quicker to market and lower cost than system-on-chip alternatives.
The partnership couples FCI’s high-volume, ultra-fine pitch wafer bumping capabilities and 2-D Wafer Level CSP package portfolio with Engent’s abilities in advanced surface-mount and flip-chip assembly technology. The flexible technology platform emerging from this partnership supports a range of ultra-high volume IC packaging applications including Silicon on Silicon, GaAs on Silicon and SiGe on Silicon as well as 3-D integration of emerging integrated passive device technologies and MEMS devices for System in a Stack solutions.
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