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TOKYODenso Corp. in July will begin construction of new facility on the premises of its Agui Plant located in Japan. Denso Elecs Co. Ltd. will transfer its headquarters and electronic product manufacturing plant from its Takatana Plant to the new facility, expected to be completed in March 2007.
 
The company expects to invest around $19 million (USD) in the 12,800 sq. m. building.
 
Production of electronic products including bar-code readers, IC card readers, and programmable controllers is scheduled to start in May 2007.
 
The company also announced future plans to move the development division of Denso Wave to the Agui plant.

Atotech introduces StannoPure HSB Bright Tin Plating and Stannopure HSM Matte Tin Plating Products in the U.S. 
 
The range of pure tin processes have been developed to meet the EU directives WEEE and RoHS, which ban the use of lead in the electrical and electronic industries. While matte tin has become a favored SnPb alloy replacement option in plating connectors, bright pure Pb-free tin has not yet gained market attention in electronic applications.
 
“With StannoPure HSB, your customers can now benefit from a ‘whisker-mitigated’ bright tin electrolyte, complying with JESD 22A121.01 requirements,” said Gene Barlowe, U.S. functional electronics coatings manager.
 
Atotech, atotech.com
 
Boston, MA -- Innov-X Systems has joined with GoodBye Chain Group and NSL Analytical to present a series of online webinars to build awareness and provide information and knowledge on RoHS/WEEE Directives.
 
An hour-long meeting on June 15 at 2 p.m. EST will enable discussions with legal, technical and business experts regarding Pb-free due diligence.
 
For more info, visit goodbyechain.com/content/view/46/61/ 

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