Products
Goepel’s JTAG/Boundary Scan includes VarioCore. Reportedly allows the reconfiguration of Scanflex I/O modules with special intellectual property to support a range of test capabilities in the same hardware setup.
Goepel, www.goepel.com
Goepel, www.goepel.com
The Opto-Bonder Femto handles various assembly technologies, including power laser/laser bar bonding, flip chip and VCSEL bonding, MEMs and MOEMs, sensors and micro-optics, chip on glass and simple die attach. Said to combine accuracy (+/-0.5 micron) and flexibility in a small footprint (1270 x 900 mm). Reported features: a 25% larger table, motorized x, y, z and theta movements, maximum die size up to 4" diameter, and substrate size up to 6" diameter. Bonding processes automatically controlled.
Finetech, www.opto-bonder.com
Finetech, www.opto-bonder.com
PowerStrip interconnects are rated for applications up to 28A at 80°C and have up to eight blade style contacts. Forty signal pins are standard and are said to handle up to 3A of current at 80°C. Available for parallel board spacings of 19 mm, and for perpendicular and coplanar board interface applications. These polarized through-hole connectors are for rugged applications; right-angle versions have screw-down features. Are RoHS-complaint and suitable for lead-free processing.
Samtec, www.samtec.com
Samtec, www.samtec.com
Press Releases
- Adam Ryder appointed as Managing Director of Incap UK
- Metal Etch Services Opens New Motor City Facility to Meet Growing Midwest Demand
- Yamaha surface-mount line powers the future of specialized production at Inter-Company in Netherlands
- Matric Group Becomes the First U.S. Manufacturer to Deploy Panasonic NPM-GH Dual Lane SMT Technology