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Vectra liquid crystal polymer S135 reportedly has a distortion temperature under load (DTUL) of 335°C (635°F), improved weld-line strength, and a reduced viscosity that allows it to fill walls as thin as 0.2 mm (0.008"). Can be molded at tool temperatures below 93°C (200°F) and has low outgassing levels.  
 

Agilent Process Control Software is a defect-prevention package and has statistical process control and charting package capabilities. Can be used with the Medalist SJ50 AOI and Medalist SP50 solder paste inspection system for paste, pre- and post-reflow trends and defect analysis. Highlights include user-defined charting and alarming, historical and live-data analysis, production summary reports, and worst-feature analysis. Historical and live images are embedded into the charts.
 
Agilent, www.agilent.com 

Araldite 7047 is a one-component, silver-filled epoxy adhesive said to combine high electrical and thermal conductivity. Is said to be a high purity, 100% solids system for void-free bonding of circuitry and ICs. Features a work life of up to four days at room temperature and reportedly cures in one hour at 165ºC (329ºF). Is compatible with Pb-free processing. Has aluminum/aluminum lap shear strength of 1300 psi and gold/gold die shear of 1700 psi at room temp. Volume resistivity at room temp. is <0.0002 ohm-cm. Has a Tg of 130ºC (266ºF) and CTE of 72 ppm/ºC. 
 
Huntsman Advanced Materials, www.huntsman.com/electronics

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