Products
BR790-HD rework system aids in the removal, alignment, placement and soldering of BGAs, CSPs, ultra-fine-pitch QFPs, and other heat-sensitive SMDs. Has 1.3m pixel, split-vision optics and 15" high-res display. Component presentation nest is mounted to the optics’ X and Y drives; automates pickup and positioning of the component in the camera’s field of view and reduces handling of SMDs. Five separate input connectors allow positioning of K-type thermocouples. LCD touchscreen displays real-time temperatures and allows adjustment of top and bottom hot air heater settings. Includes edge-clamping system that adjusts to fit boards up to 21.6" x 19.7". Has 6-zone rapid IR under-heater. Capable of supplying up to 3600w of heating power.
Manncorp, www.manncorp.com
NanoClear stencil treatment is reportedly now 50% stronger. Reduces frequency of underside cleaning. Better performance from stencils with low aperture area ratios. Uses self-assembled monolayers with phosphonates that are compatible with common types of stencil alloys, including stainless steel, electroform, nickel, and e-polished stencils. Monolayers are fewer than 5nm thick and covalently bound to the surface.
Aculon, www.aculon.com
Indium9.91 no-clean solder paste is for package-on-package applications 0.3mm and larger. Rheology optimizes dipping and package retention. Reduces defects due to package warping; provides solderability; has long pot life, and provides consistent solder paste volumes. Can be used with SAC 305 and Sn63 alloys.
Indium, www.indium.com
Press Releases
- Zero Defects International Doubles PCBA Testing Service Capacity
- SEMI Applauds Statement from Senators Crapo and Wyden Supporting U.S. Tax Credit for Semiconductor Manufacturing
- ECIA’s July Industry Pulse Sentiment Index Suffers Summer Slide and Dips 12.5 Points from June High
- Datest to Host Siemens EDA Webinar on Data-Driven PCB Test Planning for Increasingly Complex Electronics Designs