Products
The 4800 wafer level bondtester was developed for testing wafers from 200mm up to 450mm. Paragon software provides flexibility for the creation and mapping of wafers, enabling setup of test patterns. Virtual images for each test pattern reportedly enable easy editing.
Nordson Dage, www.nordsondage.com
MP-520 SiP inspection system combines precision linear drive motor technology with 25MP CoaXPress camera, 3D confocal measurement system and Omni-vision 3D digital multi-frequency moiré technology. Is configured with eight phase color lighting and four 10MP side-view cameras. For measurement and inspection of solder ball/bumps, bond wire, chip bonds, discrete devices, heat sinks, underfill, printed circuit boards, and packages. Results are stored in a central database, enabling remote access SPC data through Intellisys total quality management system software.
Mirtec, www.mirtecusa.com
Adjust-a-Vac vacuum tweezer is for handling very thin/delicate substrates, wafers, MEMS devices and other fragile components. Can adjust vacuum level from 1-10" of mercury. Integrated 10-segment bar graph display shows vacuum level present during operation. Bar graph shows minimum vacuum pressure until part is grasped, then displays vacuum level presented to the part being handled. Vacuum port integrates a user-replaceable inlet filter.
Virtual Industries, www.virtual-ii.com
Press Releases
- Kurtz Ersa Partners with E-tronix for Sales in Illinois and Wisconsin
- XLR8 EMS Welcomes Raul Jorge Lopez Jr. as Director of Program Management and Procurement
- Koh Young America Promotes Ramiro Mora to Lead Service and Applications in Mexico and South America
- ViTrox Americas Welcomes Huy Pham as Technical Support Engineer