ACT100Lite automatic wet scrubber for metal masks used in solder printing is said to reduce costs and space requirements by limiting metal masks’ size to small. Uses a novel small-area scrubbing method. Scrubbing and drying occur inside scrubber, eliminating contact with solvent and exposure to airborne cleaning solution for operator safety. The simple configuration minimizes maintenance costs and the need to replace consumables.
OKI Communication Systems, http://www.oki.com
TC-3040 thermally conductive gel is a thermal interface material (TIM-1) developed with the help of IBM. Reportedly offers more reliable
thermal management, reduced stress and excellent under-die coverage for flip chip applications. Is said to deliver nearly two times the thermal performance of other industry standard TIMs, as well as high thermal conductivity targeting 4W/mK with reliability. Offers broader design options for high-performing, reliable ICs.
Dow Corning, www.dowcorning.com
Multi-ɸ variable laser spot diameter system optimizes laser exposure diameters to fit any component size or board patterns. Laser beam spot diameters are adjustable without moving. Beam spot diameters adjustable within 0.1-3.0mm. Diameter range determined by optical fibers and lens configuration. Variable spot diameters accommodate diverse component shapes and land patterns. New feeding mechanism feeds solder wire from any direction. Mixed-component assembly PCBs now can be processed with just one machine. Replacement laser heads are now available for existing laser soldering customers.
Japan Unix, www.japanunix.com/en/products/laser/multi-phi.php