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THT-Line AOI for double-sided inspection of plated through-hole assemblies now comes with tape transport in addition to roller conveyor for work piece carriers. Inspects selective solder joints on assemblies transported without work piece carrier. Can be used both for actual manufacturing process in the upper area of the system as well as return transport in lower area of the machine. Also has laser measuring system for coplanarity control (e.g., for connectors) or for height measurements on various components. Up to two different and independently operating AOI modules can be integrated into a single system chassis. 

Goepel Electronics, www.goepel.com

EMS 618-15 is a room temperature cure two-part conductive adhesive for printed circuit board assembly applications. Is said to cure in 24 hr. at room temperature or rapidly at elevated temperatures. Has a 10-to-1 mix ratio and comes in a two syringe package designed for use with static mix heads. Forms high-strength, high-reliability conductive interconnects.

Engineered Material Systems, www.emsadhesives.com

 

Unix FS flash soldering series has a speed upgrade with an integrated optical laser configuration; is reportedly two times faster than a typical laser. Can integrate pre- and post-soldering processes such as surface mount and through-hole devices. Depending on conditions, 100 points can be soldered in fewer than 30 sec. at <0.25 sec./point. Integrates soldering process for solder paste and wire; has a coaxial camera that follows soldering work scenes. Soon will feature automatic correction and error detection. Is possible to integrate pre- and post-soldering.

Japan Unix, www.japanunix.com

 

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