C2A-06-G1350-120 rectangular rosette gage and C2A-06-015LW-120 uniaxial linear gage are designed for precise, stable, and reliable stress analysis of printed circuit boards. Detect PCB surface strains at critical locations in consumer electronics. C2A-06-G1350-120 is a stacked rosette gage with a 5mm diameter matrix and 3m of three-conductor cable to eliminate lead wire soldering after bonding. Advanced Sensors strain gage technology reportedly makes smaller planar rosettes possible for use in surface mounting applications with restricted areas, as well as for intra-laminar strain measurement. C2A-06-015LW-120 is supplied with pre-attached cables; features active grid length of 0.015" and an overall matrix of 1.4 x 1.9mm. For installation on surface mount components.
Micro-Measurements, www.micro-measurements.com
VisionXP+ convection reflow soldering comes with vacuum option. Eliminates gas inclusions inline during convection process. Improves heat transmission and reduces emissions. Is said to cut energy use up to 20% and generate an average of 10 tons less CO2 per year. Vacuum model removes pores, gas inclusions and voids, and with a negative pressure of up to 2 mbar void rates of below 2% are possible. Pressure and speed can be regulated individually. Optional second pyrolysis installed under the inlet and outlet area makes effective residue management possible.
Rehm Thermal Systems, rehm-group.com
BasicLine and AdvancedLine AOI software now reportedly provide faster 360° inspection of components and solder joints. Enable higher fault detection. New optimization algorithms reportedly cut test procedure times up to 40% using multiple angled-view inspections from different directions. Angled-view module offers a large field of view with image quality at a viewing angle of 45°. Angled-view inspection with a rotation step size of 1° evaluates hidden solder joints. Software update available for installed systems.
Goepel electronic, www.goepel.com