News
AYLESBURY, UK – Nordson Dage has developed a new test method for the evaluation of die strength by means of cantilever bending, where three-point bending is not suitable for die with a thickness of fewer than 50µm.
EARTH CITY, MO -- Raven Industries will close its facility here by next fall and lay off 58 workers.
FRANKLIN, MA – Pat O’Brien will take over as vice president and general manager of Speedline Technologies on Jan. 1. O’Brien is currently vice president and general manager of ITW Thermal Processing.
SAN JOSE — Worldwide semiconductor manufacturing equipment orders rose 4% year-over-year to $9.32 billion in the third quarter, SEMI said.
FRAMINGHAM, MA -- Looming software advacements underpin IDC's annual list of worldwide manufacturing predictions, released late last week.
SAN DIEGO – Robbie Bach, former president of entertainment and devices at Microsoft, will present the opening keynote at IPC Apex Expo here Feb. 24 about the history of the Xbox.
Press Releases
- PARMI Enhances Support for Brazilian Electronics Manufacturers with New Local Partnership
- ZESTRON Expands Capabilities with Addition of the EPS by i-Tech AG 75 Pallet Cleaning System
- BMK strengthens its coating expertise for electronic assemblies with a technology initiative
- Altus Group Strengthens Leadership with New Operations Director