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The 2710 system combines 0.24 s/Mb programming technology, FX4 socket modules
and a concurrent programming system. Programs devices with densities up to 4
Gb, has a high-speed USB 2.0 standard bus for communications. Programs a 64 Mb
device in 15 sec. Can program up to 24 devices at the same time. Guards against
passing blank parts.
BP Microsystems, bpmicro.com, Booth 5635
Aquanox A4630 aqueous cleaner is for Pb-free materials. Typically used
in spray-in-air equipment at 10 to 20%, from ambient temperatures and
without sump side additives. Said to provide brilliant joints, pass
after pass, throughout an extended bath life.
Kyzen Corp., kyzen.com, Booth 5834
Kyzen Corp., kyzen.com, Booth 5834
Zestron America
will showcase its lead-free cleaning process solutions, and will also
feature its recent advances in PCB, stencil/misprint and maintenance cleaning
applications. The applications technology and sales team will be available
to answer precision cleaning questions.
Zestron America,
zestronusa.com, Booth 5609
MPM AccuFlex printing system will be part of the live, working
electronics assembly line. The printer is for moderate volume, high-mix
printing. Combines accuracy and flexibility in a compact footprint, the
printer offers a range of options for future expansion or advanced
processes. Designed for production of 8,000 boards/week, with two or
more product changeovers per shift.
MPM Accela printing system features parallel processing technology. Said to produce the most boards/hour of any industry printer – delivering raw throughput gains of 20 to 80% over competitors and generating more quality boards per hour. Designed for ease of use, features a new design and easy-to-use operator interface. Is positioned for lead-free assembly and complex boards.
Electrovert OmniExcel 7 is a lead-free capable, seven-zone, forced convection reflow oven. Features an advanced chamber design for balanced airflow with minimal turbulence, to improve heat transfer and reduce power and N2 consumption. Compared to other platforms, reportedly consumes up to 50% less power and 35% less nitrogen. Can be equipped with self-cleaning Flux Extraction Systems (FES), delivering a drop in maintenance intervals to once per month. OmniCheck monitoring system delivers a redundant check on process temperatures and conveyor belt, and provides both extensive data tracking and monitoring capabilities of the process parameters. In addition Speedline will exhibit its Electrovert Quick-Change Solder Module equipped with the new UltraFill Nozzle.
Speedline Technologies, speedlinetech.com, Booth 5710
MPM Accela printing system features parallel processing technology. Said to produce the most boards/hour of any industry printer – delivering raw throughput gains of 20 to 80% over competitors and generating more quality boards per hour. Designed for ease of use, features a new design and easy-to-use operator interface. Is positioned for lead-free assembly and complex boards.
Electrovert OmniExcel 7 is a lead-free capable, seven-zone, forced convection reflow oven. Features an advanced chamber design for balanced airflow with minimal turbulence, to improve heat transfer and reduce power and N2 consumption. Compared to other platforms, reportedly consumes up to 50% less power and 35% less nitrogen. Can be equipped with self-cleaning Flux Extraction Systems (FES), delivering a drop in maintenance intervals to once per month. OmniCheck monitoring system delivers a redundant check on process temperatures and conveyor belt, and provides both extensive data tracking and monitoring capabilities of the process parameters. In addition Speedline will exhibit its Electrovert Quick-Change Solder Module equipped with the new UltraFill Nozzle.
Speedline Technologies, speedlinetech.com, Booth 5710
EnviroMark 907 (EM907) is a no-clean, lead-free solder paste.
Designed for high-yield, lead-free manufacturing, was
engineered specifically for the higher thermal demands and higher melting temperature
lead-free alloys, such as the SnAgCu (SAC) alloys. Features a long
stencil life, offers lead-free joints that closely resemble those achieved with
Sn/Pb solder paste. Capable of extended downtimes in printing, maintains
excellent print quality at print speeds up to 6 in/sec. (150 mm/sec). Has
excellent cold and hot slump behavior, preventing bridges and solder ball
formation. Said to have excellent solderability to a variety of board surface
metallizations, including OSP, Ni/Au, Immersion Sn and Immersion Ag. Features
solderability to an array of component metallizations, including Pd/Ag and
Alloy 42. Flux chemistry offers bright solder joints, even in air reflow.
This cosmetic feature is an added benefit during inspection. The paste leaves
only a light-colored residue and provides a stable tack life.
Reflowable
in air or nitrogen, prints down to 0201 pad sites, has superior printing
characteristics to 16 and 20 mil pitches (0.4 and 0.5 mm) and meets J-STD-004
Flux Classification ROL0.
Kester, kester.com, Booth 5636
Christopher
Associates will introduce two automatic optical inspection systems, as well as
a laser robotic soldering system. NSpec DL 18 is the latest addition to the
Marantz (Tokyo, Japan) AOI product line. Offers
high speed first article inspection, advanced illumination and very high
resolution optics, can even inspect 01005 components at very high speeds. KY
3020T bench top, 3-D solder paste inspection system from Koh Young Technology (Seoul, Korea)
offers the accuracy and speed of the standard inline systems for high mix/low
volume applications. Model 414L laser robotic soldering system from Japan Unix
Co. Ltd. was developed for lead-free processing with reduced cost of ownership.
Christopher Associates, christopherweb.com, Booth 6120
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