Pb-Free suite of materials for electronics assembly includes no-clean
and water-wash solder pastes, solder preforms in tape and reel
packaging, wave solder flux, reworkable no-flow underfill, and rework
and repair materials.
Verifier HR high-resolution x-ray system
addresses failure analysis and manufacturing/rework quality assurance
applications for PCBs up to 16 x 18". A 90kV, 5 micron microfocus x-ray
source supplies power to penetrate shielded packages; high-definition imaging
train provides >650X magnification for microscopic interconnections. Cabinet
measures 32 x 34".
Vision-Rework machines place BGA or CSP components onto the array prior
to reflow, without surface tension assistance. Lightning model has a
focal bottom heater, Marksman has a panel bottom heat system. Offer
manual component placement arm with final precision touch-down stage.
Include a 16-profile, 16-segment controller.
Lead-Free Thermal Process kit includes a SlimKIC 2000 profiler with
either nine or 12 high-temperature thermocouple inputs, and the
Auto-Focus oven recipe search engine, to automatically select the best
recipe for Pb-free applications. Metal shield offers thermal protection
and a low height. Includes TCs rated to 400°C and aluminum tape for
attachment. Operates in real-time or as a datalogger.
Horizon 01i meets assembly challenges from high-mix to high-volume,
including 0201s and CSPs. Features Cpk 2.0 @ 25 microns and a 10 sec.
cycle time. Includes Instinctiv user interface, Interactiv Web-based
support service and optional 1200 mm2/sec. Hawkeye print verification
system.
Multicore MP218 SnPb paste reportedly offers
high-temperature processing and excellent wetting characteristics, for use in
conjunction with Pb-free terminated components and board finishes. Halide-free,
no-clean formulation is pin-testable. Said to offer broad process windows and
exhibit high resistance to humidity.