AIM will highlight its lead-free soldering materials, including the SN100C lead-free alloy. A live lead-free selective soldering demonstration with the alloy is in booth 5437. SN100C, created by Nihon Superior in Japan, is comprised of tin, copper and a small amount of nickel. The nickel modifies its behavior so that in wave soldering it exhibits fluidity comparable with tin-lead solder. Excess solder drains easily off the joint, so bridges and icicles are avoided. Provides smooth, bright, well-formed fillets which make inspection easy. Does not contain silver or phosphorus, is less aggressive toward the copper of traces and pads or the stainless steel components of soldering equipment. Has a low dross rate.

AIM, aimsolder.com, Booth 5434

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Siemens Logistics & Assembly Systems Inc. this month unveiled its first machine manufactured in Singapore, the SIPLACE HS-60 high-speed pick and placer. It’s the result of 14 months of development and technology sharing with the company’s Munich headquarters, and symbolizes a new path for the Germany-based equipment giant. Siemens L&A Americas product manager Tom Foley spoke with Circuits Assembly.

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After being given up by many for dead, business is heating up at BTU International. In one of the industry’s top feel-good stories, the maker of soldering equipment has posted three straight profitable quarters, with net sales for the first half of 2005 up 12% to $28.6 million.

The stunning turnaround comes on the heels of 14 straight money-losing quarters, dating to March 2001. And it comes with several familiar faces back where they were before the company’s troubles began. In an exclusive interview with Circuits Assembly, company officials laid out the simple yet effective steps behind the resurgence, and pointed to several promising signs for continued success. (The company is exhibiting this week at AT Expo, booth 5139.)

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