caLogo

Bob Willis

Is the board preheat process optimized?

This month we look at incomplete fill of plated through-holes. During any soldering operation a balance of flux and solder/paste chemistry and soldering temperatures creates good and reliable joints. In FIGURE 1 the solder has not filled the hole completely but still exceeds the requirements of IPC-A-610, class 2 of 50%; measured, it may be 75% filled.

 

 

 

 

To continue reading, please log in or register using the link in the upper right corner of the page.

Submit to FacebookSubmit to Google PlusSubmit to TwitterSubmit to LinkedInPrint Article
Don't have an account yet? Register Now!

Sign in to your account