Exposed copper coupled with silver final finish is causing opens.

Figures 1 and 2 show two images of the same problem: one x-ray, the other optical. In both cases it’s the result of sulphur corrosion on the surface of copper and silver surfaces.

Both surfaces remain exposed after a soldering operation, and in the presence of sulphur, it is possible to witness corrosion. In time it can result in an open connection, as the figures show. Figure 1, taken on a Dage x-ray system, shows different degrees of corrosion on the tracking just below the solder joint fillet. In failure investigations it’s important to see and record as much as possible without change or damage to the sample. On one joint there was an open connection on this QFP device.

A multi-part study found plenty of whiskers, but not where they were expected.

The elusive tin whisker is only 1/100th the width of a human hair, but this tiny, single filament protrusion can wreak havoc with all sorts of electronics, and has even been cited as the cause of some sudden acceleration failures in cars.

Growth at all costs usually costs too much.

Psst! Hey you! Yeah, you over there … EMS guy. Don’t turn around and ignore me just because I’m a shadow of what I used to be…. I wanna help.

IPC Apex Expo came to a close on March 27, completing its annual three-day run at the Mandalay Bay Convention Center in Las Vegas. The trade show, the electronics assembly industry’s largest in the US, appeared to most observers to have attracted slightly more attendees than last year’s event in San Diego, and exhibitors on the whole seemed relatively upbeat about the year ahead.