EINDHOVEN, THE NETHERLANDS -- Keiron Printing Technologies has raised $24 million to accelerate commercialization of its laser-Induced forward transfer (LiFT) solder paste printing technology for electronics assembly.

Keiron's HF2 LiFT printer replaces conventional stencil printing, jet printing and solder paste inspection (SPI) with a digital, non-contact process designed to improve first-pass yield, reduce production lead times and simplify programming for high-mix, low- to medium-volume manufacturing.

The company said the funding will support production scale-up, global commercial expansion across Europe, North America and Asia-Pacific, and continued development of its next-generation LiFT printing platforms. The technology is designed for high-reliability electronics applications, including AI hardware, where increasing interconnect densities are challenging traditional solder paste printing processes.

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