Cookson EAM Launches ALPHA OM-325 Pb-Free Paste
ALPHA OM-325 lead-free solder is said to simplify the transition to µ-fine feature printing in lead-free processes. Reportedly offers excellent print transfer efficiency, self-alignment properties with small components down to 0402 or 01005", joint cosmetics across challenging reflow profiles, low voiding performance and product stability.
"We developed ALPHA OM-325 in our Japanese R&D center in collaboration with leading global adaptors of lead-free technology for use in their high end consumer electronics products," said Valentijn Van Velthoven, global product manager. "Our rigorous product development work for OM-325 can be compared to what Formula One technology means for the automotive industry. We have achieved tomorrow's technology, and made it available today."
Made with Type 4 and 5 powder, the paste delivers excellent µ-fine feature print yield and works well in demanding high-soak reflow profiles.
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