VIPx (Verifier Image Processor) is a PC/Windows XP-based Image Processor that delivers solder joint, package and PCB board level diagnostic software capabilities for visualization, precise measurement and user defined (pass or fail) analysis of SMT/BGA solder joints, PCBs, components, mechanical parts and electrical interconnections. Suitable for upgrading almost any x-ray inspection system, (manual or semi-automated) with PC-based functionality.
 
Application centric tool set focuses on key high-use features facilitated by wizard-driven diagnostic helpers. Algorithm-based inspection modules automatically find solder connections and perform measurement and defect detection by operator defined pass/fail analysis criteria. This collective image processing automatically finds failures at the solder joint level or selected regions of interest (voids, opens, shorts, ball size, ball shape,
etc.) by color-coded indicators. Data collection and e measurement reporting further isolate, quantify and document faults for corrective action.
 
Features a number of modules for BGA analysis, SMT analysis, custom analysis, package analysis, PCB analysis or image enhancement.
 
An extension of the VIP software series offered on Verifier, Concept FX and refurbished Nicolet x-ray equipment products. Can be added to any camera-based x-ray inspection systems offered in the industry.

Focalspot, focalspot.com

TSD-100 thermal shock chamber can meet the Mil-Std 883 test method 1010.7 with up to 22 lbs. of samples, such as plastic IC chips. Overall interior volume is 4 cu. ft. (100L), allowing testing of larger products and sub-assemblies, as well as large quantities of components like ICs.
 
Measurer 44” wide, resulting in a 40% smaller footprint than the ETS4-2CW. Overall power consumption (full-load amps) has been reduced by 60%. Have Copeland brand Scroll refrigeration compressors and touch-screen controller mounted on the door.
 
Has an interior of 28 x 16”.
 
STT, or Specimen Temperature Trigger, actively monitors the temperature of the product and only advances the program to the next step once the product has reached the desired temperature. It adjusts the soak period according to how much product is being tested.
 
Other features include:  a flexible cabling tube (for monitoring or powering samples) that comes out the side, rather than a moving pipe that sticks out the top; a cool-down mode; an option for a window to check on the samples r.
 
Built at ESPEC’s headquarters in Japan and will be stocked at their Michigan factory along with replacement parts. A one-year parts and labor warranty is included.
 
ESPEC Corp., espec.com

B2 Benchtop automated optical inspection system for post-reflow PCBs is said to offer up to a three times improvement in inspection speed and improved fusion lighting to provide defect coverage. Features large board handling in a compact package, and complete software/board setup compatibility with the inline F1 series. 
 
Operators typically take less than 30 min. to create a complete inspection program including solder joints. Uses a stand package library to simplify training and ensure program portability across manufacturing lines. Image processing technology integrates several techniques, including color, normalized correlation and rule-based algorithms to provide inspection coverage with a low false failure rate.
 

Provides diagnostic and trending analysis of the manufacturing process.

Features a package of SPC charts, including X-bar range, X- moving range, histogram, Pareto analysis, scatter plot, Cp, CpK and other reports that provide real-time alarms for out-of-tolerance conditions. Compatible with YESTech AOI and YTX-5000 combined x-ray/vision system.
 
YESTech, www.yestechinc.com

MEP 6T servo electric press specializes in the application of compliant pin connectors to PCBs.
 
Uses a PC-controlled servo drive to control and monitor force, position and speed throughout the press cycle. By monitoring the entire press cycle, it can determine if a connector is being applied incorrectly and stop the process to avoid scrap and rework. Complete press cycle data can be stored for each connector applied to provide full traceability for the entire PCB.
 
Programming is provided through a Windows interface with database-driven software. Each connector can be pressed to a different level of force or distance without any operator setup.
 
Connectors can be terminated on force or distance while providing control of the speed of the press cycle, including the ability to dwell for a specified time. Can be used in applications other than press-fit connectors such as PEM nuts, rivets and heat sinks.
 
Provides up to 6 tons of pressing capacity, can accommodate PCBs up to 24 x 36". The 10" wide press ram allows for the mass-termination of more than one connector (of the same type) in a single press stroke. Options include an air table to allow for easy PCB movement and tooling stack up, tool-in-place sensor to ensure proper tool location and complete turnkey solutions including insertion tooling and PCB fixtures.
 
Tyco Electronics, tycoelectronics.com
Booth 1029

The Commercial Products division of Branson introduces support racks for the bottom of the ultrasonic tank. Parts baskets are required to suspend items in the solution, however they are not practical for all ultrasonic cleaning applications. Support racks provide a stable, flat surface upon which parts, fixtures, or containers may be placed. Open design with integral rubberized “feet” will not inhibit chemistry circulation or ultrasonic energy.
 
Also useful as countertop support racks following cleaning or processing. Hold containers or components off the table to facilitate air circulation and drying.  A  range of sizes is provided to access the full volume of your tank. Have stainless construction for chemical compatibility, electro-welded design for durability,  bright electro polished finish for cleanliness. For use with .5 to 5.5 gal units.
 
Branson Ultrasonics Corp., bransonic.com

Until now, optical chips have been cut out of a silicon wafer and then placed individually into housings. However, the dimensions of these casings are several times the size of the chip itself.
 
Schott’s Thin-Glass Wafer-Level-Package with BGA on the backside concept aims to manufacture miniature opto-housings.
 
Instead of packaging individual chips, the technique “packs“ the more than 1000 chips that the entire wafer yields at the same time.
 
Production started at the Electronic Packaging business unit in Singapore last October. The company aims to manufacture approx. 3 million chips per month with its staff of 65 employees.

 
SCHOTT North America, us.schott.com

CSM 200 Connector Seating Machine is a semiautomatic machine for the application of compliant pin connectors. A BMEP servo electric press allows for the monitoring and control of force, distance and speed during the press process.
 
Operators manually load a PCB and connectors onto fixtures and tooling. The CSM automatically positions the connectors on the PCB and then an X/Y table with PCB fixture locates the PCB (up to 8 x 11") under the servo press head for processing the connector. Automatically sequentially presses each connector on the PCB to the required specifications. Each press cycle is monitored and can be stopped if an error occurs. Each press cycle can be recorded to provide real-time feedback with full traceability for every connector applied.
 
Specializes in processing right-angle board edge connectors with non-overmolded pins. Uses “comb” tooling to ensure proper location of the pin legs to the hole pattern in the PCB ¾ allowingr faster processing, less scrap and lower applied cost.
 
Tyco Electronics, tycoelectronics.com
Booth 1029

Offers 3,200 scans per second at a repeatability of ±0.03µm (LSM-500S) to inspect rapidly moving or vibrating workpieces such as optical fiber, fine wire, micro shafts, films, ferrules and similar items.     
 

Data can be output via a standard RS-232C and I/O analog interface for use in multiple statistical analyses.
 
Mitutoyo America Corp., www.mitutoyo.com 

Chassis Carts are ideal for 19" chassis handling for box build. Offer fully adjustable rails to fit all chassis sizes. Open-top cart design accommodates vacuum lift heads to place chassis in and out of the cart. Also available: ESD Softsurface material on the top, bottom and side of the rails, and front vertical post edges of the cart. This protects the chassis from scratches and dents during handling. The cart can hold up to 1,000 lb.


Bliss Industries, blissindustries.com
Apex booth 857

Kester, kester.com
Apex booth 1085

The company will also preview its Post Wave Cooling (PWC) module and the Optima ultrasonic spray fluxing system featuring Ultra-Spray technology.

Speedline will also preview new options for its MPM Accela printing system as well as spotlight an array of its MPM printing, Camalot dispensing, and Electrovert soldering and cleaning solutions.