Series 582 Vertical Flow Hardwall Modular Cleanrooms are prefabricated and easy-to-assemble. Available in a variety of sizes, shapes, materials of construction and classifications. Comply with Class 100,000 to Class 10 operating conditions.
Room shape is not limited to squares and rectangles but can include jogs or steps in the walls to adjust to building supports or other obstacles in the available space. Available in unlimited lengths, widths to 34’ and heights up to 15’. Options include motorized ceiling HEPA filters and ducted filter modules, and air conditioning for cooling and humidity control.
Modular wall panels fasten together to form a shell and a NEST-TIGHT grid system attaches to the shell to create the internal clean room ceiling. The ceiling grid features interconnecting tee bars that provide strength to support filters, light fixtures and panels to comprise the clean room ceiling. Uses a HEPA-N-SEAL negative pressure safety seal to ensure that no air leaks through the ceiling grid into the clean room.
The components are light enough for anyone to lift and assemble using internally mounted rotary clamps and fasteners. Parts are interchangeable and easy to maneuver.
Zuken and UK-based Quadra Solutions have launched starturn, a part list management add-on tool for CADSTAR.
starturn offers four core areas of functionality to enhance post-design documentation within the desktop PCB design environment. This includes advanced export functionality for BOMs, enhanced drill drawing exports and report generation, assembly drawing creation and a new "where used" search capability. This tool allows designers to compile design-derived manufacturing and purchasing reports in minutes rather than hours.
BOMs can be exported into various file formats, including html, Microsoft Excel and XML, and for a fully tailored output, users can specify which design fields should be included.
Drill drawing functionality is more extensive in this tool. It will generate drill tables within the PCB design, eliminating the need to cut and paste from drill reports. Mark-up of drill holes can also be carried out various ways within the design.
Has improved assembly drawing generation. Circuit references, for example, can be sited in multiple places within the design, through the association of attributes. Searching for parts within the parts library is also more expansive, with functionality that allows a user to select any part and search within any file directory. This is useful when managing parts obsolescence.
XJIO expansion board improves test coverage and fault diagnosis on complex printed circuits, checks power rail levels and can eliminate custom test jigs.
The board improves the test coverage for a Unit Under Test (UUT) by verifying the signals through to the external connections. In the event of a board failure, fault diagnosis times can be reduced by as much as half, as the board eradicates the need for loopbacks and cable swapping.
Has 208 digital and 16 analogue (8xADCs and 8xDACs) I/Os, provides customers developing JTAG and non-JTAG boards with a reusable alternative to traditional test fixtures.
“The XJIO board was developed predominantly for testing circuits with large amounts of digital I/O such as on network cards - particularly if the board has more outputs than inputs or vice-versa,” said Dominic Plunkett, CTO. “It features over 200 digital I/Os and this density can be expanded to many thousands by daisy-chaining the XJIO boards together using the reconfigurable external JTAG connector.”
Can be powered from USB, for quick and portable test setup. If more than 80mA of current is required, there is a connector for a standard 12V power supply. All connectors are standard IDC. Switches and LEDs enable additional test control.
Tyco Electronics’ Global Application Tooling Division (GATD) designed a customized RFID inlay assembly system for Graphic Solutions International (GSI). The equipment will assemble semiconductor chips, surface-mount devices and printed batteries onto a continuous web of printed antennas, adding RFID capability to tags and labels.
Working closely with GSI to meet their specifications, Tyco provided a reel-to-reel system that allows GSI to mount flip-chips, SMDs and printed batteries onto printed antennas and conductive traces. The system is capable of the high-speed mounting of electronic components on a 6,000'+ roll of 20" wide material. After conductive printing, the roll is fed into the machine where components are added along with one or two printed batteries. Upon completion, the roll can be slit into individual streams and rolled, or supplied in production web width rolls for delivery. A typical circuit is inlaid with batteries, an RFID chip, and a printed antenna. The speed of this machine allows for production levels up to 26 million inlays per year.
The line can accommodate printed substrates from 0.002" (50 mm) to 0.005" (125 mm) thick, mount on continuous rolls with a repeat pitch of 0.8" (20 mm) and position chips to micron accuracy.
Tyco Electronics, tycoelectronics.com Graphic Solutions International LLC, graphicsolutionsinc.com
The Feinfocus Cougar-SMT with CT can image complex components in 2-D and 3-D for quality assessment and process improvement.
Featuring a Feinfocus GUI, it includes a microfocus x-ray tube up to 160 kV, HDX-Ray real-time 16-bit image processing, digital flat panel detector and accelerated CT reconstruction and visualization. Provides feature recognition down to 1 µm, with total magnification up to 10,000X and True X-Ray Intensity (TXI) Control.
Users may add features such as BGA and die-attach void calculation modules, a more sophisticated manipulator system and a multifocus x-ray tube up to 160 kV. CT functionality is an available upgrade for existing systems.
Features a small footprint (approx. 1 x 1 m), low system weight (approximately 1,450 kg) and convenient front- and side-door service access.
LF-4300 is an RoHS-compliant Pb-free solder paste with multi-process capabilities, a single product for no-clean applications that is also water washable. Compatible with Pb-free, SnPb and high-temperature alloys, the versatile and forgiving solder paste can be cleaned using standard aqueous cleaning systems without saponification.
Manufactured using a proprietary formula, including synthetic materials for good printing characteristics, lot-to-lot consistency and long stencil life. Is VOC and halide-free, and is classified as REL0. When used as a no-clean with either SnPb and Pb-free alloys, flux residue remains clear and meets S.I.R. requirements per IPC-TM-650.2.6.3.3.
Features include:
·Complies with RoHS directive 2002/95/EC for lead-free
ALPHA OM-338 PT lead-free no-clean solder paste is said to offer unparalleled pin testability, while allowing high print speeds and delivering excellent throughput and yield.
“Lead-free pastes have an inherent difficulty with pin test yields… [but] OM-338 PT has proven to be a very promising innovation,” said Mitch Holtzer, global product manager. “Alpha OM-338 PT is targeted to both EMS and OEM customers using in-line circuit testing. It was developed to reduce the number of false negatives recorded when pin probes are used, resulting in increased throughput and yield.”
In addition to excellent pintestability with virtually no residue on pins, it offers high print speeds (up to 150 mm/sec., on 12 mil squares and 10 mil circles), compatibility with both Rheopump and Pro-Flow, electrical reliability (passes IPC, Bellcore and HP requirements), clear, colorless flux residue yielding excellent joint appearance, and low voiding and anti-slumping characteristics.
BP Microsystems will highlight the Helix, the latest addition to its automated device programmer family, at the upcoming SMT/Hybrid/Packaging exhibition in Nuremberg, Germany. Also on display: ISP-PRO socket module and manual programming systems.
The Helix desktop automated system comes with two precision-designed tube input and output handling systems. Integrated in the handler are two 7th Generation programming sites with FX socket module capability. This allows for programming up to four devices simultaneously per site. Can handle MSOP, SOIC, PLCC, SSOP and TSSOP. A tray-only version will be available at a later date.
ISP-PRO socket module was designed to provide in-circuit programming solutions. Manual programmers can be connected to the board via a cable interface using the socket module.
The latest manual device programmers feature high-speed USB 2.0 standard bus for improved communication speed.
BP Microsystems, bpmicro.com SMT/Hybrid/Packaging Hall 9, Stand 9-532
ESSEMTEC will display the HLX Series, a high-performance placement system series for flexible SMT manufacturing at SMT/Hybrid/Packaging on May 30 to June 1.
The series features production speeds up to 22,000 cph and a large feeder capacity (192 tape and stick feeders). 16 JEDEC trays can be used without loss of any feeder space. The series is comprised of the HLX8100 and HLX8200. Can be changed over during operation-- without standstill. On-the-fly setup modification ensures maximum machine load even with small productions series. Linear drives are maintenance-free, fast and precise. They position the placement heads precisely in the x- and y-axes. During placement, the board is fixed.
“Collect & Place” method enables high-placement performance. HLX8100 comes with one placement head with four vacuum nozzles and HLX8200 has two placement heads with a total of eight nozzles working in parallel. Cognex Vision (SMD4) enables precise, fast alignment, and checking of components. With transparent lighting, illumination is independent of component type and image analysis is reliable.
All feeders are exchangeable and refillable during operation. The systems are optimized immediately after every feeder change.
Are laid out for rugged, long-term operation at three-shift workdays. The chassis and wear-resistant linear drives allow for high acceleration of placement heads. The gantry system permits the simultaneous operation of two placement heads in parallel. While one head retrieves four components, the other uses this time slot for placement.
ESSEMTEC, essemtec.com SMT/Hybrid/Packaging Hall 7, Stand 203
VacuNest Shape Memory Tooling combines the benefits of a custom tooling plate with the versatility of pins. An antistatic membrane covers a foam former surrounded by polymer granules. Place a golden board onto the modules, press down, pull a vacuum and the memory of the board shape profile is held. The chambers are profiled to the shape of the underside of the board ¾ on activation of the vacuum this shape is now held. Simple, secure and a custom board support is created within seconds. The shape will be held for weeks/days/months until the vacuum is released, whereupon the modules return to their original form, awaiting a new set up for the next version of board.
Advantages include: no risk damage to a component due to the pin/printing pressure, support forces evenly spread over the entire board, firm and precise support, ease of use, no dedicated tooling and short payback period, and the tool can be simply reset when a board version changes.
Can handle high-density boards and requires little to no lead-time.
Applys firm force consistently to the entire board. Guarantees board flatness and is not sensitive to solder paste contamination.
The 23" SP200 avi inline stencil printer is designed for medium and high throughput, high-mix applications.
Uses a “look down, look down” approach to vision alignment. Twin roving cameras mounted on independent X-Y gantries ensure accurate, repeatable precision alignment using fiducial marks or PCB/stencil features. This facilitates a “paste on stencil” inspection feature to determine if adequate paste is on the stencil before running the print cycle.
Selective Auto-Paste Dispense technology is fully programmable. The advanced intelligence of the twin camera vision system analyzes the stencil to see where paste is required, and the dispenser deposits it accordingly.
The user interface runs under a menu-driven, Windows XP application and is simple to operate. Incorporates comprehensive self-diagnostic capabilities, including production logging and automatic fault report generation
Data stored on the machine may be accessed remotely via a PC modem connection, allowing for “on the fly” troubleshooting. Automatic rail width adjust is standard to help with quick changeovers. Stencil loading is automatic; does not require adaptors for varying sizes of stencil frames. Speedprint Technology, speedprint-tech.com Hall 7, Stand 116 (with ANS-Answer Elektronik)
Simple Green Stencil and Misprint Cleaner reportedly combines effective results with a high level of user and environmental safety associated with Simple Green products.
Michael Konrad, president, said, “Simple Green Stencil and Misprint Cleaner is simply the best solder paste remover we have ever seen. I have never before seen a stencil cleaning chemical clean so quickly and rinse so effortlessly.”
Is designed for use in immersion stencil cleaning systems such as ultrasonic stencil cleaners and is also available in a trigger spray for manual stencil cleaning applications.
Offering lower health and safety risks than traditional solvent-based cleaners, and better cleaning efficiency than current aqueous-based cleaners, it complies with the most stringent (SCAQMD) VOC regulations when used as directed.