Products
Lead Eliminator uses a combination of chelating agents and other ingredients to lift and remove lead and heavy metals from a variety of surfaces such as Formica (commonly found in workbenches), stainless steel and aluminum, Lexan and other polymers, as well as materials found in and around SMT manufacturing lines, including painted surfaces and flooring. Has low toxicity.
Employs a combined proprietary chemistry and wipe technology that picks up and remediates lead and other heavy metals from work surfaces, tools, etc. Dual action remediation wipes and sprays remove heavy metals, soil and residue from affected surfaces.
Is part of the GlobalTech family of environmentally responsible products. Available in saturated wipes with one abrasive side and one smooth side in 100-count canisters of 6 x 9” wipes, or in one-pint spray bottles. Sold separately or as part of a lead remediation kit.
Employs a combined proprietary chemistry and wipe technology that picks up and remediates lead and other heavy metals from work surfaces, tools, etc. Dual action remediation wipes and sprays remove heavy metals, soil and residue from affected surfaces.
Is part of the GlobalTech family of environmentally responsible products. Available in saturated wipes with one abrasive side and one smooth side in 100-count canisters of 6 x 9” wipes, or in one-pint spray bottles. Sold separately or as part of a lead remediation kit.
JNJ Industries, Inc., jnj-industries.com
EMI Filters with optional surge suppression can be mounted with ¼” quick connect terminals; can be used wherever needed to control EMI – even multiple locations within a piece of equipment. Fully encapsulated construction complies with EN 133200 and UL 1283, while a UL94 VO plastic enclosure increases protection against electrical shock. Leakage current is reduced by eliminating the capacitor to earth ground connection. RoHS-compliant filters are ideal for appliances, medical devices, industrial equipment, motor control, lighting, recreational vehicles and more.
Available for 100 to 120 or 200 to 240 line voltages, provide high levels of EMI suppression in a convenient package. Standard models incorporate 5.0 mH common mode inductors suitable for up to 6 amp service. Options include bypass capacitors for increased differential mode noise rejection, and MOVs to protect against line transients. Custom configurations and multiple stage filters available.
Foster Transformer, foster-transformer.com
Available for 100 to 120 or 200 to 240 line voltages, provide high levels of EMI suppression in a convenient package. Standard models incorporate 5.0 mH common mode inductors suitable for up to 6 amp service. Options include bypass capacitors for increased differential mode noise rejection, and MOVs to protect against line transients. Custom configurations and multiple stage filters available.
Foster Transformer, foster-transformer.com
Checker 101E uses patterns to detect and inspect parts, for reliability. Offers the simplicity and power of the original, plus it directly accepts encoder signals, eliminating the need for a PLC when tracking and rejecting parts on variable-speed production lines.
“The simple-to-use Checker 101 sensor radically changed the way sensor users detect parts or part features, eliminating the complex wiring, mounting, ladder logic programming, and precise part handling required when using multiple photoelectric sensors,” said Brian Phillips, VP, expert sensors. “By directly accepting encoder signals, the Checker 101E eliminates the cost and complexity of a PLC for part tracking and rejection on variable-speed lines. Unlike the shift register of a PLC, which requires programming, Checker’s shift register is automatic, enabling it to accurately track up to 4,000 parts between the inspection and rejection point.”
Acquires and processes over 500 images/sec., can detect and inspect parts on fast production lines. If inspection is not required, it can detect and track parts or webs for improved process control.
Cognex Corp., cognex.com
“The simple-to-use Checker 101 sensor radically changed the way sensor users detect parts or part features, eliminating the complex wiring, mounting, ladder logic programming, and precise part handling required when using multiple photoelectric sensors,” said Brian Phillips, VP, expert sensors. “By directly accepting encoder signals, the Checker 101E eliminates the cost and complexity of a PLC for part tracking and rejection on variable-speed lines. Unlike the shift register of a PLC, which requires programming, Checker’s shift register is automatic, enabling it to accurately track up to 4,000 parts between the inspection and rejection point.”
Acquires and processes over 500 images/sec., can detect and inspect parts on fast production lines. If inspection is not required, it can detect and track parts or webs for improved process control.
Cognex Corp., cognex.com
Crysta-Apex C1600/2000 Series coordinate measuring machines (CMMs) handle measurement of large auto body and airframe assemblies and similarly sized components.
The large, bridge-type machines incorporate four-loop control to reduce cost and maintain accuracy. The low acquisition cost makes it feasible to bring CMM capabilities to inspect large workpieces used in the manufacture of heavy equipment, marine construction, automotive powertrain, etc.
The multi-sensor system uses high-speed, non-contacting digitizing probes (two- or three-axis) and a variety of scanning, vision or conventional touch probe inputs. When equipped with the SP80 long stylus (max 500 mm), it is capable of deep hole measurement. System software compensates for temperature and surface variations to ensure quality data acquisition under varying conditions.
Mitutoyo America Corp., www.mitutoyo.com
The large, bridge-type machines incorporate four-loop control to reduce cost and maintain accuracy. The low acquisition cost makes it feasible to bring CMM capabilities to inspect large workpieces used in the manufacture of heavy equipment, marine construction, automotive powertrain, etc.
The multi-sensor system uses high-speed, non-contacting digitizing probes (two- or three-axis) and a variety of scanning, vision or conventional touch probe inputs. When equipped with the SP80 long stylus (max 500 mm), it is capable of deep hole measurement. System software compensates for temperature and surface variations to ensure quality data acquisition under varying conditions.
Mitutoyo America Corp., www.mitutoyo.com
SolderStar will use Nepcon Shanghai to launch three easy-to-use thermal profiling packages, designed for the technical and budgetary requirements of low, medium and high volume Pb-free electronics manufacturing environments – SolderStar Lite, SolderStar Plus and SolderStar Pro. Visit booth 2J25-9 at the exhibit.
The range is lead-free compliant and fulfills the need for fast, precise profiling and process control. Typically, clients can achieve an optimal thermal profile after 30 min. and perhaps two or three runs through the reflow oven.
The range is lead-free compliant and fulfills the need for fast, precise profiling and process control. Typically, clients can achieve an optimal thermal profile after 30 min. and perhaps two or three runs through the reflow oven.
Incorporating up-to-date battery technology, the instruments are said to have a higher working temperature than most alternatives, and they incorporate heat shielding, which keeps them cool even at higher processing temperatures. Measure just 20 to 25 mm thick. This makes them ideal for use in modern reflow ovens with limited tunnel height, typically used in the manufacture of miniaturised products, such as mobile phones.
SolderStar Lite works for the small manufacturer or as an entry-level or second system. It includes four-channel Neptune datalogger, a Pb-free capable heat-barrier and a standard software suite including a solderpaste thermal profile library, and analysis and control capabilities.
SolderStar Plus offers a six-channel Neptune datalogger with a high-performance heat barrier, and simulation software for ultra-fast profile set-up.
SolderStar Pro includes the Neptune SL datalogger with up to 12 channels for demanding processes and PCBs, as well as full-feature software that includes SPC capabilities. It can be used with accessories to optimize wave soldering processes and profiles, and is ideal for medium to large manufacturers who profile continuously as part of an ongoing quality control strategy.
SolderStar Ltd., solderstar.com
SolderStar Lite works for the small manufacturer or as an entry-level or second system. It includes four-channel Neptune datalogger, a Pb-free capable heat-barrier and a standard software suite including a solderpaste thermal profile library, and analysis and control capabilities.
SolderStar Plus offers a six-channel Neptune datalogger with a high-performance heat barrier, and simulation software for ultra-fast profile set-up.
SolderStar Pro includes the Neptune SL datalogger with up to 12 channels for demanding processes and PCBs, as well as full-feature software that includes SPC capabilities. It can be used with accessories to optimize wave soldering processes and profiles, and is ideal for medium to large manufacturers who profile continuously as part of an ongoing quality control strategy.
SolderStar Ltd., solderstar.com
Digitaltest GmbH will exhibit at the Nepcon Shanghai show with its distributor, Wacky International (Booth E1 B02), showing test systems and software suited for Asian electronics manufacturing needs.
MTS 300 SIGMA In-Circuit Tester offers flexibility, high fault coverage and easy programming. Features a modular design and range of test methods. Can be optimally configured for current needs without limiting the possibilities of future expansion. Future changes to individual test methods, as well as to the number of test pins, can be easily performed. Incorporates analog and digital in-circuit test capabilities, vectorless testing, functional test, Boundary-Scan (optional) and on-board programming. Capacity is 1000 measurements/sec.
Can emulate existing test programs and fixtures from other platforms like Aeroflex (Marconi) GenRad, Teradyne, Agilent (HP), Rohde & Schwarz. Can also be integrated into a handling system. The press system, driven by a servomotor, allows double-sided fixturing and dual level for both ICT and functional test.
MTS 180 In-Circuit Tester for high volume production. Is equipped with a Press Down Unit and a combination of analog and hybrid in-circuit test pins. Can be equipped with functional test modules to provide fault coverage and satisfy the test requirements of a number of customers. Users can create complex fixtures with features such as double-sided board access, OpensCheck probes from both sides, etc. Can be equipped with up to 1400 analog or 1400 hybrid pins.
Digitaltest GmbH, digitaltest.net
MTS 300 SIGMA In-Circuit Tester offers flexibility, high fault coverage and easy programming. Features a modular design and range of test methods. Can be optimally configured for current needs without limiting the possibilities of future expansion. Future changes to individual test methods, as well as to the number of test pins, can be easily performed. Incorporates analog and digital in-circuit test capabilities, vectorless testing, functional test, Boundary-Scan (optional) and on-board programming. Capacity is 1000 measurements/sec.
Can emulate existing test programs and fixtures from other platforms like Aeroflex (Marconi) GenRad, Teradyne, Agilent (HP), Rohde & Schwarz. Can also be integrated into a handling system. The press system, driven by a servomotor, allows double-sided fixturing and dual level for both ICT and functional test.
MTS 180 In-Circuit Tester for high volume production. Is equipped with a Press Down Unit and a combination of analog and hybrid in-circuit test pins. Can be equipped with functional test modules to provide fault coverage and satisfy the test requirements of a number of customers. Users can create complex fixtures with features such as double-sided board access, OpensCheck probes from both sides, etc. Can be equipped with up to 1400 analog or 1400 hybrid pins.
Digitaltest GmbH, digitaltest.net
DEK has developed processes for depositing silver epoxy and B-stage adhesives for die attach applications, for higher throughput and repeatability as well as enhanced control over deposit characteristics including total thickness variation (TTV).
The process for B-stage epoxy deposition allows application of die attach adhesive at the wafer level, at high rates of throughput. This streamlines package assembly and also allows OEMs to outsource this process to a wafer specialist. The process can deposit a part-cured adhesive layer of nominal thickness 50 micron, with TTV less than ±5 micron, across the back side of the wafer.
For attaching singulated die to a lead-frame or bond pad, the process replaces dispensing to deposit silver-loaded wet epoxy ahead of die attach. Many hundreds of deposits can be made simultaneously, so epoxy deposition can match the speed of die placement. Die placement rates are 40,000 units/hr., with SMT pick-and-place technology.
“Mass imaging delivers the throughput, uniformity and repeatability that commercial producers of advanced semiconductor packages need in order to economically meet market demands for quality and price,” said Clive Ashmore, Global Applied Process Engineer at DEK. “For die attach using B-stage or wet epoxy adhesives, our mass imaging processes outgun legacy techniques in every respect, to deliver a more highly optimized, faster, more repeatable and more cost-effective solution.”
DEK, www.dek.com
The process for B-stage epoxy deposition allows application of die attach adhesive at the wafer level, at high rates of throughput. This streamlines package assembly and also allows OEMs to outsource this process to a wafer specialist. The process can deposit a part-cured adhesive layer of nominal thickness 50 micron, with TTV less than ±5 micron, across the back side of the wafer.
For attaching singulated die to a lead-frame or bond pad, the process replaces dispensing to deposit silver-loaded wet epoxy ahead of die attach. Many hundreds of deposits can be made simultaneously, so epoxy deposition can match the speed of die placement. Die placement rates are 40,000 units/hr., with SMT pick-and-place technology.
“Mass imaging delivers the throughput, uniformity and repeatability that commercial producers of advanced semiconductor packages need in order to economically meet market demands for quality and price,” said Clive Ashmore, Global Applied Process Engineer at DEK. “For die attach using B-stage or wet epoxy adhesives, our mass imaging processes outgun legacy techniques in every respect, to deliver a more highly optimized, faster, more repeatable and more cost-effective solution.”
DEK, www.dek.com
M1 AOI system was developed with enhancements to satisfy high-volume manufacturing environments in the Asian market. Has a small footprint and board handling system, is designed for maximum flexibility and can adapt to pre- or post-reflow inspection and a multitude of rework and data tracking scenarios.
Based on proprietary machine vision software, the system provides fast and easy program creation. Powerful inspection algorithms identify all visible component, lead and solder anomalies. Three mega pixel Thin
Camera and Fusion Lighting enable defect coverage and low false call
rates.
YESTech, yestechinc.com
Based on proprietary machine vision software, the system provides fast and easy program creation. Powerful inspection algorithms identify all visible component, lead and solder anomalies. Three mega pixel Thin
Camera and Fusion Lighting enable defect coverage and low false call
rates.
YESTech, yestechinc.com
Tapered dispense tips provide fast flow and minimize bubbles when dispensing thick or particle–filled fluids like epoxy, silicone and brazing paste.
Precision molded polyethylene tips feature a tapered hubless design to provide smooth, unrestricted application of thick fluids; reduces rework and rejects by preventing bubbles that could cause variations in the size of fluid deposits.
The color-coded tips are available in six sizes (0.060” to 0.010” ID) to handle a variety of fluids and applications. All sizes feature double-threaded SafetyLok design for secure attachment without the risk of tips blowing off, especially when using higher dispensing pressures for thick fluids.
Available in two styles: UV-blocking translucent tips for benchtop applications, and rigid opaque tips for automated applications or light-sensitive fluids. Both are packaged in lint-free, see-through boxes of 50 that are lot numbered to simplify process control.
EFD, efd-inc.com
EFD, efd-inc.com
ASYS Inc. has launced the Depaneling System ADS 01FR for maxium productivity.
The Turntable system is designed to lower the depaneling cost per product by maximizing throughput. Processes like loading a panel, alignment, cutting and unloading take place at the same time, which increases cycle times. For some products, throughput can be imporoved up to 80%.
The target market for this model is the telecommunication industry with fairly small panel sizes and a high volume, low mix environment.
The Turntable system is designed to lower the depaneling cost per product by maximizing throughput. Processes like loading a panel, alignment, cutting and unloading take place at the same time, which increases cycle times. For some products, throughput can be imporoved up to 80%.
The target market for this model is the telecommunication industry with fairly small panel sizes and a high volume, low mix environment.
ASYS, asys-group.com
Unifilm U801 and U801NP are acrylic transfer adhesives that reportedly deliver excellent peel strength and high temperature resistance.
Both are 5 mil acrylic transfer adhesives. U801 is supplied with a 64# printed polycoated kraft release liner, while the polycoated kraft release liner on U801NP is unprinted. Both are said to offer a balance of tack and peel and maintain excellent shear properties at temperatures greater than 375ºF. Adhere to a variety of metals and plastics including polyimide, polyester and ABS.
Designed to bond and protect flexible printed circuits (FPC), the adhesives are also ideal for applications involving nameplates, screen printing and high temperature industrial bonding and assembly.
Both are 5 mil acrylic transfer adhesives. U801 is supplied with a 64# printed polycoated kraft release liner, while the polycoated kraft release liner on U801NP is unprinted. Both are said to offer a balance of tack and peel and maintain excellent shear properties at temperatures greater than 375ºF. Adhere to a variety of metals and plastics including polyimide, polyester and ABS.
Designed to bond and protect flexible printed circuits (FPC), the adhesives are also ideal for applications involving nameplates, screen printing and high temperature industrial bonding and assembly.
Scapa Industrial, scapaindustrial.com
Model 2200-545-037 two-component Miniature Mix-Dispense Valve precisely dispenses miniature beads and small volumes of low-viscosity pourable materials and abrasive or filled materials. Ideal for low-flow applications typically found in miniature potting, doming, filling and bonding operations.
The valve uses No-Drip technology for dispensing solvent-based, moisture-curing and stringy materials such as epoxies, silicones and polyurethanes in difficult product-assembly applications. The pneumatically actuated valve opens and closes its carbide resin- and catalyst-material passages at the mixer entrance to precisely start and stop material flow.
Has stainless-steel wetted components, dual carbide ball-and-seat shut-off, safety-closure spring, flow-control adjustment and balancer eye-hook. The valve’s stroke adjuster can set the needle opening to adjust material-flow rates. Wear-resistant fluid seals extend valve life. Precision dowel and screw holes allow easy and accurate mounting.
Quarter-turn bayonet mount accommodates many disposable mixer sizes. A typical bayonet-mount mixer used is a 17-element disposable mixer, 0.125” diameter, 2.46” long and 0.030” outlet orifice. Resin and catalyst materials are delivered on-ratio by Servo-Flo metering assembly fed by supply tanks or pumps.
Sealant Equipment & Engineering, sealantequipment.com
The valve uses No-Drip technology for dispensing solvent-based, moisture-curing and stringy materials such as epoxies, silicones and polyurethanes in difficult product-assembly applications. The pneumatically actuated valve opens and closes its carbide resin- and catalyst-material passages at the mixer entrance to precisely start and stop material flow.
Has stainless-steel wetted components, dual carbide ball-and-seat shut-off, safety-closure spring, flow-control adjustment and balancer eye-hook. The valve’s stroke adjuster can set the needle opening to adjust material-flow rates. Wear-resistant fluid seals extend valve life. Precision dowel and screw holes allow easy and accurate mounting.
Quarter-turn bayonet mount accommodates many disposable mixer sizes. A typical bayonet-mount mixer used is a 17-element disposable mixer, 0.125” diameter, 2.46” long and 0.030” outlet orifice. Resin and catalyst materials are delivered on-ratio by Servo-Flo metering assembly fed by supply tanks or pumps.
Sealant Equipment & Engineering, sealantequipment.com
Press Releases
- Innominds and SIIX launch SIIX-Innominds JV to offer full-stack ODM services in India
- Syrma SGS Technology, Ltd to Accelerate AI-Driven Manufacturing with implementation of analytics and AI solution from Arch Systems in partnership with NMTronics India
- TTCI and The Training Connection Strengthen Electronics Manufacturing with Test Services and Training at PCB West 2025
- SMTA “Members of Distinction” Awards Announced