NuSil Technology, a manufacturer of silicone-based materials for military, aerospace, electronics and photonics, has expanded its line of electronic packaging materials (EPMs).
 
All materials in this line will have low outgassing properties to prevent contamination. They have undergone extensive processing and maintain weight losses of less than 1% after exposure to temperatures exceeding 275°C for one hour. Other materials used in this industry are said to exhibit weight losses four to five times that of the NuSil materials.
 
Among the new offerings are potting and encapsulating materials; static-dissipative and glop top materials; dielectric gels; and thermal interface materials (TIMs), which come in grease, adhesive and gel forms.
 

VISULA 8 features three core areas of improvement: layout, library tools and CAM tools. Layout developments include enhancements to functionality associated with the use of starpoint components, which can now be simply added to a design. Thermal relief on vias has been extended to allow relief at 45-degrees as well as the existing 90-degree setting. Other layout features include allowing the user to display areas of different types using different colors, introduction of a 'necked width violations' report, identification of component pads that violate via keep-out areas supported by batch and interactive checking and the option of coloring trunk* items within the design.
 
Users can now print using the standard Windows printing dialog in the Databook Designer, in addition to the PostScript printing option. Tabular display option makes adding gate suffixes to elements within the Library Editor much simpler. Search results from the Library Searcher can also be output in CSV format.
 
Use of CAM tools allows the employment of standard page sizes for printing PDF outputs, and the user can specify the default plot file extension for post-processing output files in their MDF database.
 
Version 8 is free of charge for all current customers with a maintenance agreement.
 

 

 

AERIAL L4 is the latest addition to Seica's Pilot line, and is for customers who need to implement test strategies for prototype verification, pre-screen for manufacturing defects,and fault diagnostics after functional maintenance tests.

Being based on the VIVA Integrated Platform (VIP) it integrates the core VIP hardware and software, and is fully compatible with the other Seica test products including the PILOT Flying Probe, STRATEGY In-circuit and VALID Functional testers.

Uses four independent, mobile test probes to carry out tests on both sides of the UUT (two on each side). The vertical board clamping system is said to eliminate vibration of the board under test and allows a compact footprint. Offers a board test area of 24 x 24 in. (610 x 610 mm).
 
SEICA Inc., seica.com
Booth 2257

ZESTRON America will showcase its latest  Pb-free cleaning services during Apex.  The company will also feature recent advances in PCB, stencil/misprint and maintenance cleaning applications.
 
The applications technology and sales team will be available to answer precision cleaning questions.
 
As part of the conference’s technical sessions, Zestron’s Application Technology Manager, Umut Tosun, will discuss “Cleaning Lead-Free Prior to Conformal Coating? Risks and Implications.” The presentation will take place on Wed., Feb. 8 at 1:30: Quality Reliability and Testing.
 
Zestron America, zestronusa.com
Booth 1229

Multi-Seals offers a free engineering sample kit of Uni-form epoxy preforms. Includes a variety of epoxy preform configurations along with an information pack.  Free evaluation samples in specified dimensions and epoxy systems are also available for specific applications. The preforms are an alternative to liquid epoxy for high-volume epoxy sealing applications. 
 
Preforms are one-part epoxy resins that are solid at room temperature. When heated, they melt and cure, forming a consistent seal that protects components from dust, moisture, oil, flux, solvents, conformal coatings and other contaminants.  Close tolerances on preform configurations, consistent pre-mixed ratios of resin to catalyst and consistent viscosity from beginning to end of batch ensure uniform results. 
 
Can be dispensed at 200 to 600 parts/min. with little or no operator training.  Said to eliminate pot-life concerns and cleanup procedures. 

Multi-Seals Inc., multi-seals.com

VIPx (Verifier Image Processor) is a PC/Windows XP-based Image Processor that delivers solder joint, package and PCB board level diagnostic software capabilities for visualization, precise measurement and user defined (pass or fail) analysis of SMT/BGA solder joints, PCBs, components, mechanical parts and electrical interconnections. Suitable for upgrading almost any x-ray inspection system, (manual or semi-automated) with PC-based functionality.
 
Application centric tool set focuses on key high-use features facilitated by wizard-driven diagnostic helpers. Algorithm-based inspection modules automatically find solder connections and perform measurement and defect detection by operator defined pass/fail analysis criteria. This collective image processing automatically finds failures at the solder joint level or selected regions of interest (voids, opens, shorts, ball size, ball shape,
etc.) by color-coded indicators. Data collection and e measurement reporting further isolate, quantify and document faults for corrective action.
 
Features a number of modules for BGA analysis, SMT analysis, custom analysis, package analysis, PCB analysis or image enhancement.
 
An extension of the VIP software series offered on Verifier, Concept FX and refurbished Nicolet x-ray equipment products. Can be added to any camera-based x-ray inspection systems offered in the industry.

Focalspot, focalspot.com

TSD-100 thermal shock chamber can meet the Mil-Std 883 test method 1010.7 with up to 22 lbs. of samples, such as plastic IC chips. Overall interior volume is 4 cu. ft. (100L), allowing testing of larger products and sub-assemblies, as well as large quantities of components like ICs.
 
Measurer 44” wide, resulting in a 40% smaller footprint than the ETS4-2CW. Overall power consumption (full-load amps) has been reduced by 60%. Have Copeland brand Scroll refrigeration compressors and touch-screen controller mounted on the door.
 
Has an interior of 28 x 16”.
 
STT, or Specimen Temperature Trigger, actively monitors the temperature of the product and only advances the program to the next step once the product has reached the desired temperature. It adjusts the soak period according to how much product is being tested.
 
Other features include:  a flexible cabling tube (for monitoring or powering samples) that comes out the side, rather than a moving pipe that sticks out the top; a cool-down mode; an option for a window to check on the samples r.
 
Built at ESPEC’s headquarters in Japan and will be stocked at their Michigan factory along with replacement parts. A one-year parts and labor warranty is included.
 
ESPEC Corp., espec.com

B2 Benchtop automated optical inspection system for post-reflow PCBs is said to offer up to a three times improvement in inspection speed and improved fusion lighting to provide defect coverage. Features large board handling in a compact package, and complete software/board setup compatibility with the inline F1 series. 
 
Operators typically take less than 30 min. to create a complete inspection program including solder joints. Uses a stand package library to simplify training and ensure program portability across manufacturing lines. Image processing technology integrates several techniques, including color, normalized correlation and rule-based algorithms to provide inspection coverage with a low false failure rate.
 

Provides diagnostic and trending analysis of the manufacturing process.

Features a package of SPC charts, including X-bar range, X- moving range, histogram, Pareto analysis, scatter plot, Cp, CpK and other reports that provide real-time alarms for out-of-tolerance conditions. Compatible with YESTech AOI and YTX-5000 combined x-ray/vision system.
 
YESTech, www.yestechinc.com