Dual Rail Conveyor J204-53 optimizes manufacturing process equipment utilization, especially pick-and-place machines and high-volume, low- or medium-mix production. Production planning flexibility increases when the same process equipment can be used for both sides in double-sided SMD assembly or when two different products can be produced in single-sided production.
 
Transports and buffers PCBs between process machines, offers multiple-drive technology, eliminates contact between boards during transfer and features a safe, clean design with no visible motors or wiring. Sturdy structure offers reliable operation in demanding production conditions, and easy mechanical connection to other equipment.
 
Features steel frame construction, up to four individually driven conveyor segments on both conveyor rails, automatic indexing and inspection modes, Pb-free process compatible, PLC controller, start/stop/reset/emergency stop/inspection/send switches in membrane terminal, four standard frame lengths: 500, 1000, 1500, 2000 mm, SMEMA electrical interface, ESD-safe design and CE-safety compliant.
 

Photo Stencil announces the results of Universal SMT Laboratories’ independent, extensive study, conducted in February 2006. The print-process study isolated the stencil alone to determine performance differences among a group of stencils manufactured by other stencil suppliers. Photo Stencil’s AMTX E-FAB stencil performed the best out of 12 stencils tested, provided by five different stencil manufacturers. The Xerox-authorized stencil manufacturer usse the AMTX Electroform stencil technology, licensed under U. S. Patents owned by Xerox and acquired by Photo Stencil in 1998.
           
The study included five electroform stencils and seven laser stencils, including Photo Stencil’s proprietary NicAlloy stencil. The report contains extensive data on the solder volume data for a range of SMT devices and aperture designs. Solder paste deposit heights, area and volume were measured for over 154,000 solder paste bricks. Solder paste volume and paste volume repeatability were measured for 16 SMT components in all 12 stencils. Both Pb-free and SnPb solder paste were used in the study. Stencils were ranked in paste volume delivery performance as well as paste volume repeatability. Photo Stencil’s E-FAB stencil provided the best paste transfer for both solder pastes among all stencils tested. NicAlloy was in second place for paste transfer.
 
The yield analysis program was used to determine the yield loss due to open defects of BGA and microBGA packages directly attributed to the stencil. The results show that compared to the best stencil, the increase in repair costs vary from an additional $658 for the second best to an additional $10,122 for the last place stencil. E-FAB provided the lowest rework cost for both solder pastes among all 12 stencils tested, with NicAlloy again coming in second. 
 

BEST Inc. has developed a simpler process for reworking or hand-placing high lead count connectors. The StencilQuik polyimide stay-in-place stencil helps rework high-density connectors by preventing bridging of neighboring solder joints while allowing technicians to “fit” connector contacts into the stencil.
 

 


 
Business Electronics Soldering Technologies (BEST), www.solder.net
 

BP Microsystems has released BP Win 4.60, which features increased throughput on all 7^th Generation automated programming systems. 
 
By altering the site sequence prioritization routine to allow the autohandler to pick and place parts more efficiently, the 4710 and 4700 programmers can now program up to 1,400 devices/hr. (dph), an increase from 1,200 dph. On-the-fly vision system is helpful when handling fine-pitched devices and VSP devices.
 
The 3710 and 3700 programmers can now program up to 1,100 dph, up from 950 dph.
 
All 4710, 4700, 3710 and 3700 customers with a current software support contract can download the new software through the Web site.
 
BP Microsystems, bpmicro.com
 

Leica EZ4 StereoZoom can achieve sharp, clear images with light as bright as fiber optic illumination. Five integrated LEDs can be switched individually, dimmed and combined with transmitted light. Daylight 6500°K color temperature remains constant; true colors are preserved. Three-way incident light technology provides illumination to view samples from strongly structured objects to flat probes. LEDs have a 25,000-hour service life, which means no more bulbs to replace. The LEDs stay cool; microorganisms and plant samples are protected. 
 
Other features include:
Image transfer is easy; PC connection is not required. Insert an SD card to record images, then upload to a PC via a card reader, projector or video recorder.
4.4:1 zoom ratio provides magnification range from 8-35X (with 10X eyepieces).
3 EZ4 versions are available: Integrated 10X/20 high eyepoint eyepieces; integrated 16X/15 high eyepoint eyepieces; and open eyetubes.
Eyetube angle of 60°.
100 mm working distance for easy access to specimens.
No removable parts.
100V to 240V integrated universal power supply.
 
The complete E-Series product line is designed to provide high-quality image, color and detail fidelity combined with mechanical precision for decades of maintenance-free functionality.
 
Leica Microsystems Inc., leica-microsystems.us

 

 

The 15^th  version of GerbTool has a host of new features and technology, such as HyperNETLIST generation, that have been handed down from VisualCAM. It increases netlist generation performance over competitive tools by 5 to 10X.
 

• HyperNETLIST Comparison performance has been increased 5X over previous releases, while Draw-to-Flash Conversion has been increased 5-10X.
• Pin-Point Error feature reduces user effort when trying to locate a Short or Open condition.
• Automatic Draw-to-Flash conversion function reduces “hands-on” user time.
• Improvements to Paste Mask Stencil Enhancement offer more control during shape replacement. Increased control minimizes the iterations required to achieve desired mask results.
• For Release May 15th, 2006
Includes 100+ additional enhancements to existing features, ranging from improvements to Gerber file handling to better handling of previous users’ settings when upgrading.
 
Has revised product configurations for GT-Communicator, GT-Inspector, and GT-Designer to include support for ODB++, ODB++ (X) and IPC-2581. All of these interfaces will cover both importing and exporting.
 
WISE Software Solutions, wssi.com

Universal Instruments will demonstrate its latest platform placement system, the AdVantis XS, at Semicon West. Designed for the convergence of semiconductor and standard surface-mount assembly, the system deploys Universal’s VRM linear motors for accuracy and repeatability.
 

 
The linear-motor-driven system has high magnification cameras, flip-chip algorithms, low force capability, heated spindles, fluxing, dispensing, and a variety of feeder types. Is Class 1000 clean room compatible.
 
Universal Instruments, uic.com
Semicon West Booth 7039

Practical Components Inc., a distributor of dummy SMD and thru-hole components, test boards, training/setup kits and supplies, has added Thin Array Plastic Package (TAPP) to its selection. 
 
Packaging companies Amkor Technology and ASAT Holdings entered into a multi-year cross-licensing agreement to provide Amkor with a license for its TAPP semiconductor package technology.
 
“Over the past few years, the semiconductor industry has seen an extensive adoption of QFN packages, fueled in part by the success of Amkor’s proprietary MicroLeadFrame package technology and ASAT’s Leadless Plastic Chip Carrier package. We look forward to integrating ASAT’s TAPP with our MicroLeadFrame family of packages to support our growing base of customers requiring innovative QFN package solutions,” said Jim Fusaro, Amkor’s corporate VP for product management, in a statement.
 
Available TAPP solder finishes are eutectic Sn/Pb and Pb-free with lead counts from 28 to 208.  The very thin, fine-pitch package with an exposed die attach pad allows for improved thermal performance and a power/ground ring option for enhanced electrical characteristics.  
 
Practical Components is the exclusive distributor of mechanical samples for Amkor Technology as well as distributing components from most other manufacturers. 
 
Practical Components Inc., practicalcomponents.com

Syon electrically conductive adhesive solders can be used to form conductive paths in applications where hot soldering would be ineffective or impractical. The epoxy and epoxide formulations mix and pour easily, fill voids and cure with minimal air entrapment. Reportedly provide environmental and impact resistance.
 
Syon Tru-Bond 206A Conductive Adhesive Solder is a pourable liquid for bonding electrical components that could be damaged by hot solder. This silver-filled epoxide is also useful where hot solder would not bond to the types of metals or wires to be joined, as well as for microwave shielding. Pot life is one to three hours. Cure time is 72 hours at 75° F or 2 hours at 130° F.  Can be used in service temperatures from -65° to 200° F.
 
Tru-Bond 214 Adhesive is a silver-filled, nonsagging epoxy paste for applications where a conductive bond is required and where hot soldering is impractical. Can be used to form conductive paths on circuit boards and to prepare electrodes for capacitance and loss measurements. Is also for applications requiring high thermal conductivity and meets federal specification MMM-A-1931, Types I and II. Pot life is one hour; cure time is 24 hrs at room temperature. Can be used in temperatures from  -65° to 200° F.
 
Tru-Bond 215 Copper-Filled Epoxy Adhesive is both electrically and thermally conductive. An economical alternative to silver-filled products, this nonsagging paste can be used in place of hot solder in the preparation and repair of conductive paths on circuit boards and in RF shielding as well as in heat-sink applications. Has a pot life of 45 min. Although it cures at room temperature, heating the adhesive to 150° F for 2 hours speeds curing and ensures electrical conductivity. Can be used in temps from  -65° to 200° F.
 
Devcon, devcon.com

 
Imbera is a joint venture of Aspocomp Group Oyj and Elcoteq Network Corp. that is developing a production process that integrates active components inside the PCB structure. PCB manufacturing, component packaging, and assembly are incorporated into a single manufacturing process. All interconnections between the IC and substrate are processed simultaneously.
 
The thermal properties of the new technology were challenging to define because the technology is so new and is developing very rapidly. Tight schedules limited the number of prototyping runs that could be executed. Flotherm software from Flomerics is suited to this type of complicated electronics cooling problem because it is designed for electronic cooling applications. It provides a number of thermal model libraries for existing components and tools that allow users to assemble models from libraries.
 
Imbera engineers used Flotherm to model two types of IMB structures, BGA modules and ICs embedded in motherboards, in a standard still air environment. Simulations provided fundamental information about the behavior of the structure. The simulation results made it possible for Imbera engineers to optimize the various methods afforded by IMB technology to keep the product operating temperature within specifications.
 
The simulation models were validated by performing measurements with MicReD’s “T3Ster” thermal tester. It can test up to eight components at one time and analyze the results as the test is being performed.