Products
Aegis introduces the "MCAD" system to support box and mechanical product documentation, tracking, quality and materials management. Customers may now support any discrete assembly processes—from circuit boards to full system level assembly—in a single information system.
MCAD functionality is inherently incorporated within the Web-centric manufacturing execution system (MES). Shop-floor operators can step through and drill into iView's existing sequential assembly process feature with intelligent cross-reference to the mechanical components.
MES also supports multi-level assemblies and material setup validation at any work station, and these assemblies are now better depicted in the visual aids.
Features include:
·Support for common mechanical CAD vector file formats;
·Simple digitizing for 2-D capture from a 3-D drawing with the desired user-controlled perspective;
·A mechanical Shape Library permits re-use of commonly used items and components;
·A color-coded parts list display for easy cross-referencing to the drawing.
The module is a cost option available in the upcoming 6.1 release; existing customers have been offered this option at no charge.
Aegis Industrial Software Corp., aiscorp.com
Enhanced Concept 129 Intelli-Drill includes a companion Database and Search Utility. These tools inspect and measure internal layer movement, then assist in using this information to improve process yields.
Database is loaded by the CNC-7 Controller during panel inspection. Search Utility allows the user to search for data and perform statistical analysis. This data is then fed back to the beginning of the PCB design process to improve production process yields
Database can be searched from any networked PC.
Excellon Automation, excellon.com
Booth 2031
Excellon Automation, excellon.com
Booth 2031
Database is loaded by the CNC-7 Controller during panel inspection. Search Utility allows the user to search for data and perform statistical analysis. This data is then fed back to the beginning of the PCB design process to improve production process yields
Database can be searched from any networked PC.
Excellon Automation, excellon.com
Booth 2031
Booth 2031
Wave Surfer is a self-contained measurement system for wave solder machines that provides critical data on wave solder machine setup and its process. As a wave solder machine profile fixture, it has five embedded thermocouples, and works in conjunction with the SlimKIC 2000 for quick and easy profiling and setup.
Made of a material similar to typical wave solder pallets, can withstand thousands of passes. The fixture holds the SlimKIC in place during each run to measure process data including peak temperature, dwell time, parallelism and conveyor speed.
Made of a material similar to typical wave solder pallets, can withstand thousands of passes. The fixture holds the SlimKIC in place during each run to measure process data including peak temperature, dwell time, parallelism and conveyor speed.
KIC, kicthermal.com
Apex booth 363
FX-1R High-speed Chip Shooter is equipped with a double head system driven by two independent linear motors. Both quadruple heads have a multi-nozzle alignment system using a high-resolution laser. This technology simultaneously measures four different components in width, length and height. In-flight measurement eliminates idle time.
Placement rate is 27,000 cph (IPC 9850), component range from 0201s to 11 x 26.5 mm to 20 x 20 mm. Placement accuracy is ±40µm (3 Sigma).
Juki Automation Systems, jas-smt.com
Apex booth 1069
Placement rate is 27,000 cph (IPC 9850), component range from 0201s to 11 x 26.5 mm to 20 x 20 mm. Placement accuracy is ±40µm (3 Sigma).
Juki Automation Systems, jas-smt.com
Apex booth 1069
EnviroMark 907 (EM907) is a no-clean, lead-free solder paste designed for high-yield lead-free manufacturing. Said to offer a long stencil life and Pb-free joints that resemble those achieved with Sn/Pb solder paste. Capable of extended downtimes in printing, maintains print quality at high print speeds — up to 6 in/sec. (150 mm/sec.). Said to have excellent cold and hot slump behavior to prevent bridges and solder ball formation.
Reportedly has excellent solderability to a variety of board surface metallizations, including OSP, Ni/Au, Immersion Sn and Immersion Ag. Features high levels of solderability to a wide array of component metallizations, including Pd/Ag and Alloy 42. Flux chemistry offers bright solder joints, comparable to 63/37, even in air reflow. The paste leaves only a light-colored residue and provides a stable tack life. Reflowable in air or nitrogen, prints down to 0201 pad sites, has printing characteristics to 16 and 20 mil pitches (0.4 and 0.5 mm) and meets J-STD-004 Flux Classification ROL0.
Kester, kester.com
Booth 1085
Reportedly has excellent solderability to a variety of board surface metallizations, including OSP, Ni/Au, Immersion Sn and Immersion Ag. Features high levels of solderability to a wide array of component metallizations, including Pd/Ag and Alloy 42. Flux chemistry offers bright solder joints, comparable to 63/37, even in air reflow. The paste leaves only a light-colored residue and provides a stable tack life. Reflowable in air or nitrogen, prints down to 0201 pad sites, has printing characteristics to 16 and 20 mil pitches (0.4 and 0.5 mm) and meets J-STD-004 Flux Classification ROL0.
Kester, kester.com
Booth 1085
Vertical PC Board Cart is available in a variety of standard sizes, and is infinitely adjustable. Offers custom slotted, ESD-safe plastic panels on the shelves to protect the edges of PCBs and the sheet metal panels attached to high-end PCBs. Feature a “fish mouth” entrance to the slot to make it easy for the operator to slide PCBs into the shelf. Available for single-sided or double-sided applications. Hundreds of PCBs can be stored in the cart; fully enclosed models are available.
Bliss Industries, blissindustries.com
Booth 857
Bliss Industries, blissindustries.com
Booth 857
Glenbrook Technologies offers real-time x-ray systems with x-ray microscope technology to meet the demands of both production and laboratory environments for PCB and BGA inspection.
RTX series for production monitoring, and the Jewel Box series for process development and failure analysis, help reduce manufacturing costs and feature compact designs.
RTX series provides rapid, reliable in-process inspection at high volumes for PCBs with advanced components such as BGAs, micro BGAs and flip chips. Compact size, light weight and wheeled design make it easy to move and position in tight quarters.
To support advanced research, process development and failure analysis in the laboratory, Jewel Box series offers high magnification, with continuous zoom from 7x to 2000x. Micro-focus x-ray tubes provide ultra-high resolution and detail. A five-axis positioner allows x-ray imaging from any angle.
Glenbrook Technologies, glenbrooktech.com
RTX series for production monitoring, and the Jewel Box series for process development and failure analysis, help reduce manufacturing costs and feature compact designs.
RTX series provides rapid, reliable in-process inspection at high volumes for PCBs with advanced components such as BGAs, micro BGAs and flip chips. Compact size, light weight and wheeled design make it easy to move and position in tight quarters.
To support advanced research, process development and failure analysis in the laboratory, Jewel Box series offers high magnification, with continuous zoom from 7x to 2000x. Micro-focus x-ray tubes provide ultra-high resolution and detail. A five-axis positioner allows x-ray imaging from any angle.
Glenbrook Technologies, glenbrooktech.com
PCB049 board and kit can evaluate mixed-technology Pb-free assembly. Tests a variety of JEDEC and EIAJ components.
Evaluates solder paste wetting and spread, solder paste slump performance, solder preform pin-in-paste performance and wave flux hole fill performance. Helps provide pick-and-place equipment and placement accuracy, reflow process capabilities, effectiveness of cleaning processes, surface insulation resistance (SIR), surface finish interaction factors and lead-free underfill performance.
Indium Corp., indium.com
Evaluates solder paste wetting and spread, solder paste slump performance, solder preform pin-in-paste performance and wave flux hole fill performance. Helps provide pick-and-place equipment and placement accuracy, reflow process capabilities, effectiveness of cleaning processes, surface insulation resistance (SIR), surface finish interaction factors and lead-free underfill performance.
Four different optional finishes available for 8 x 10" boards: OSP, ImSn, ImAg and ENIG.
Each test kit includes a copy of CircuitCAM and CheckPoint software, ready-to-run CircuitCAM project files (CPFs), assembly documentation samples and templates, installation instructions and user manual.
Practical Components Inc., practicalcomponents.com
Indium Corp., indium.com
A-TEK is the exclusive distributor of the CSR 1200 Stand-Alone Depaneling machine manufactured by Getech Pte Ltd. The depaneler addresses the stringent electrical and safety requirements for CE certification.
Stand-alone unit features two independent processing tables for continuous operation and system optimization. Can handle panel sizes up to 13.8 x 13.8” (350 x 350 mm). Larger panels up to 20.8 x 20.8” (528 x 528 mm) can be prcessed on the CSR1280.
A-Tek, atekllc.com
Stand-alone unit features two independent processing tables for continuous operation and system optimization. Can handle panel sizes up to 13.8 x 13.8” (350 x 350 mm). Larger panels up to 20.8 x 20.8” (528 x 528 mm) can be prcessed on the CSR1280.
A-Tek, atekllc.com
Booth 263
A full range of precious metal clad products for fabricating micro-switches, connectors and components used in high-reliability medical, military and consumer products is available from Anomet.
They are metallurgically bonded to a core material to meet specific high-reliability requirements for contact and corrosion resistance, biocompatibility or to simply reduce material cost.
Fabricated by hot and cold drawing, have a smooth, consistent surface finish. The cladding can be produced thinner than filled and thicker than plated wire or ribbon, and the products are reportedly more ductile and formable.
Functionally equivalent to solid products, available as wire and rod in sizes from 0.002 to 0.125” O.D. and as ribbon up to 1” W, with 2% or more cladding thickness, depending upon desired properties. Precious metals can include platinum, palladium, gold or silver and related alloys on cores such as stainless steel, copper, Kovar, niobium, nickel-iron, molybdenum, tantalum and titanium.
Anomet Products, www.anometproducts.com
They are metallurgically bonded to a core material to meet specific high-reliability requirements for contact and corrosion resistance, biocompatibility or to simply reduce material cost.
Fabricated by hot and cold drawing, have a smooth, consistent surface finish. The cladding can be produced thinner than filled and thicker than plated wire or ribbon, and the products are reportedly more ductile and formable.
Functionally equivalent to solid products, available as wire and rod in sizes from 0.002 to 0.125” O.D. and as ribbon up to 1” W, with 2% or more cladding thickness, depending upon desired properties. Precious metals can include platinum, palladium, gold or silver and related alloys on cores such as stainless steel, copper, Kovar, niobium, nickel-iron, molybdenum, tantalum and titanium.
Anomet Products, www.anometproducts.com
Micro HVR addresses the high-volume rework market where hundreds of boards must be repaired due either to high value, component scarcity or where manual rework is illogical. For repair challenges arising from component failure, assembly error, device revision and firmware updates, the system automatically sequences the repair steps: component de-solder and discard, residual solder removal, flux dispense (where necessary) and component re-solder. All steps are automated.
The pivot arm, with component rotation capability, is automated for hands-free placement. Sensors on the pivot arm allow component placement with defined force via z-axis motion of the substrate. Uses ”single-sweep“ residual solder removal technique. Has placement accuracy better than 10 µm, is suitable for large BGAs to fine-pitch CSPs and flip chips.
A ”friction-free“ positioning table with x,y planar motor and high-resolution z-axis control is integrated. An additional fast linear axis accomodates large substrates.
Features an open data interface structure to the assembly line, and a modular design that is adaptable for different applications.
Can be configured with solder paste dispense for 0201 devices. Can perform for extended periods of time at elevated temperatures.
Finetech, finetechusa.com
Booth 1481
The pivot arm, with component rotation capability, is automated for hands-free placement. Sensors on the pivot arm allow component placement with defined force via z-axis motion of the substrate. Uses ”single-sweep“ residual solder removal technique. Has placement accuracy better than 10 µm, is suitable for large BGAs to fine-pitch CSPs and flip chips.
A ”friction-free“ positioning table with x,y planar motor and high-resolution z-axis control is integrated. An additional fast linear axis accomodates large substrates.
Features an open data interface structure to the assembly line, and a modular design that is adaptable for different applications.
Can be configured with solder paste dispense for 0201 devices. Can perform for extended periods of time at elevated temperatures.
Finetech, finetechusa.com
Booth 1481
IBIS, the Interferometric Bump Inspection System, offers production volume solder bump inspection on chip carriers. It inspects and reports on the position, height and shape of solder bumps on the die-attach side of chip carriers, ensuring that carriers are within specification for chip attachment.
Uses massively parallel digital signal processing technology coupled with true white light interferometry to reportedly offer 20 to 30X improvement over existing interferometry systems. This technology will be transportable to wafer and chip solder bump measurement in the future.
Lloyd Doyle Ltd., lloyd-doyle.com
Booth 2086
Uses massively parallel digital signal processing technology coupled with true white light interferometry to reportedly offer 20 to 30X improvement over existing interferometry systems. This technology will be transportable to wafer and chip solder bump measurement in the future.
Lloyd Doyle Ltd., lloyd-doyle.com
Booth 2086
Press Releases
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- Indium Corporation Experts to Present on High-Temperature, Lead-Free Solder Paste and High Reliability Liquid Metal Alloys Poster at ECTC