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VisualCAM hosts a series of new features and technology, such as HyperNETLIST generation, which reportedly increases netlist generation performance over competitive tools by 5-10X. Offers Assembly Reverse Engineering functionality, which focuses on providing component centroid information when all a user has to work from is Gerber data.
 
Offers five different methods of component identification, including automatic processes that can work from information found within a standard bare-board production dataset. The results allow for a reverse engineering flow in as little as a few seconds.
 
Also contains to help increase throughput while processing data. Graphical Netlist Comparison performance has been increased 5X over GT-Fabricator, while Draw-to- Flash Conversion has been increased 5-10X. An automatic Draw-to-Flash conversion is now offered, which reduces the amount of “hands-on” time required. Paste Mask Stencil Enhancement offers greater control during shape replacement to minimize the iterations required to achieve the desired mask results.
 
Includes 100+ additional enhancements to core technology. Migration offers are available to GerbTool users that wish to upgrade, however both product lines will remain.
 
WISE Software Solutions, wssi.com
Ultra 2400 Dispensing Workstation allows electronics assemblers to apply uniform amounts of  solder paste, flux and other assembly fluids.
 
Removes guesswork and variability by using a precision air regulator and microprocessor-controlled timer to determine how much material is applied. Shot size is controlled through a combination of dispensing tip size, air pressure and dispense time, which is adjustable in .0001 sec. increments for exceptional control of deposit size.
 
Material is dispensed from a syringe barrel that can be held like a pen or mounted on an optional arm. To put an identical amount of material on each part, the operator just places the dispense tip in position and presses the electric foot pedal.
 
Includes simultaneous digital displays of all dispensing parameters (including air pressure, shot count, dispense time and vacuum), and a “Teach” function that simplifies initial setup. Can be programmed on-site in nine languages, provides automatic voltage conversion and includes power adapters for various countries.
 
Mounting panels and accessories allows customization. Options include a flexible task light, 1.7X magnifier for precision work, flexible syringe barrel mounting arm, and ergonomic grip with a touch-sensor finger switch and LED spotlight to illuminate the dispensing area.
 
Includes an introductory supply of syringe barrels, pistons and dispense tips, along with a 10-year warranty.
 
EFD Inc., efd-inc.com
SFX-6216 I/O module with VarioCore technology is the next member of the boundary scan hardware platform Scanflex. Is a 16-channel voltage measurement module with application-specific, in-system reconfigurable add-on resources based on VarioCore.
 
Can take bipolar voltage measurements on up to 16 different points in conjunction with JTAG/Boundary Scan operations. Can be combined with Scanflex TAP transceivers and controllers based on PCI, PXI, PXI Express, USB, FireWire or LAN. Features programmable range selection, external triggering and VarioCore for universal use, e.g. for the test of DC/DC converter, digital/analog converter, or digital potentiometer functionality. Ability to reconfigure integrated module resources also allows the implementation of complex dynamic sample and storage functions, which can run autonomously.
 
Fully supported in software suite System Cascon starting with version 4.3. Module programming and test program handling of analog/digital data is provided on basis of CASLAN commands. By simultaneously using multiple SFX-6216 modules, the channel number can be expanded as needed. Are automatically identified by AutoDetect feature. The software also manages the diverse VarioCore module configurations.
 
GÖPEL electronic, www.goepel.com
Practical Components announces the availability of dummy versions of Amkor’s new Dual Row MLF (MicroLeadFrame) package. With two rows of lands, for devices requiring up to 164 I/O.

Typical applications include hard disk drives, USB controllers and Wireless LAN. The small size and weight, along with thermal and electrical performance, make the MLF package good for handheld portable applications, or other applications where size, weight and package performance are required issues.
 
Benefits include:
· Small size (reduce package footprint by 50% and improve RF performance) and weight
· Standard leadframe process flow and equipment
· Excellent thermal and electrical performance
· 0.6 to 1.5 mm maximum height
· 4 to 164 I/O
· 1 to 12 mm body size
· Thin profile and superior die to body size ratio
· Lead-free/green
· Flexible designs and high yields.
 
Practical Components is the exclusive distributor of mechanical samples ¾ or “dummy components” ¾ for Amkor Technology.
 
Practical Components Inc., www.practicalcomponents.com

Corelis has added direct I2C and SPI-based device programming capabilities for the ScanExpress Boundary-Scan System that employs JTAG controllers. SPI and I2C interfaces are independent of the JTAG test interface; the user can use the same JTAG controller to test the board and perform direct programming of serial EEPROM and flash memories without removing the JTAG connector or switching to a dedicated SPI and I2C programmer.
 
The user needs only to enable the direct programming option on the Test Programming file Generator (ScanExpressTPG) to create the SPI and I2C programming files. The programmer automatically detects the file type and programs the device using either the SPI protocol or the I2C.
 
Serial FLASH/EEPROM devices can be programmed at speeds up to the device theoretical programming time. This typically 10 times faster than programming the devices indirectly using JTAG. Programming capability allows versatile I2C and SPI device access.
 
Customers can upgrade their old controllers to include the new direct programming feature.
 
Corelis, corelis.com
Easyteach is a software tool that makes selective soldering set-up fast and simple. An operator uses a simple graphic image of the assembly – a JPEG or flat scan – to program the soldering sequence for any assembly in a matter of minutes with a few mouse clicks.
 
Anyone who can use a photo-editing program, or layout a newsletter, can master ‘Easyteach’. No specialized CAD tools, sophisticated training or computer programming abilities are needed. Begins with a simple graphic image of the PCB that will be soldered. The user selects fluxing and soldering points on the image, clicks to mark the fluxing and soldering points, and the program automatically sets up the fluxing and soldering sequence in minutes.
 
Sets of sequences can be copied or duplicated for multiple boards, and the program automatically calculates the path and sequence for the soldering points. The operator marks the sites to be soldered and indicates the board’s outer dimensions.
 
Part of mySelective 6745, an in-line capable, compact, modular selective soldering system for medium volume, high-mix assembly. Features precision flexible robotics, optimized product handling and a compact footprint. Preheat modules and fluxing units can be added. Incorporates an IR preheating module, dropjet fluxer and SelectWave nozzle.
 
Vitronics Soltec, vitronics-soltec.com
 
AkroMetrix will display its latest product, the LineMoiré automated flatness measurement system, Model J5000, at Semicon West booth #8301. 
 
The high-speed, full-field shadow moiré technique allows for flatness measurement of chip-carriers/substrates, packages and ICs in JEDEC (or similar) trays. Can measure the full contents of a tray simultaneously (with one-sec. data acquisition time per tray), has integrated tray stack/destack and part sorting capabilities. Can measure stacks of trays, replace “bad” parts (i.e., parts that fail a user-specified warpage specification) with known good parts, and then stack good and bad trays separately. This is important for incoming/outgoing inspection of parts.  Enables flatness characterization before any value added processing is performed.
 
AkroMetrix, www.akrometrix.com

COMET has added an upgrade to its Feinfocus Cougar X-Ray platforms: Computerized Numerical Control (CNC). This enables operators to program and automate x-ray inspection procedures, as well as perform 2-D measurements of hidden details during failure analysis without the need for calibration.
 
CNC provides numerous benefits, facilitating an efficient failure analysis process. With the ability to program the manipulation system of the platform, CNC can automatically position the optical overview camera in the optimal position for inspection. Operators can even program the entire inspection process with CNC, including x-ray parameters and image processing, eliminating costly variables associated with manual control. User-friendly “teach-in” buttons enable easy programming.
 
The platform provides x-ray inspection for a range of inspection needs, from 2-D failure analysis of manufacturing components to advanced 3-D imaging of complex BGA and wafer-level packages. Has a small, ergonomic design, small footprint (approximately 1 m x 1 m), low system weight (approx. 1,450 kg) and convenient front- and side-door service access. Includes a microfocus x-ray tube up to 160 Kv, standard 5-axes manipulator with Auto Isocentric Motion (AIM) Technology for oblique viewing, CNC Capabilities, HDX-Ray real-time 16-bit image processing, digital flat panel detector and a hardware-driven anti-collision system.
PCB Probe Kit provides new or additional test points on PCBs. Engineers attempting to debug an existing system will find this tool useful for hands-free probing and viewing signals on a logic analyzer, oscilloscope, meter or other instrument. 
 
The following components are included: arm probe with a heavy base, spring loaded tip, rotatable head and fine vertical adjustment knob for precise positioning to adjacent test points; small lead clips enabling quick connection to SMD leads from 0.5 to 0.2 mm lead pitch; large lead clips for connection to leads from 1.25 to 0.3 mm lead pitch; SMD clips in four sizes (0201, 0402, 0603, and 0805); SMD clip support with guide wire; and an integrated magnifying glass with tweezers.      
 
OptoTherm, optotherm.com
FLIP Solder Bath for lead-free reflow soldering features linear induction pumping technology in which three phases of AC currents flow through induction coils to induce horizontal magnetic fields inside solder bath. The magnetic fields generate vertical force, F, per Fleming’s left hand law. The Force moves molten solder upward through nozzles and flow down by gravity. Two induction coils generate magnetic field and propelling force as the alternating AC current flows in induction coils. Developed for use in selective soldering systems.            
 
Features advantages over other solder bath systems, including less solder used (300 kg, instead of 450 kg) and less solder dross (7 kg vs. 15 kg), after 8 hours of operation.This results in less waste. This feature uses one third less solder for cost savings. Offers ease of maintenance — open space to access inside bath – and easier nozzle cleaning and maintenance. Improved machine reliability and up time is realized — no motors, impeller shafts or belts. Said to feature a quieter, more stable solder wave than impeller motor types. Acid oxidization around the motor spindle is eliminated and a quicker response results.
 
Tamura H.A. Machinery, tamura-ha.com
Omnify 3.0 enables efficient collaboration in product development and helps companies meet RoHS compliance. Meets compliance objectives for such companies as LuminentOIC, Agfa and Mangrove Systems. 
 
The newest version provides a means of identifying the complete material composition of a part. It classifies compliant and non-compliant parts, provides searching and reporting features, and performs analysis at any level of a product’s structure. Allows manufacturers to store all of the materials declarations/certificates of compliance from suppliers.
 
Incorporates customer-requested enhancements that accelerate and streamline product development. Customers can achieve faster performance in searching, bill of material loading and engineering change releases in addition to easier importing and exporting of data through XML capabilities.
 
Improvements include:
Accelerated performance for faster BOM loading, saving, releasing changes and searching;
Vendor part composition fields allowing unlimited vendor attributes;
Enhanced permissions offering extended field/attribute and project level permissions;
Improved document vaulting and new caching options;
Attribute Groups for easy field navigation;
New BOM fields including: balloon/find numbers, alternate items fields and user-defined attribute fields;
Condition-based dynamic workflows to define generic workflows/stages and user assignments based on various field parameters;
XML file formats enabling easy importing and exporting of item and database schema information.
 
Omnify Software, www.omnifysoft.com
Promation introduced its latest multi-level belt conveyors, the “SM” series.

 
Is available in widths from 6 to 24" and lengths from 2 to 20'. Variable speed drives may be left to right or right to left, offering different flow directions for each level.

 
Side guides prohibit products from falling off, and stopper bars may be used at exit points.

 
Promation, pro-mation-inc.com

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