CyberOptics Corp. will highlight SE 300 Ultra, its 3-D solder paste inspection system, in booth 2D21 at the upcoming NEPCON South China exhibition and conference in Shenzhen.
 
The 100% inspection system reportedly provides accurate, repeatable results at speeds that keep up with increasing line cycle times. Incorporates the field-proven technology and reliable features of the SE 300 along with new features.
 
Features a conveyor that accommodates panel sizes from 101 x 35 mm (4 x 1.4") to 508 x 508 mm (20 x 20"), flexible conveyor rail options — rear or front-fixed rail, program call-up using a bar code reader, and the ability to read skip marks and exclude data from inspection results.
 
Can handle odd-shaped pads, has paste height accuracy (each measurement calculated using 200k reference points) and an XML file format output for easy integration to shop floor control systems. Features paste height, area and volume measurements with Gage R&R <10%.
 
New features include 01005 pad inspection capabilities, enhanced warp compensation for flexible circuits , easy-to-use Operator Interface and Defect Review and conveyor auto-width adjustment.
 

KISS 103 ‘Stretch’ large-format selective soldering system with 3” nozzles will be exhibited at the upcoming ATExpo in Rosemont, IL.
 
Offers the popular features found in the KISS 101 and 102 systems, but handles larger PCBs and panelized boards. Provides a 26 x 19" work area. The user can place more boards in the work area and take advantage of the Step-and-Repeat feature of the operating program.
 
3" nozzles are a new option, designed to increase throughput as well as close the gap between selective, or secondary soldering, and full wave soldering.  Enables quick conversion from a leaded to a no-lead solder process.  By "painting" the solder side of a circuit with the 3" wide wave, can deliver productivity that approaches that of standard wave soldering tools. Can be easily integrated with A.C.E.’s line of preheat modules.
 
A.C.E.products, www.ace-protech.com

EFD’s Solder Paste Group introduces an improved no-clean solder paste product family specifically formulated for SAC 305. Pb-free formulations are known to leave dull, matte finishes, but the new clear, colorless no-clean flux residue allows the solder joint to sparkle. For applications requiring a shiny, cosmetic finish. Said to ease inspection and improve wetting capabilities for SMT, mechanical, electronic and electro-mechanical soldering applications. 
 

WaveMax 7000 thermoset composite material features enhanced durability for pallets used in high-temperature wave solder applications. Is made from an epoxy resin and random mat glass substrate. The ratio of glass to epoxy is high to maximize flexural strength and rigidity. Increased durability is critical for high-temperature, high-volume production runs that require a solder pallet to maintain strength at temperatures up to 315°C, for as many as 5000 soldering cycles.  
 
Has flexural strength of 59,000 psi, as well as flexural strength to 39,000 psi at elevated temperatures.
 
Norplex-Micarta, norplex-micarta.com

SigmaQuest software helps OEMs track the quality and performance of products that have been revamped to adhere to the RoHS Directive.
 
SigmaSure on-demand, Web-based software features several modules where the impact of moving to RoHS compliance can be checked. Through its Manufacturing and Test Insight software, users can continuously monitor their manufacturing chain’s product quality data, and OEMs can measure the impact of how new, RoHS-compliant components affect their end products. The Supplier Quality Insight module tracks the quality of core suppliers’ components, including those modified for RoHS compliance, before committing to the assembly of broader product offerings. RMA Insight module delivers knowledge about defects, trends and the root cause of failures on products returned by end customers. OEMs can quickly learn when products are not conforming to specifications along with the cause of product quality issues. 
 
The software also helps to provide “due diligence” information by creating technical files that are loaded with supporting documentation that confirms “RoHS compliance.”  This information is built into the manufacturing process and is systematically quality controlled. Can also provide auditable data about what a company has done to make sure non-compliance is identified in the manufacturing process. 
 
SigmaQuest, www.SigmaQuest.com

‘Advantage X’ enhancement package is said to boost placement rates by 15%. The retrofittable upgrade is suitable for all MIMOT pick-and-place machines; it combines hardware and software advances. Beneficial for high-mix pick-and-place systems, bringing the cph rate to 24,000 for devices from chip components to fine pitch.
 
Features an intelligent nozzle vacuum sensor, automatic polarity checks for feeder setup and other software help tools.
 
Will be a standard feature on all new Advantage Systems.
 
MIMOT, mimot.com

BP Microsystems will highlight the latest addition to its Helix automated device programmer at the upcoming NEPCON South China exhibition and conference in Shenzhen.
 
As a desktop automated system, the Helix comes with two precision-designed tray input and output handling systems with a reject location. The updated system is designed to have the same dph and is based on the Helix-TU-10 design. The tray version uses the same core programming technology, as well as the same socket modules as the standard BP Microsystems automated line. The pressure plates are exchangeable between the tray version and the Helix-TU-10 units.
 
Integrated in the handler are two Enhanced 7^th Generation programming sites with FX4 socket module capability. This allows for programming up to four devices simultaneously per site. Designed to handle a range of packages including MSOP, SOIC, PLCC, SSOP and TSSOP. A tray-only version will be available at a later date. 
 
BP Microsystems, www.bpmicro.com
Nepcon Shenzhen booth 52C01

Blakell Europlacer Ltd. will display the new Tornado head at the upcoming NEPCON South China trade show and exhibition.
 
The head features 12 position turret nozzles. Available on the Xpress range. Xpress 15 equipped with a Tornado head becomes Xpress 15T and the Xpress 25 becomes Xpress 25T. The speed of the machines is reportedly increased by 10%.
 
Xpress 25T combines high-speed and fine-pitch capabilities within a compact footprint. Twin heads can place devices ranging from 0201 to 50 x 50 mm QFP (70 x 70mm QFP and 100 mm connector optional) at a tact time of 0.128 sec (28,000 cph equivalent). Equipped with “smart nozzles” and on the fly vision.
 
Europlacer, europlacer.com
Nepcon Shenzhen booth 2M05

FINETECH will highlight the compact rework system Fineplacer CRS10 at Nepcon South China on Aug. 29 to Sept. 1.
 
The rework station handles the complete rework process and supports automated component placement and lift-off. Has user-friendly Chinese software. Better than 10 µm placement accuracy allows for rework of high density packaged boards. Large field of view accommodates large component alignment (e.g., super BGAs with side lengths of up to 45 mm), without additional optics. Even larger components can be aligned using the company's Split Field Optics "MIRAGE". Typical applications include BGA, CGA, CSP, microBGA, MLF, QFP, TSOP, PLCC, small components such as 0201, 0402, 0603 and connectors, RF-shields, shielding frames, flip chip rework and customized applications.
 
FINETECH, www.finetech.de
Nepcon Shenzhen booth 2G71

ESSEMTEC AG will highlight CSM7100, a flexible pick-and-place system with intelligent feeders for high-mix/low-volume production, at the upcoming NEPCON South China exhibition and conference.
 
Features large feeder capacity, intelligent feeders and easy-to-use operation software. Standard laser alignment is accurate, reliable and maintenance-free. Every component is measured and aligned on-the-fly. Tape reels, tape strips, sticks and trays of any size can be used to feed parts. Components as tall as 15 mm can be placed.
 
Ooffers a wide application range, feeder capacity of 100 x 8 mm, intelligent tape feeders from 8 to 56 mm, 4000 placements per hour, optical on-the-fly alignment, easy graphical operation system, integrated dispensing system, barcode-based feeder setup and a universal CAD data input filter.
 
Includes machine operation software Lightplacer. Barcode labels on feeders and components guarantee the correct and quick feeder setup using a barcode reader.
 
Footprint is 80 x 80 cm.
 
 
ESSEMTEC, essemtec.com
Nepcon South China booth 2C50

KIC will showcase its 24/7 Process Monitor at the upcoming Nepcon South China exhibition and conference in Shenzhen.
 
24/7 Process Monitoring brings automation to the thermal process: Automatic profiling of each product, around-the-clock monitoring, SPC charting, analysis, documentation and production traceability -- all in a single, intuitive product. Continuous tracking occurs in the background, never interrupting production. Real-time process data enables engineers to make crucial cost containment and quality control decisions.
 
Uses custom probes installed inside the oven at the product level to gather and record real-time thermal process data for every product. Automatically charts all critical process specs: peak temperature, soak time, time above liquidous, etc. The data is plotted on real-time control charts and process capability (Cpk) is calculated for each specification. The overall process window index (PWI) is charted, providing a real-time Cpk for the entire process. Any process drift outside of control limits or defined Cpk value will immediately trigger an alarm. Real-time Cpk tracking provides a zero-defect, fail-safe system that automatically identifies potential defects before they occur.
 
KIC, kicthermal.com
Nepcon South China booth 2D58