Products
DEK will attend the Nepcon UK show, held May 9-11 at the National Exhibition Centre, Birmingham. Sop by stand C30 to find information and exhibits of the HawkEye print verification system operating on a Europa high-accuracy SMT printer equipped with Instinctiv; VectorGuard stencil technologies; and consumables.
Visitors can witness DEK’s HawkEye print verification system in action, live on the Europa platform. It enables high-speed verification of 100% of printed boards at line beat rate. The system analyzes streamed 2-D board images in real-time to generate a pass/fail indication. Any faulty board can be immediately isolated before component placement and returned for cleaning and re-printing, thereby minimizing scrap.
The Instinctiv user interface provides intuitive graphical features and on-board help to streamline new product introduction, facilitate process monitoring and optimization, and reduce stoppages.
VectorGuard stencil technologies address the need for accuracy in the Pb-free environment. The Gold electro-formed stencils and Silver nickel laser-cut stencils reportedly deliver enhanced aperture release and paste volume repeatability.
DEK, dek.com
Visitors can witness DEK’s HawkEye print verification system in action, live on the Europa platform. It enables high-speed verification of 100% of printed boards at line beat rate. The system analyzes streamed 2-D board images in real-time to generate a pass/fail indication. Any faulty board can be immediately isolated before component placement and returned for cleaning and re-printing, thereby minimizing scrap.
The Instinctiv user interface provides intuitive graphical features and on-board help to streamline new product introduction, facilitate process monitoring and optimization, and reduce stoppages.
VectorGuard stencil technologies address the need for accuracy in the Pb-free environment. The Gold electro-formed stencils and Silver nickel laser-cut stencils reportedly deliver enhanced aperture release and paste volume repeatability.
DEK, dek.com
Bonding Source LLC, a reseller of specialty materials, enters the microelectronics and RF/Microwave market with a family of epoxies and bonding wire. It will provide immediate delivery of electrically conductive and non-conductive pastes and films manufactured by Ablestik, Emerson & Cuming and Epoxy Technology. Epoxy film pre-forms will be available with a lead-time of one week. An array of gold bonding wire and ribbon manufactured by SPM will be available for immediate delivery. The company will offer next-day delivery of epoxy paste syringes, film sheets and spools of wire/ribbon.
Scott MacKenzie, president, said, “We decided to start this new concept in providing specialty materials because we were always frustrated with how long it took to get a quote, lead-times on delivery and minimum charges. In our manufacturing business, a 4-6 lead-time on material isn’t acceptable to our customers. Also, we were constantly buying more epoxy than we could use up before the expiration date. Every year we were tossing out or reclaiming thousands of dollars worth of epoxy and wire. We thought that there must be other microelectronics and RF/Microwave companies experiencing the same pain, and approached the epoxy and wire manufacturers with the idea. They have been fully supportive, and the response from the industry has been tremendous. Bonding Source takes all the risk by purchasing the epoxy and wire, and the customers just call up and get what they need the next day.”
Bonding Source, bondingsource.com
Scott MacKenzie, president, said, “We decided to start this new concept in providing specialty materials because we were always frustrated with how long it took to get a quote, lead-times on delivery and minimum charges. In our manufacturing business, a 4-6 lead-time on material isn’t acceptable to our customers. Also, we were constantly buying more epoxy than we could use up before the expiration date. Every year we were tossing out or reclaiming thousands of dollars worth of epoxy and wire. We thought that there must be other microelectronics and RF/Microwave companies experiencing the same pain, and approached the epoxy and wire manufacturers with the idea. They have been fully supportive, and the response from the industry has been tremendous. Bonding Source takes all the risk by purchasing the epoxy and wire, and the customers just call up and get what they need the next day.”
Bonding Source, bondingsource.com
Stackable PCB Transport and Storage Racks are made of conductive material for safe, convenient handling of printed circuit cards during assembly. Can hold up to 50 PCBs from 2” to 9.8” (5 to 25 cm) wide. Are made of conductive plastic temperature rated to 176OF, Surface resistance <10 6.
The width of the rack can be quickly adjusted for different PCB sizes by unlocking the stop latches on the top panel, pushing the side plate to the correct position and resetting the position holders. A chain and sprocket mechanism assures that the sides of the panel will be held parallel during adjustment. Adjusting the rack for new PCB size takes less than 20 sec.
The width of the rack can be quickly adjusted for different PCB sizes by unlocking the stop latches on the top panel, pushing the side plate to the correct position and resetting the position holders. A chain and sprocket mechanism assures that the sides of the panel will be held parallel during adjustment. Adjusting the rack for new PCB size takes less than 20 sec.
FKN Systek, Fknsystek.com
Zuken and PCB Libraries Inc. have launched a CADSTAR-compatible land pattern generator, IPC-7351A LP Wizard. The tool reportedly reduces the time it takes to build library parts and ensures compatibility with the latest IPC standard for surface-mount design.
The tool consists of land pattern viewers, calculators and generators
for the creation of CAD land patterns in SMT parts libraries. The time to build a standard SMT library part (previously on average 30 min.) has been reduced. The generated library parts comply with the latest land pattern and surface-mount design requirements as defined by the IPC. Using data based on the IPC-7351 Land Pattern Standard, users can generate accurate manufacturing compliant PCBs while cutting costs.
The LP Wizard dovetails with the free library documentation and the Viewer, both provided by the IPC with the needed standard. The data entered by a PCB designer can also be shared with engineers throughout the organization with the Viewer on a project by project basis.
Available for purchase direct from PCB Libraries; all licenses come with one year of maintenance; pcblibraries.com/store/detail.aspx?ID=54
The tool consists of land pattern viewers, calculators and generators
for the creation of CAD land patterns in SMT parts libraries. The time to build a standard SMT library part (previously on average 30 min.) has been reduced. The generated library parts comply with the latest land pattern and surface-mount design requirements as defined by the IPC. Using data based on the IPC-7351 Land Pattern Standard, users can generate accurate manufacturing compliant PCBs while cutting costs.
The LP Wizard dovetails with the free library documentation and the Viewer, both provided by the IPC with the needed standard. The data entered by a PCB designer can also be shared with engineers throughout the organization with the Viewer on a project by project basis.
Available for purchase direct from PCB Libraries; all licenses come with one year of maintenance; pcblibraries.com/store/detail.aspx?ID=54
Zuken USA Inc., zuken.com
Protocase Designer version 113 is now available for download at protocase.com/www/designer.
Upgrades inclulde:
Flat panel: a simple flat panel template compliments standard enclosure templates.
Exclusion zone: eliminates any user concern from placing cutouts or components in inappropriate areas.
Flanges: appropriate flanges result in realistic template models
Information bar: more information regarding origins, exclusion zones, library component nomenclature, etc.
Coordinate origin: more detail regarding face editor origins.
Open/Save functions: cleaned up issues related to opening and saving files.
A new tutorial emphasizes proper enclosure design for mounting your PCBs; it can be found at protocase.com/www/designer/tutorial/.
Upgrades inclulde:
Flat panel: a simple flat panel template compliments standard enclosure templates.
Exclusion zone: eliminates any user concern from placing cutouts or components in inappropriate areas.
Flanges: appropriate flanges result in realistic template models
Information bar: more information regarding origins, exclusion zones, library component nomenclature, etc.
Coordinate origin: more detail regarding face editor origins.
Open/Save functions: cleaned up issues related to opening and saving files.
A new tutorial emphasizes proper enclosure design for mounting your PCBs; it can be found at protocase.com/www/designer/tutorial/.
Protocase Inc., protocase.com
LeadCheck swabs (2515-N) are a fast method of testing components and solder joints for lead solder. Incoming components and boards, in addition to existing inventories, can be checked for RoHS compliance. This avoids mixed lead and Pb-free inventories, lead contamination in RoHS compliant work areas and potential penalties for shipping noncompliant products. Swab kits are packaged in eight-packs so every station can be equipped to prevent lead contamination from incoming and in-stock boards and components.
All Techspray branded products are RoHS compliant.
All Techspray branded products are RoHS compliant.
Techspray, techspray.com
Promation has developed a small footprint line loading station that incorporates a bare PCB loader and a magazine line loader into the same work cell.
Gary Goldberg, president, said, “This new design has been developed to serve customer with limited floor space. By incorporating the two machines together, the customer also sees cost savings from shared controls without sacrificing features.”
The station may be built to handle the four most common sizes of magazine (CAB 601/701, CAB 704, CAB 706 and CAB 707). Is also compatible with NIKKO style magazines of the same dimension. The four-magazine buffer station measures 48 x 43" and the five-magazine buffer station is 64 x 43" in SL size (CAB 701).
With “One Touch” control panel, operators are offered independent control over most features of the system by depressing a button. A PCB counter is also included.
Gary Goldberg, president, said, “This new design has been developed to serve customer with limited floor space. By incorporating the two machines together, the customer also sees cost savings from shared controls without sacrificing features.”
The station may be built to handle the four most common sizes of magazine (CAB 601/701, CAB 704, CAB 706 and CAB 707). Is also compatible with NIKKO style magazines of the same dimension. The four-magazine buffer station measures 48 x 43" and the five-magazine buffer station is 64 x 43" in SL size (CAB 701).
With “One Touch” control panel, operators are offered independent control over most features of the system by depressing a button. A PCB counter is also included.
Promation, Pro-mation-Inc.com
Practical Components now supplies the AIM print test board and kit designed to include printing challenges commonly encountered on manufacturers’ assemblies. In addition to BGA and microBGA pads, both have circular and square pad designs to test paste release. AIM has included the standard IPC slump test pattern to further challenge the properties of any product tested. This print pattern is more “real life” and can more accurately predict slump since individual pads are used as opposed to one pad that is common in the “thermometer” method. A number on the board indicates the distances between pads.
Common pad sizes were incorporated into the layout including 1206, 0805, 0402 and 0201 rectangular pads for discrete components. These pads have varying distances between them, allowing users to determine paste solder beading. Four 250 x 250 mil pads are available for use with various aperture styles to allow for wetting tests. There are also several fine-pitch QFP pads designed to check for the propensity of any given product to cause bridging, and to confirm the existence of torn prints, peaking (dog ears) or bridging.
Board material is FR4 170Tg with a standard ImAg finish. Digitized Gerber files are provided by Aegis Software. Available with lead-free components.
Common pad sizes were incorporated into the layout including 1206, 0805, 0402 and 0201 rectangular pads for discrete components. These pads have varying distances between them, allowing users to determine paste solder beading. Four 250 x 250 mil pads are available for use with various aperture styles to allow for wetting tests. There are also several fine-pitch QFP pads designed to check for the propensity of any given product to cause bridging, and to confirm the existence of torn prints, peaking (dog ears) or bridging.
Board material is FR4 170Tg with a standard ImAg finish. Digitized Gerber files are provided by Aegis Software. Available with lead-free components.
Practical Components, practicalcomponents.com
Onyx 29 semi-automated selective soldering machine provides high-performance rework of standard SMD components, but also handles problem components such as 80-mm SMD connection boards.
Has Multiple-Field-Of-View (MFOV) Vision System and an optional variable working height of up to 70 mm. Provides placement precision with standard components such as components down to 01005, flip chips, µBGA, CSP, BGA, LGA, MLF, CCGA, TCP, QFP, Fine Pitch, plug and base, RF-shields.
Has Multiple-Field-Of-View (MFOV) Vision System and an optional variable working height of up to 70 mm. Provides placement precision with standard components such as components down to 01005, flip chips, µBGA, CSP, BGA, LGA, MLF, CCGA, TCP, QFP, Fine Pitch, plug and base, RF-shields.
Zevac AG, zevac.ch
92-XCON OA flux is formulated for Pb-free soldering, and designed to withstand the high temperatures associated with Pb-free processing without breaking down or losing its activity. Said to offer a robust process window and combine freely rinsable, thermally stable synthetic polymers with a well-tuned activator system. Delivers metallurgically sound solder joints with a shiny appearance even under high thermal load. Cleans easily in a straight aqueous process, yielding circuit assemblies with extreme ionic cleanliness. Passes the Silver Chromate test for halides and is categorized as an IPC-Jstd-004 ORH0 product.
Cobar BV, cobar.com
Cobar BV, cobar.com
BPWin 4.58 features new NAND Flash options that will allow users to customize multiple partitions using a single algorithm when programming NAND devices.
Special Spare Area calculations can be added as needed without having to change the algorithm. The user can specify partitions with an arbitrary number of required addresses and specify how they align to the buffer. This feature is available to all NAND Flash devices that support it.
NAND Flash is used in numerous applications that involve the data file to be partitioned. For instance, the file may consist of an initial bootloader, followed by a bootup image, and data partitions. Depending on the application, each partition has a logical address to which it must map for correct functionality. Due to the presence of bad blocks, data on a device can shift, in terms of the actual address, to which it is programmed. It becomes essential that the algorithm used to program the NAND Flash guarantees that each partition starts at the exact specified logical address on the device. NAND Flash options in the BPWin software allow for this functionality.
Spare Area schemes allow fills or ECC (Error Correction Code) calculations “on the fly” during programming and verifying without modifying the buffer.
Special Spare Area calculations can be added as needed without having to change the algorithm. The user can specify partitions with an arbitrary number of required addresses and specify how they align to the buffer. This feature is available to all NAND Flash devices that support it.
NAND Flash is used in numerous applications that involve the data file to be partitioned. For instance, the file may consist of an initial bootloader, followed by a bootup image, and data partitions. Depending on the application, each partition has a logical address to which it must map for correct functionality. Due to the presence of bad blocks, data on a device can shift, in terms of the actual address, to which it is programmed. It becomes essential that the algorithm used to program the NAND Flash guarantees that each partition starts at the exact specified logical address on the device. NAND Flash options in the BPWin software allow for this functionality.
Spare Area schemes allow fills or ECC (Error Correction Code) calculations “on the fly” during programming and verifying without modifying the buffer.
BP Microsystems, bpmicro.com
A.C.E. Production Technologies introduces a Dual Head Fluxer option that facilitates quick changeover of flux types.
Is designed to meet the needs of selective soldering applications that demand quick changeover from leaded to no-lead solders, a common concern among electronics assemblers transitioning to Pb-free. The feature enhances the flexible KISS 102 programmable selective soldering system. The dual head fluxing system makes it possible to change flux types quickly and complements a fast solder pot changeover time.
Is a spray-type, system, with controllable spray point size, pattern and deposition volume. The maintenance-free spray head is controllable down to a spot size of 2 mm.
Rugged, reliable and compact, the programmable KISS 102 features a Pb-free compatible solder pot and is ideal for assembly, prototyping and rework, post-reflow offline assembly and other soldering applications such as odd-form devices.
Is designed to meet the needs of selective soldering applications that demand quick changeover from leaded to no-lead solders, a common concern among electronics assemblers transitioning to Pb-free. The feature enhances the flexible KISS 102 programmable selective soldering system. The dual head fluxing system makes it possible to change flux types quickly and complements a fast solder pot changeover time.
Is a spray-type, system, with controllable spray point size, pattern and deposition volume. The maintenance-free spray head is controllable down to a spot size of 2 mm.
Rugged, reliable and compact, the programmable KISS 102 features a Pb-free compatible solder pot and is ideal for assembly, prototyping and rework, post-reflow offline assembly and other soldering applications such as odd-form devices.
A.C.E. Production Technologies, ace-protech.com
Press Releases
- SMTXTRA Partners with Quantum Systems to Expand Representation in Key Territories
- KYZEN Announces Exclusive Partnership with Manufacturers’ Representative Restronics Florida
- Koh Young will Showcase its Award-winning Inspection Solutions at SMTconnect with SmartRep in Hall 4A.225 on 11-13 June 2024 in Nuremberg, Germany
- Precision Automation & Assembly Appointed as New England Rep for Kubler US