NC277 VOC-free liquid flux is said to be as electrically safe as alcohol-based flux and has a medium residue suitable for long thermal demands. Withstands thermal preheats required for palletized selective soldering. Has a broad activation range, and is for use in lead-free wave soldering with tin-silver-copper, tin-silver, tin-copper, and other alloys. Reportedly has low post-process residues and can reduce preventative maintenance requirements in spray fluxing applications. Is no-clean, non-visible residue flux, but can be cleaned. Meets IPC SIR 2.6.3.7 test in an air-dried state. Sealed shelf life of nine months at room temperature.

AIM Solder, www.aimsolder.com

NXT III component mounter features a faster XY robot, faster tape feeders, and a new "flying vision" parts camera. New H24 head is said to be capable of 35,000 cph per module. Reportedly capable of placement accuracy of +/-25 microns. Can reportedly places parts down to 03015 package styles.

Fuji Machine Mfg., fujiamerica.com

No. 977 is an electrically-heated, 500ºF universal style oven for preheating racks of small circuit boards. Workspace dimensions measure 30" x 40" x 31".  9KW are installed in Nichrome wire heating elements to heat the unit, while a 600 CFM, 0.5-hp recirculating blower motor provides front-to-rear universal airflow to the workload. Features 4" thick insulated walls, Type 304, 2B finish stainless steel interior and aluminized steel exterior. Is equipped with four drawers, each 24" x 30" x 2" and rated for 50 lb. loading. Drawers open to extend 20" from front of oven. Integral leg stand provided. Controls include digital indicating temperature controller, manual reset excess temperature controller with separate contactors and recirculating blower airflow safety switch.

The Grieve Corp., www.grievecorp.com
 

MPM EnclosedFlow print head now features positive-displacement, motor-driven pressure system that controls paste chamber pressures to within +/- 0.1 psi. Prints fine features such as 01005s and 0.3mm pitch CSPs with reportedly up to 50% greater volume and 25% lower deviation than squeegee blades. Is good for high-volume fills such as paste-in-hole. Solder paste is held within an enclosed chamber, and is directly pressurized during the print stroke. Is a "plug-and-print" solution. Is for high product mix environments; has detachable, modular chambers that can be removed and stored with fewer than 5 min. needed for changeover. Comes on Accela and new printers; supported sizes include 8", 10", 12", 14", 16", and 18".

Speedline Technologies, www.speedlinetech.com

Capital Harness TVM software automatically generates electrical system and wire harness manufacturing process and cost data specific to each harness design, factory and company’s cost models. Supports process choice and sourcing decisions. Is able to act directly on design data generated by other tools from the Capital suite, and can be implemented as part of an extended flow or standalone. Reads data in several standard formats, including KBL. Data can be received from a variety of industry tools.

Mentor Graphics, www.mentor.com
 

topoView is part of XI-Pilot v. 3.1 x-ray inspection software for evaluation of x-ray images. Facilitates interpretation of x-ray images with respect to better fault assessment and classification. Construes every grey value of an x-ray image as a change in material thickness and density. Thick materials such as solder (dark grey values) are displayed on a higher position than less thick PCB materials (light grey values). Faults such as lifted leads, shorts, non-soldering, insufficient or too much solder are displayed.

Goepel electronic, www.goepel.com 

Asscon VP1000 and VP6000 vapor phase reflow systems now come with Dynamic Profiling, which automatically adjusts and controls reflow profiles. Simplifies setup and preparation of reflow profiles; eliminates interferences due to different loads or usage conditions. User determines temperature profile and keys in values to the PLC user interface. Can create soldering program by determining start soak temperature (°C), duration ramp, and time above liquidus. Uses embedded three temp. reference measuring points for permanent control and monitoring of the profile. Controller can use temp. behavior of selected reference measuring points to start appropriate control actions during profiling.

Asscon Systemtechnik, www.asscon.de 

 

X Series placement machines are up to 0.5 meters shorter than the previous models. X4i S places 120,000 components per hour (cph) in a footprint of 1.9 x 2.6 m. Come in three- (X3 S, shown below) and four-gantry (X4i S) models, with slots for up to 160 8mm feeders, conveyors for boards up to 650mm wide, barcode readers, adjustable pin support, interchangeable gantries and new tray feeders. Handle printed circuit boards up to 610 x 560mm. Dual-conveyor setup handles PCBs up to 450 x 300mm. Places components from 01005 to 200mm long.

Siplace, www.siplace.com

Unscrambler X 10.3 multivariate data analysis and design of experiments software now offers better plotting tools, sample selection techniques, a new spectroscopic transformation, an improved DoE module and better handling of process data. Includes exploratory data analysis, regression and classification methods, predictive modeling, and descriptive statistics. Units and ranges can be defined and saved with PLSR, PCR, MLR and PCA models for assigning multiple input parameters; can set alarm and warning limits for PLSR, PCR, MLR and PCA models; has an optional plug-in enabling direct import from OPC DA servers and OSISoft PI databases. Includes interactive response surface plots in the DoE module. D-optimal designs in the DoE module have been enhanced. Has 2D-scatter plots automatically grouped by first category variable in data tables, sample labeling by data value, and new outlier plots with F-residuals. Sample selection tools now include the Kennard-Stone method. A spectroscopic attenuated total reflectance transformation has been added to correct for wavelength-dependent light penetration effects in IR spectroscopy.

CAMO, www.camo.com

Indium6.4 solder paste is water-soluble and said to minimize voiding under QFN and BGA assemblies. Reportedly yields less than five% voiding. Comes as standard type 3 powder in Sn63, Sn62, and Indalloy100 (tin, lead and silver).

Indium, www.indium.com

EP21FRNS-2 two-part epoxy has a non-halogen filler. Passes UL 94V-0 testing for flame retardancy in potting, encapsulation and casting applications. Produces low smoke levels.  Features one to one mix ratio by weight and cures at room temperature or more quickly at elevated temperatures. Bonds to a variety of substrates including metals, glass, ceramics and many plastics. Withstands exposure to a range of chemicals, such as water, fuels, lubricants and acids, among others. Serviceable over temperature range of -51° to 90°C. Comes in ½ pint, pint, quart, gallon and 5 gal. kits, premixed and frozen syringes, bubble packs and gun dispensers. Is for the computer, aerospace and other industries.

Master Bond, www.masterbond.com

CA-105 conductive LED die attach adhesive is for attaching LEDs and other small semiconductor die to silver and copper lead frames. Has a high glass transition temp. to facilitate wire bonding small die; has low extractable ionics and high adhesion to silver and copper lead frames. Has a dispensing open time (pin transfer) greater than 24 hr. (measured as a 25% increase in viscosity).

Engineered Material Systems, www.emsadhesives.com