KISS-102 selective soldering machine now comes with a board size and soldering area of 16” x 16” (406 x 406mm) with no increase in machine footprint.  Handles a range of flux types with either an atomizing flux applicator for speed or precision drop-jet applicator for no-clean processing. Optional “Super Quick” z-axis motion and closed-loop positioning feedback with linear encoders, dual solder nozzle pump assembly, and dual LCD monitors.

ACE Production Technologies, www.ace-protech.com

Fineplacer pico ma is for bonding anisotropic conductive film (ACF). Achieves applied bonding forces of up to 700 N, for coherent, durable bonds between the chip and ACF. Features a new multi-chip transfer station, which permits up to four components to be placed simultaneously and bonded with defined distances. Precision z-hub positioning table achieves 5-micron placement accuracy. Places component sizes from 0.125 x 0.125mm to 40 x 40mm and the shifting optics enable alignment of long chip edges. Supports wafer or substrate sizes up to 8". Suited for high-mix, low-volume applications.

FineTech, www.finetechusa.com

TAGS: FineTech, ACF, anisotropic conductive film, component bonding

Loctite Multicore HF 212 halogen-free, Pb-free solder paste is under the limit of detection for chlorine and bromine. Reportedly has consistent print performance and minimal hot slump, even at temperatures that exceed 86°F and relative humidity as high as 80%. Exhibits low voiding in CSP via-in-pad joints, good coalescence, and solderability over a range of surface finishes, including NiAu, immersion Sn, CuNiZn, immersion Ag and OSP copper. For use on components with pitches of 0.3mm and greater; is ideal for larger boards used in industrial, networking and lighting applications.

Henkel, www.henkel.com/electronics

Loctite Multicore HF 212 halogen-free, Pb-free solder paste is under the limit of detection for chlorine and bromine. Reportedly has consistent print performance and minimal hot slump, even at temperatures that exceed 86°F and relative humidity as high as 80%. Exhibits low voiding in CSP via-in-pad joints, good coalescence, and solderability over a range of surface finishes, including NiAu, immersion Sn, CuNiZn, immersion Ag and OSP copper. For use on components with pitches of 0.3mm and greater; is ideal for larger boards used in industrial, networking and lighting applications.

Henkel, www.henkel.com/electronics

Pilot 4D flying probe testing line includes V8, M4, L4 and H4 testers. Are suitable to test miniaturized circuits with high component density. Have VIVA 3.0 software and new measurement resources deployed on the probes. Provide electrical and thermal test capabilities and onboard digital programming of complex components. Optical inspection performances enable non-invasive tests for capacitor polarity, as well as LED characterization and verification compliant with the automotive industry. Can be equipped with both single and multiple rack loading/downloading modules.

Seica S.p.A., www.seica.com

Pilot 4D flying probe testing line includes V8, M4, L4 and H4 testers. Are suitable to test miniaturized circuits with high component density. Have VIVA 3.0 software and new measurement resources deployed on the probes. Provide electrical and thermal test capabilities and onboard digital programming of complex components. Optical inspection performances enable non-invasive tests for capacitor polarity, as well as LED characterization and verification compliant with the automotive industry. Can be equipped with both single and multiple rack loading/downloading modules.

Seica S.p.A., www.seica.com

CA-195 die attach adhesive is for attaching LED and other small semiconductor die to silver and copper lead frames. Is thermally and electrically conductive, and its glass transition temperature (Tg) facilitates wire bonding to small die. Has low extractable ionics and high adhesion to silver and copper lead frames. Has a dispense open time greater than 24 hr.; maintains optimized rheology for pin transfer or needle dispensing.

Engineered Material Systems, www.emsadhesives.com

KY8030-3 solder paste inspection system features KY software. Has a true color display and foreign material inspection. Includes KSMART Warp feature.

Koh Young Technology, www.kohyoung.com

SACM solder alloy reportedly offers 800% improvement in drop-shock test performance without compromising on thermal cycling. Offers a fine grain size with a thin, stable IMC layer, even after exposure to accelerated life conditions. Is doped with manganese and is said to contain less silver than other Pb-free alloys.

Indium Corp., www.indium.com/SACM

EB2000S lightweight, compact soldering station operates at 470 KHz. Is based on Curie heat technology; responds to thermal demands of each solder joint by regulating power instantaneously. Allows use of three different handpieces and EK, EP, and ES series tips. No calibration is needed.

EasyBraid Co., www.easybraidco.com

Pico xMod dispensing valve uses piezoelectric actuation technology for continuous operation at speeds up to 500 cycles/sec. Can produce deposits as small as 2nL. Reportedly non-contact jet valve makes it possible to apply fluid in hard-to-access areas or onto uneven or delicate substrates for applications in electronics, automotive, life sciences, solar, and other industrial dispensing applications. The Piezo Actuator, the Valve Seat, the Fluid Body, the Cartridge ball/stem assembly, and Heater Set are interchangeable and assembled for each application; can be disassembled for cleaning, repair, or maintenance.

Nordson EFD, www.nordsonefd.com 

Sarcon GR45A-00 is a low modulus thermal interface material with a low thermal resistance. Fills air gaps between components, board protrusions and recessed areas. Reportedly exhibits very low pressure. Provides thermal conductivity of 6.0 W/m°K per ASTM D2326 (4.5 W/m°K per ISO/CD 22007-2 Hot disk) and a thermal resistance as low as 1.33°C cm²/W. Is available in pre-cut sheets up to a max. size of 200mm x 300mm. Can be die cut to application specifications. Material thicknesses from 0.5mm to 5.0mm can be specified in 0.5mm increments.

Fujipoly America Corp., www.fujipoly.com