B-724, B-727, B-728 and B-729 polyimide labels withstand harsh condition wash systems and chemicals. Are engineered to stay adhered to boards during inline and batch washes. Reportedly offer temp. performance up to 500⁰F and excellent resistance to harsh fluxing and wave solder environments. Are RoHS and Reach compliant, UL969 recognized and available in custom sizes.

Brady Corp., www.bradycorp.com

PS300 2HY hybrid batch stencil cleaner is suitable for stencils, PCBs, misprints and solder frames. Is an automatic single-chamber system; features 3-4 step PowerSpray cleaning. Is part of compact C-Class series. Includes two tanks and three circuits. Is PLC-controlled. The three-stage program selector for stencil, misprints, and carriers is pre-configured. Up to 99 programs can be written and saved for later recall. Has safety interlocks, master lock out switch and pressure control switches monitoring tank A and B values. Features ClosedLoop processing.

Kolb Cleaning Technology, www.kolb-ct.com/en/

Cognex Industrial Camera (CIC) series are GigE Vision digital industrial cameras designed for integration with VisionPro and CVL vision software. First four models are 29mm x 29mm, monochrome, area scan cameras. VisionPro provides access to a library of computer vision tools, from geometric object location and inspection to identification and measurement algorithms.

Cognex, www.cognex.com/cic
 

535-18M-57 UV cured epoxy adhesive is formulated for microelectronic assembly applications. Is an ultra-low stress, low shrinkage, ionically clean, low glass transition temperature UV cure adhesive. Is designed to eliminate warpage of components in disk drive assemblies, lens bonding in camera modules, chip encapsulation in smart cards and general bonding applications in photonics assembly. Reportedly cures rapidly when exposed to high-intensity UV light. Does not contain antimony.

Engineered Material Systems, www.emsadhesives.com

Sherlock 3.0 automated design analysis software is for analyzing, grading and certifying the expected reliability of products at the circuit card assembly level. Includes a global parts database with private cloud storage; 3D FEA model and 3D viewer for ICT and shock and vibration analysis; sub-assembly analysis to attach one or more printed circuit board subassemblies to the primary circuit board; improved result management functionality, and embedded failure rate models. 

DfR Solutions, www.dfrsolutions.com

SDR custom size desiccant drying and storage rooms control and trace moisture sensitive components, boards and assemblies. Modular enclosures accommodate feeder trolleys, WIP carts and PCB racks. Employ energy-efficient, dual wall insulated steel construction; enable rapid, oxidation-free drying at 40°-60°C and safe storage per J-STD-033C. U5000 Series Dry Unit is said to deliver 0.5% RH and closed-loop regeneration that responds to the atmosphere in the cabinet. Relevant process data are obtained with use of a 0.8% digital sensor. Data can be logged directly through RS232 with available software links.

Super Dry, www.totech.eu.com
 

Siplace Di-Series placement machines include digital vision systems, single and dual conveyors and multi-language station software. Available with one, two and four gantries. Siplace D1i, Siplace D2i and Siplace D4i place components down to 01005s. Include S-feeders. Component cameras have high-resolution; changeover tables are newly developed. Can accommodate three flexible head types: the 12-nozzle collect and place head, the 6-nozzle collect and place head, and the TwinHead.

ASM Assembly Systems, www.siplace.com 

Tin-bismuth-silver solder paste for SMT assembly has silver content of >1% for improved mechanical reliability and thermal cycling. Melting point is around 139°C. Offers good soldering yield for temperature-sensitive components, shorter reflow cycle times and reduces energy.

Inventec, www.inventec.dehon.com

Scorpion high-speed jetter has piezo jetting valves that enable jetting with speeds of up to 800Hz. Fluid box is less than 150nl. No tubing to connect fluid to jet valve. Can be equipped with up to four valves or pumps, including jet valves, Archimedian screw valves, time pressure valves and slider valves. eDIS software offers context-sensitive help; CAD import is supported. Includes library of best known parameters for common fluids.

Essemtec, www.essemtec.com

MPM Momentum Compact printer is 30% smaller overall than the standard Momentum. Equipped with the new EnclosedFlow print head option, it reportedly prints fine features such as 01005s and 0.3mm pitch CSPs with up to 50% greater volume and 25% lower deviation than squeegee blades, and paste volumes over 50% for 150µm apertures with a 0.35 area ratio. Wet print accuracy reportedly 18µm @ 6ó, Cpk>2. Configured standalone or inline. Other options include board snugging, auto paste dispenser, paste height monitor, 2D contrast and enhanced inspection, board support, and print capability verification.

Speedline Technologies, www.speedlinetech.com

Ultra thin double coated tapes are for bonding and attaching components and assemblies where high dielectric strength is required. REACH and RoHS compatible. Come in polyimide (PI) and polyester (PET). Have dielectric strengths up to 13.2kV. Include acrylic and silicone adhesives with a variety of liners for die cutting into complex shapes and auto application. Halogen-free UL94 VTM0 flame-retardant and antistatic versions also available. Antistatic versions have peel voltages of <100v and surface resistances of 10^5 to 10^9 Ohms.

Polyonics, www.polyonics.com

NC277 VOC-free liquid flux is said to be as electrically safe as alcohol-based flux and has a medium residue suitable for long thermal demands. Withstands thermal preheats required for palletized selective soldering. Has a broad activation range, and is for use in lead-free wave soldering with tin-silver-copper, tin-silver, tin-copper, and other alloys. Reportedly has low post-process residues and can reduce preventative maintenance requirements in spray fluxing applications. Is no-clean, non-visible residue flux, but can be cleaned. Meets IPC SIR 2.6.3.7 test in an air-dried state. Sealed shelf life of nine months at room temperature.

AIM Solder, www.aimsolder.com