PCB Library Expert version 2013 software takes component data and automatically creates footprints and 3D models based on predefined settings. Now includes a Footprint Designer module, allowing users to create footprints for non-standard components with asymmetrical, arbitrary-style leads. Reportedly enables users to create footprints for 9 of 10 components used in a typical project. IPC now distributes the tool, along with library documentation consisting of 5,000 components. Outputs to formats readable by Allegro, OrCAD PCB, OrCAD Layout, CADint, Altium, DesignSpark, Expedition, PADS Layout, Cadstar, CR-5000, Pantheon, Pulsonix, P-CAD, Ultiboard, Target 3001!, Eagle, DipTrace and Board Station, with 3D STEP and SoloPCB in development. Library Expert Lite is free and outputs to the CAD formats mentioned above.

PCB Libraries, www.PCBLibraries.com

MB600S aqueous-based sodium silicate coating is said to provide electromagnetic interference/radio frequency interference (EMI/RFI) shielding. Is effective as aluminum reference with a range of 95-105 dB, from 100 MHz to 2 GHz, per IEEE 299, 2006 methods. Above 2 GHz, shielding effectiveness decreases to 80 dB and slightly below. Above 4 GHz, effectiveness is 60-70 dB. Is relatively non-toxic and easy to handle. Can be brushed or sprayed on. Cures at room temperature in 24 to 48 hr. or in 1 to 2 hr. at 80°C. Service temperature range 0° to 700°F.

Master Bond, masterbond.com/tds/mb600s

Lumet LED materials are for die attach and package, package on board, Luminaire module, power driver/supply and control systems. Lumet P33 Pb-free, no-clean solder paste for LED package-on-board assembly reportedly prints well, particularly with ultra fine feature repeatability (11 mil squares) and high-throughput applications. Lumet P34 is for long soak reflow profiles. Lumet P39 Pb-free, zero-halogen, no-clean solder paste is for LED assembly and other applications that must pass JIS Copper Corrosion test. Lumet P39 has clear, colorless flux residue; is for LED package-on-board assembly. Is designed to enable consistent fine-pitch printing capability to 180µm circle printed with 100µm thickness stencil. Lumet P52 Pb-free alloy has a melting point below 140°C, and has been used with peak reflow profiles between 155° and 190°C.

Alpha, http://alpha.alent.com/Markets/LED

B-724, B-727, B-728 and B-729 polyimide labels withstand harsh condition wash systems and chemicals. Are engineered to stay adhered to boards during inline and batch washes. Reportedly offer temp. performance up to 500⁰F and excellent resistance to harsh fluxing and wave solder environments. Are RoHS and Reach compliant, UL969 recognized and available in custom sizes.

Brady Corp., www.bradycorp.com

PS300 2HY hybrid batch stencil cleaner is suitable for stencils, PCBs, misprints and solder frames. Is an automatic single-chamber system; features 3-4 step PowerSpray cleaning. Is part of compact C-Class series. Includes two tanks and three circuits. Is PLC-controlled. The three-stage program selector for stencil, misprints, and carriers is pre-configured. Up to 99 programs can be written and saved for later recall. Has safety interlocks, master lock out switch and pressure control switches monitoring tank A and B values. Features ClosedLoop processing.

Kolb Cleaning Technology, www.kolb-ct.com/en/

Cognex Industrial Camera (CIC) series are GigE Vision digital industrial cameras designed for integration with VisionPro and CVL vision software. First four models are 29mm x 29mm, monochrome, area scan cameras. VisionPro provides access to a library of computer vision tools, from geometric object location and inspection to identification and measurement algorithms.

Cognex, www.cognex.com/cic
 

535-18M-57 UV cured epoxy adhesive is formulated for microelectronic assembly applications. Is an ultra-low stress, low shrinkage, ionically clean, low glass transition temperature UV cure adhesive. Is designed to eliminate warpage of components in disk drive assemblies, lens bonding in camera modules, chip encapsulation in smart cards and general bonding applications in photonics assembly. Reportedly cures rapidly when exposed to high-intensity UV light. Does not contain antimony.

Engineered Material Systems, www.emsadhesives.com

Sherlock 3.0 automated design analysis software is for analyzing, grading and certifying the expected reliability of products at the circuit card assembly level. Includes a global parts database with private cloud storage; 3D FEA model and 3D viewer for ICT and shock and vibration analysis; sub-assembly analysis to attach one or more printed circuit board subassemblies to the primary circuit board; improved result management functionality, and embedded failure rate models. 

DfR Solutions, www.dfrsolutions.com

SDR custom size desiccant drying and storage rooms control and trace moisture sensitive components, boards and assemblies. Modular enclosures accommodate feeder trolleys, WIP carts and PCB racks. Employ energy-efficient, dual wall insulated steel construction; enable rapid, oxidation-free drying at 40°-60°C and safe storage per J-STD-033C. U5000 Series Dry Unit is said to deliver 0.5% RH and closed-loop regeneration that responds to the atmosphere in the cabinet. Relevant process data are obtained with use of a 0.8% digital sensor. Data can be logged directly through RS232 with available software links.

Super Dry, www.totech.eu.com
 

Siplace Di-Series placement machines include digital vision systems, single and dual conveyors and multi-language station software. Available with one, two and four gantries. Siplace D1i, Siplace D2i and Siplace D4i place components down to 01005s. Include S-feeders. Component cameras have high-resolution; changeover tables are newly developed. Can accommodate three flexible head types: the 12-nozzle collect and place head, the 6-nozzle collect and place head, and the TwinHead.

ASM Assembly Systems, www.siplace.com 

Tin-bismuth-silver solder paste for SMT assembly has silver content of >1% for improved mechanical reliability and thermal cycling. Melting point is around 139°C. Offers good soldering yield for temperature-sensitive components, shorter reflow cycle times and reduces energy.

Inventec, www.inventec.dehon.com

Scorpion high-speed jetter has piezo jetting valves that enable jetting with speeds of up to 800Hz. Fluid box is less than 150nl. No tubing to connect fluid to jet valve. Can be equipped with up to four valves or pumps, including jet valves, Archimedian screw valves, time pressure valves and slider valves. eDIS software offers context-sensitive help; CAD import is supported. Includes library of best known parameters for common fluids.

Essemtec, www.essemtec.com