White Paper Outlines Tests for Pb-Free Alloy Evaluation
BANNOCKBURN, IL – The IPC Solder Products Value Council has published a free white paper that provides a set of test protocols for the evaluation of new Pb-free alloys on the basis of their physical properties.
Analytical Procedures for Portable Lead-Free Alloy Test Data was developed in cooperation with OEMs and EMS companies to help the electronics assembly industry reduce the time and effort required to characterize an alloy and improve its processes without jeopardizing reliability.
The SPVC white paper prescribes general requirements for determining critical physical and mechanical properties of bulk Pb-free solder alloys used to make high-quality electronic interconnections. It describes material tests that generate portable data for direct comparison of different alloys; aiding in alloy acceptability determination for various applications; development of reliability models, and other uses.
To download the white paper, visit www.ipc.org/SPVC-LAT1.
