New Products
DB-1541-LTC low-temperature curing conductive adhesive is for use in organic solar modules or other temperature-sensitive photovoltaic devices. Optimized for excellent conductivity and stability on various substrates when cured at 100°C. Has a dispensing work life greater than 48 hrs. (measured as a 25% increase in viscosity), while maintaining optimized rheology for dispensing and excellent damp heat resistance and conductivity stability on tin, tin-silver and silver-plated ribbons. Is reportedly ideal for flexible photovoltaic applications with high peel strength. Can be fast cured at elevated temperatures (1 min. at 180°C).
Engineered Conductive Materials, www.conductives.com
Single coated engineered tapes are designed to solve static dissipative, halogen-free flame-retardant and high-temperature applications. Are REACH and RoHS compliant and available in a variety of polyimide, polyester and aluminum constructions. Include an array of liners for hand or die-cutting.
Polyonics, www.polyonics.com
Aquanox A4638 is an electronics assembly and advanced packaging cleaning agent. Is designed to remove flux residue from flip chip and low clearance components; removes water-soluble polar flux residues at low concentrations. Is a nonhazardous, biodegradable aqueous solution. Contains no CFCs or HAPs; is RoHS-compliant, and Halogen-, Halide- and Hexane-free. Is compatible with all materials commonly used in electronics assembly manufacturing and cleaning processes.
Kyzen, www.kyzen.com
Flight Status Board Tracking System tracks the progress of circuit boards throughout the manufacturing process. Can see defects in real-time. Is visible for employees to track the status of orders at any point in the manufacturing process. Touch-screen displays present a list of projects and board counts within specific process centers, including the quantity of boards in previous and subsequent process centers. Can see enforced route and contact information of specific project. Can see when nearing the end of the quantity of boards for current run.
ACD, www.ACDUSA.com
The free, illustrated 2011-2012 Dummy Component Catalog is now available. Features dummy components that have the same materials and are made on the same production lines as live components, as well as standards and future technology needed. New sections in the catalog include an expanded selection of flip chips and flip chip test kits; Quick-Pak open-molded quad flat pack no leads; FusionQuad board and kits; IPC A620 compliant wire harness kit; IPC PCB-J-STD compliant hand solder kit; PCB-B-25A standard test board; PCB-B-24 standard test board, and PCB-B-36 standard test assembly. Numerous product revisions also are included. Additional technology includes Amkor’s TMV package; WLP Wafer Chip Size Packages’ finished package, and a Dummy Component Sample Case.
Practical Components, http://www.practicalcomponents.com/catalog.htm
MFR-1300 standalone desoldering equipment builds on existing MFR technology. New design permits hand piece to be used in two configurations. Can swap grip on hand piece from standard pencil grip to pistol grip. Power supply features internal pump that provides 0.7 bar (21" Hg) of vacuum suction force, combined with Smartheat technology. Has dual switchable output; can operate one or two different hand pieces. Includes replaceable collection chamber. Solder collection capabilities reportedly have been increased 40% from previous MFR desoldering systems.
OK International, www.okinternational.com
Press Releases
- 4FRONT Solutions Invests in Seica’s PILOT V8 NEXT Flying Probe Tester to Enhance Test Capabilities at DeLand, FL Facility; Mike Sementelli Comments
- FRANK Elektronik invests in high-precision SMT line with ASYS machines; Robert Both Comments
- SASinno Americas Opens State-of-the-Art Facility in Washington, Missouri to Support North American Manufacturers; Mike Young Comments
- ZESTRON Hosts Webinar on “Electronic Assembly Failures, Solutions and Lessons Learned for Long Term Reliability”