CM-series ionic tester uses a solid gold test-cell, ballistic amplifiers, and high-volume pumping systems. Produces complete test solution change more than 6x per min. PC-based software is used to produce graphical test data, a pass/fail analysis, and automatic hard copy print-out using test methods according to MIL and DEF standards. Features include solid gold measuring cell and ballistic amplifier, providing a test accuracy of < 0.005mS/cm; curve-fitting analysis algorithm (merit of fit); complete testing within 3 min.; full regeneration in < 6 min.; accurate measurement, and automatic temperature compensation. Measures in accordance with all international and MIL specifications, and complies with J-STD 001, IPC-TM-650, and DEF Standard 00-100/3.
GEN3 Systems, www.gen3systems.com
FX SL inspection system reportedly offers accelerated throughput at more than twice the inspection speed of previous systems. For inspection of solder and lead defects, component presence and position, correct part, polarity and through-hole parts. Typically takes less than one hour to create a complete inspection program, including solder inspection. Inspects 01005 components. Uses a standard package library. Has Advanced Fusion Lighting and 5 MP image processing technology, including color inspection, normalized correlation and rule-based algorithms.
Nordson YESTech, www.nordsonyestech.com
Fuji XP SMT nozzles come in standard and special nozzle designs for odd-form components, such as LEDs, switches and connectors. Are guaranteed to function properly with the following pick-and-place equipment: XP142, XP143 and XP242. Nozzles are also available for XP141 series machines and XP143 with automatic nozzle changer.
Count On Tools, www.cotinc.com
THERMLfilm HT is a high-temperature polyimide film able to withstand fluctuating temperatures, abrasion and chemicals. Is for high-density barcode and alphanumeric PCB labels. Topcoat provides a smooth printing surface. Is reportedly ideal for data matrix codes; provides consistent ANSI scannability. Static dissipating qualities of the topcoat minimize the risk of print voids. Heat resistance testing has revealed endurance at 500°F/260°C continuously for 5 min. and intermittently at up to 750°F/398°C.
FLEXcon, www.FLEXcon.com/HT
SN100C (551CT) is a Pb-free, fluxed-cored solder wire formulated for soldering tip temperatures up to 380°C with good tip separation for reduced icicles. Is said to deliver an Ag-free stable microstructure. Is designed for high-speed robotic soldering processes; excellent wetting and high spread factor offer increased soldering speeds with hand soldering. Said to provide fast wetting and increased spreadability over SAC 305.
Nihon Superior, www.nihonsuperior.co.jp
CI-1083-L and CI-1081-H conductive grid inks are for use in thin-film solar modules. Have been optimized for excellent conductivity and low contact resistance on transparent conductive oxides used in solar applications. CI-1083-series conductive grid inks have high solid contents and optimized rheologies to enable screen printing of high aspect ratio fine lines. Are low stress, low shrinkage thermosetting inks that reportedly offer excellent moisture resistance and low polymeric creep. Line resistivity is 8 mΩ/sq/mil (1 mil emulsion; 230 mesh).
Engineered Conductive Materials, www.conductives.com