HS70XL inline SPI handles printed circuit boards up to 22 lbs (10kg). Features sensor head camera, timing conveyor belt, and four sets of motors. Uses dual CPUs to handle data. Measuring speed is 80cm2/sec. at 20x10 micron resolution, and 40cm2/sec. at 13x7 micron resolution. Inspects smaller than 01005 pads and sizes as small as 100u microns.

Parmi, www.parmi.com

Macromelt MM6208 low-pressure molding material is for high thermal stability and chemical resistance. Has a 95°C relative temperature index rating; reportedly the highest RTI rating in its class. Uses an application pressure of between 20 and 500 psi. Is for certain automotive, consumer and appliance applications.

Henkel, www.henkel.com/electronics

Board Merger enables automatic generation of a project database, while maintaining original signal designations and board characteristics. Debugging is facilitated and diagnostic information quality is reportedly improved. Handles each board as an individual object with bequeathing properties. Connections between single objects are initiated by referencing maintaining the original net designation. I/O modules can be inscribed into the principle as adapters. If modules of the same type are used, the whole process is handled through duplicating. Is integrated as standard in the System Cascon development package starting with version v. 4.6.

Goepel electronic, www.goepel.com 

Copper Glass-Coated Micro Wire features glass insulation for use in semiconductor wire bonding. Is a replacement to traditional copper bonding wire or gold wire. Is cast, not drawn, to enable a soft metal core with a high strength, ultra-fine glass coating. Is said to eliminate anti-oxidation, enabling a longer shelf life. Supports larger spools, for simpler materials management. Protects against shorts since the wire is coated and cannot make contact. Scale to 4 microns.

RED Micro Wire, redequipment.com