XCT-2000i inline computed tomography system is fully automatic for 100%, nondestructive part inspection. Can be equipped with different x-ray tubes and detectors. Is integrated into production line – including loading and unloading unit; can be adapted to process control and QS system. Cycle time is less than a minute, including part handling. Is equipped with MIPS software. Covers defect inspection of castings (cavities, shrinkage, pores, cracks, and inclusions); also measures forms and structures (wall thickness or distances). 

MatriX Technologies, www.m-xt.com

Tempotac (120-TEM) tacky flux features basic ingredients of a solder paste flux, including various activators. Can withstand higher temperatures and comes in a blue color for inspection purposes. Can be used in rework applications: reballing; repair applications; BGA placement, and bridging. Passes all SIR tests. Residues can be removed using a typical flux-remover.

Balver Zinn/Cobar Group, www.balverzinn.com, www.cobar.com 

VHX-2000 digital microscope incorporates zoom optics with a CCD camera, 17" LCD monitor, light source, controller and analysis/reporting software. Has a magnification range from 0.1x - 5000x; is for macro-scale stereoscopic imaging to analysis of a SEM. Supports bright and dark field, transmitted, polarized, and differential interference observation. Has a color filter wheel; can choose a specific wavelength of light (red, green or blue). Super resolution mode combines blue filter with pixel shift technology. Can be equipped with a motorized XY stage along with motorized Z-axis lens control. Can adjust movement in all three axes by using an included control pad. Image stitching function can be completed with a push of a button to produce up to a 20,000 x 20,000 pixel image that expands the viewing area up to 200 times.

Keyence, www.digitalmicroscope.com/VHX2PR

SI software release 7.45 includes improved component body detection for SOTs, new color ring inspection capability for resistor values, simplified optical character recognition, and solder ball inspection. For color ring inspection, a new analysis process based on color images from 8Mb camera technology is now available. Reportedly ensures fast, reliable color ring inspection for MELF and through-hole components.

Viscom, www.viscom.com