Through-hole 1mm pitch 860 series headers and 861 series single-row sockets provide support for applications requiring multiple insertions and extractions. Have solder tail diameters of 0.015"and 0.014" respectively. Tail diameters allow for smaller PCB holes. Insulator bodies have standoffs on the termination side of the connectors to aid in solder flow during the soldering process. Header and socket provide a mated height of 0.200" for board stacking applications. Are available in 2 -50 positions and are RoHS compliant; sockets have gold-plated shells and contacts; headers have gold-plated pins.

Mill-Max, www.mill-max.com/PR629

Alpha Argomax silver sinter pastes and films are for die attach applications. Were manufactured to perform well in fast sintering, high-volume manufacturing processes.

Atrox is a conductive adhesive for die attach applications.

Alpha, www.alphacpmd.com         

UV2000 ultraviolet light curing oven encloses Fusion UV lamp system, resulting in an 8% reduction in noise output, less RF interference, and enhanced service access. Has lamp height adjustability of 50mm – 200mm, and includes standard light baffles. Convert from single-sided to double-sided oven with four additional parts. Uses UV lamps to initiate fast UV light polymerization of adhesives and coatings. Various UV beam widths available.

PVA, www.pva.net

Model 2651A High Power System SourceMeter Instrument is for testing high power electronics, semiconductors, and materials. Features broad dynamic range, capable of sourcing or sinking up to 2,000W of pulsed power (±40V, ±50A) or 200W of DC power (±10V@±20A, ±20V@±10A, ±40V@±5A).

Keithley Instruments, www.keithley.com