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Excen high-speed modular mounter has 16 nozzles and a speed of 120,000 CPH. Is for fine chip placement; monitors pre- and post-part placement. Has a side-view vision system. Includes non-stop device type change; mixed production of different boards, and a smart feeder with auto splicing and auto loading functions. Applies high rotary modular head.

Samsung Techwin SMT, http://www.samsung-smt.com

Alternative Tracks permits components to be installed in multiple tracks of the component cart. When the first feeder runs empty, the system automatically switches to an alternate, which can be set up on any track of the component cart. Designed for applications where splicing should be avoided or where traceability is needed at the component level. If a component reel runs out, the job can continue running non-stop with predefined alternative components. When a track is empty, the system automatically switches to a feeder and components on an alternative track. The respective feeders and components can be set up on the same component cart. Operators can set up alternative tracks in advance as part of the product setup or immediately before the primary track is about to run empty.

ASM Assembly Systems, www.siplace.com

V510 G2 series AOI has inspection speeds up to 55 cm2/sec for post-reflow and 65cm2/sec for pre-reflow. Features low power consumption with an LED monitor display. Multi-shot imaging technology can capture up to 180 frames per sec.; multi-core processing enhances inspection time. Features optical color inspection, color pattern matching, network offline programming, flexible universal fiducial, pad overhang detection, and centralized library distribution.

ViTrox, visit www.vitrox.com

In-Sight 7010 is an entry-level vision system developed for inspection tasks where vision sensors are too limited. Includes autofocus optics and integrated lighting. Applications are configured with EasyBuilder user interface. Vision library focuses on tools most frequently used. Is reportedly ideal for production situations requiring regular part changes, or applications that require vision system to be placed in hard-to-reach spaces. Can set and save focus values associated with inspection of each part. Can fine-tune focus levels manually. Includes five lens options.

Cognex, www.cognex.com/IS7000

SonoSimulator software is now a standard feature on Gen6 C-SAM acoustic microscope. Determines optimal gate positions and other parameters; results in high-quality acoustic images. Can create a virtual die stack that matches the characteristics of the physical 3D IC or die stack to be inspected, including defects at specified layers. Virtual defects help determine optimum placement of gates to image specific levels in the stack. Imaging parameters are then transferred to the Gen6 Sonolytics software and used to image the physical 3D IC or die stack.

Sonoscan, www.sonoscan.com

MicroLine 6000 P UV laser system is for etching, drilling, cutting and depaneling printed circuit boards (PCB). Now includes automatic beam correction for environmental interference and an advanced vision system. Delivers operative parameters, machine data, tracking and tracing values, as well as information about individual production runs. Has a working area of 21" x 24".    

LPKF, www.lpkf.com

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