Smart Tweezers ST5 is for component evaluation, on-board impedance testing, and SMT component sorting. Automatically determines the type of component and selects proper range and signal frequency for highest accuracy measurement. LCR-meter displays component type, measurement results, and test conditions used to determine results. Accuracy level is said to be about 0.2%. Also shows parasitic resistance and measurement. Tests for continuity and diodes. Evaluates all passive types of surface mount components, such as resistors, capacitors and inductors as small as 0201 size (0.3 mm).

Siborg Systems, www.smarttweezers.ca

EPM1-2493 low-viscosity, low modulus silicone elastomer has a nominal thermal conductivity of 1 W/mk. Offers bond lines as thin as 5 microns. Adheres materials with differing coefficients of thermal expansion (CTE) for significant stress reduction during thermal cycling. Reportedly reduces or prevents contamination of electronics components in applications exposed to high heat, such as solder reflow at 260°C. Adheres to aluminum, and with a primer achieves average lap shear values of120 psi (0.8 MPa). Is a pourable, conformal liquid for potting/filling recessed areas. Can be used for adhering integrated circuit substrates, base plates or heat sinks, or where grooves or other configurations require a limited flow material. Comes in a 1:1 mix ratio and can be loaded into syringes and dispensed as a one-part material for automated dispensing. Cures at lower temperature but can be heat-accelerated for faster cure time.

NuSil Technology, www.nusil.com

ROI Calculator determines the cost of performing rework and repairs associated with solder contamination in wave solder operations. Determines amount of defects. Input data for shifts, days and working weeks per year.

Solderlab.com, www.solderlab.com/cost_of_rework

SFX5212 I/O module provides independently programmable I/O channels, and reportedly processes voltages up to 30V. Increases test coverage for non-boundary scan circuits or peripheral signals with higher signal voltage by combining structural and functional test procedures on a single platform. In addition to increasing test quality, test costs can be reduced by saving separate process steps.

Goepel Electronic, http://www.goepel.com