Fast-curing CA-141 conductive adhesive is for stringing and bussing CIGS solar modules. Has been optimized for molybdenum and other substrates used in thin-film manufacturing. Is designed for thermal cycling and damp heat stability. Low Tg is suitable for manufacturing flexible modules using reel-to-reel manufacturing. Can be partially cured for 60 to 90 sec.; adhesive cure is completed during encapsulant lamination process. Reportedly has optimized rheology for dispensing, excellent damp heat resistance and conductivity stability on molybdenum, tin, tin-silver and silver-plated ribbons.

Engineered Conductive Materials, www.conductives.com

WXD 2 is a two-channel, 255W soldering and desoldering station. Features desoldering tool with 120W of power, a 35-sec. heat-up time, replacement filter cartridge and nozzles with extended shafts. Standby mode monitors motion sensor and automatically sets pencil to lower temperature when not in use. Nozzles have extended thermal transfer shaft that prevents suction tube from sticking. Has standard power-sharing feature. Preheating plate or solder fume extraction unit can be connected.

Weller, http://www.apexhandtools.com/weller 

PNA-X network analyzer now has source-corrected noise-figure measurement capability of 43.5 and 50GHz. Provides a single-connection, multiple-measurement capability for R&D and manufacturing engineers developing and testing low-noise transistors, amplifiers, frequency converters and transmit/receive modules. The 50GHz noise hardware features a built-in low-noise receiver and impedance tuner. Network analyzers combine S-parameter vector-error correction and an impedance tuner to remove the effects of imperfect system source match.

Agilent Technologies, www.agilent.com 

HP-520SPI is closed-loop solder paste inspection system that provides real-time measurement and control of solder paste. Automatically adjusts squeegee pressure and speed, initiates screen cleaning sequence, and stops production if a PCB cannot be brought into programmed specification. Three-stage automatic conveyor buffers printed circuit boards on entrance and exit. Features edge clamping; programmable control of squeegee pressure during print stroke; servo-controlled support table.

SJ Inno Tech, www.sjinnotech.com