Continuous Path Motion Control software for jetting underfill for flip chips optimizes dispense head motion, saving time and increasing units per hour. Instead of stopping to move between die, backtracking, ramping to speed, dispensing, and decelerating, the head maintains a continuous speed and direction throughout the process. Improves overall cycle time by 27% under certain conditions.

Nordson Asymtek, www.nordsonasymtek.com

5R6-900 benchtop laboratory temperature controller has ramp/soak capabilities. Single enclosure device plugs into wall as a self-contained temperature control system. Can be used universally, wherever user is located. Solid-state MOSFET bidirectional compact unit features internal power supply and handles load currents up to 10A. PC programmable. Features digital display for controlling functions, including adjusting output voltage and setting the desired temperature. Auto output shuts down unit if sensor is opened or shorted.

Oven Industries, http://www.ovenind.com

NCM5000 dispense pump has two wetted parts -- a flexible diaphragm and nozzle plate -- and no seals or springs to replace or adjust, to simplify field operation. Uses a high-speed pneumatic solenoid to drive jetting action. Offers continuous frequency of up to 300Hz. Main body of pump has built-in non-wetted heater to maintain fluid temperature for consistent results. Priming volume is 0.09 cc, minimizing lost materials and maximizing production per fluid reservoir. 

Replaceable diaphragm is impregnated with carbide ball and available in different materials for fluid compatibility. Nozzle plate can be configured with durable ceramic nozzles in a variety of sizes. Nozzles are field replaceable and require no adjustments once replaced. For UV encapsulants, underfills and SMT adhesives.

GPD Global, www.gpd-global.com

OhmegaPly MTR permits thin-film resistors to be built within a printed circuit trace less than 0.004" wide. Using standard subtractive printed circuit board processes, it is for high density interconnect designs where passive component placement is difficult.

Omega Technologies, www.ohmega.com