TOM system (Teachable Optical Measurement) inline AOI has been enhanced for inspection of conformal coating Maximum PCB size 460 x 400mm. Can be adjusted to specific test requirements. Range of possible standard camera configurations extends from one to multiple camera configurations (1 to 5Mp) as color or black/white variant. Various illuminations for the visible and UV ranges (conformal coating) are available. Also can be used for component presence, selective solder joint inspection, display and LED check, color recognition and optical character reading. Intuitive software enables a simple, convenient test program generation without programming knowledge. Custom camera, illumination and software integration optional.

GÖPEL electronic, www.goepel.com

Many Separo solder recovery system quickly and easily reclaims solder. Reportedly turns a shift's worth of wave solder dross to usable solder ingots in under an hour.  Works with lead-free or SnPb alloys and is capable of treating 4 to 5 kg (9 to 11 lb.) of hot or room-temperature dross per cycle. Heavier solder alloy settles at the bottom of a heated crucible while lighter dross oxides rise to top and are captured in a custom filter. After 30 to 40 min. molten solder is transferred to the five ingot molds below the crucible. No chemical additives required. Reclaimed alloy is 100% pure and usable.

MGR Electro, mgrelectro.com/en/prodotti/separo-2

Manncorp, manncorp.com/solder-recovery

XACT 3 inline screen and stencil printers feature a 508 x 508mm (20 x 20”) print format, and 12 sec.+ print cycle times. Come with adjustable stencil guide rails and accept stencils up to 29 x 29” without adapters. EVA vision system ensures ±15µm @6 Sigma alignment repeatability and facilitates 2D print inspection. Pneumatically driven closed-loop print heads ensure constant print pressure throughout the print stroke. Cleaning system benefits from side channel fan upgrade with higher vacuum flow. Features servo motors and upgraded L-shaped belts to improve transport of thin substrates. Options include 2D print inspection, vacuum tooling set-up, heavy duty transport and SPC data interface. User-friendly Wizard interface eases setup.

ASYS Group, www.asys-group.com

CondensoXS vapor phase reflow system reduces floor space by 25%. Uses injection principle and controls temperature and pressure (vacuum) for precise, diverse reflow profiling. Solders heavy units quickly and reliably. Horizontal transport of the assembled board prevents components from slipping, reducing reject rates rework requirements. Boards load at the front, underneath the cooling system.

Rehm Thermal Systems, www.rehm-group.com