MV-9 SIP is configured with Omni-Vision 2D/3D technology for semiconductor inspection. Combines 25Mp CoaXPress 2D ISIS vision system with digital multi-frequency quad Moiré 3D system for inspection of semiconductor assemblies. Features four 10Mp side-view cameras and 25Mp top-down camera. MP-7 Micro is designed for BGA ball inspection. Is configured with 15Mp ISIS vision system, a 6µm telecentric compound lens and color strobe LED lighting.
Mirtec, www.mirtec.com
Sigma G5JS single-beam mounter implements overdrive technology for utilization of front and rear resources via a single placement head. Head can be high-speed (up to 44mm square single shot recognition) or multifunction. Head is rated at 37,500 cph; multi-function head is rated at 7,000 to 9,000 cph for chip components, excluding transition time of approx. two sec. Can choose from three different tray feeders.
Hitachi High Tech Instruments, http://www.hitachi-hta.com
SM3320S-S single table, SM3350S-D twin table and SM4520L-D twin table floor-mounted printed circuit board depaneling routers feature built-in high-res color CCD cameras with 20x magnification. Program cutting path with controls that are saved, edited and copied. Vision system is included to check fiducials before cutting starts or can be turned off. Precision ball-screw and linear guides maintain repeatability of ±0.03mm. Offer dust collection from the bottom with a built-in ionizer and a safety shield.
Fancort Industries Inc., www.fancort.com
Amtech VS-213 no-clean, lead-free solder paste formula is halogen-free based on all testing methods, including oxygen bomb combustion and ion chromatography. Is said to be environmentally friendly and fully compliant with ROHS 2011/65/EU. Helps prevent voiding when soldering LGA, BGA, CSP and QFN packages. Wets easily, has long stencil-life, and 16-hour abandonment time. Thermally stable at temperatures up to 300oC. Meets highest IPC 7095 voiding performance classification of Class 111. ROL0 flux classification. Post-reflow residue said to be nonconductive and noncorrosive.
SMT International, www.amtechsolder.com
ESV-200 XXL and ESU-400 XXL printed circuit board handlers are for high-volume production of 1220mm LED PCBs. ESV XXL was redesigned as a rear load, bare PCB line loader capable of handling LED boards up to 1220 x 370mm. Vacuum lift mechanism is positioned for long, narrow PCB production; elevator platform can hold up to 150 panels. ESU XXL is a magazine line unloader that accepts completed panels and secures them into custom magazines. Handles LED boards up to 1220 x 370mm in width, using custom 50 slot ESD magazines. ESU is equipped with a feed conveyor with pusher mechanism, precision indexing elevator with pitch selection, automatic magazine changeover (two-up/two-down configuration) and touch panel. Both include safety covers, PLC, SMEMA, roller wheels and leveling feet. XXL ESD magazines (1220 x 370mm) and interconnecting conveyors are available.
Promation, http://www.pro-mation-inc.com/
Press Releases
- Altus Supports Phoenix Systems in Advancing THT Assembly with Robotic Soldering; Joe Booth Comments
- Robert C. Donovan Joins DISTRON CORPORATION, Marking the Third Generation in Family Leadership
- Incap UK Invests in SMT Technology as Part of Long-Term Operational Development
- Evolve Manufacturing Celebrates 100 Years of Combined Leadership in Medical Device Manufacturing; Noreen King Comments