Circuits Assembly Online Magazine - Features

No. 887 is a gas-fired 1000°F cabinet oven used for curing metal coatings onto parts. Workspace dimensions measure 38” x 38” x 38”. 175,000 BTU/HR installed in a modulating natural gas burner provide heat, while a 2,000 CFM, 2-HP stainless steel recirculating blower furnishes a horizontal airflow across the workload. Features an aluminized steel exterior, Type 304, 2B finish stainless steel interior, plus inner and outer door gaskets that seal against the door plug and front face of the oven. Has 8” thick insulated oven walls, consisting of 2” of 1900°F block and 6” of 10 lb/cf density rockwool insulation. Safety equipment is onboard as required by IRI, FM and NFPA Standard 86 for gas-heated equipment, including a 325 CFM, 1/3-HP powered forced exhauster. Digital indicating temperature controller is provided.

The Grieve Corp., www.grievecorp.com

Explorer real-time monitoring uses DataMan barcode reader. Incorporates scalable architecture, a web-based performance statistics interface, and novel vision technology. Trends read rates, evaluates images from packages that were not read and classifies those images. Connects to a network of DataMan readers and regularly pulls read rate information and images from packages. When a process error results in a package with an unread barcode, images are sent; automatically evaluates and categorizes each image and stores them in a database.

Cognex Corp., http://www.cognex.com

PSV3000 automated programming system uses FlashCORE III programming engine; combines programming technology with intelligent system integration. Includes pick-and-place technology and vision system. Is reportedly capable of delivering up to 1000 parts per hr. in tape and tray configurations. Supports up to 16 individual programming sockets and all device types, including FPGAs, CPLDs, microcontrollers, and flash memories, including serial flash, eMMC, NAND and NOR devices.

Data I/O, www.dataio.com/PSV3000

Multi-Phi laser soldering robot can be adjusted for each soldering pattern. Variable diameter laser beam optimizes energetic conversion into heat. Components reportedly can be soldered from any direction without interference. Has fixed z-axis distance; variable is 0.004-0.12". Unix-413S mid-size soldering robot and Unix-414S wide-area soldering robot come with clean cut feeder and lock-on mechanism.

Japan Unix Co., www.japanunix.com

MC7885-UFS flip-chip underfill has a Tg of >240°C and stress-absorbing capabilities. Underfills large-area flip-chip components and reportedly cures without voids and internal stresses. For use in chip-on-board underfill and standard flip-chip underfill component applications. Reportedly withstands temperatures up to 350°C without thermal degradation. Cured underfill has less than 20ppm/°C in coefficient of thermal expansion and higher than 6 GPa in modulus. Most curing can be done at 120°C; can increase temp. to 150°C.

AI Technology, www.aitechnology.com

Genealogy software module is capable of tracking, tracing and controlling printed circuit boards throughout assembly to the finished product. Captures the identity of each individual PCBA, subassembly or other item, and links information directly to the serial number of the finished product. Enables drill-down to multiple levels of subassembly, identifying which component lot numbers were used to build a specific PCBA in a specific product serial number. Traceability database is backwards-searchable to identify which product serial numbers were built using a specific component lot number. Permits multi-level box build traceability and improves inventory control with real-time visibility of all materials in process (WIP). Is said to reduce manufacturing, warranty and customer service costs, and improve product quality with automated quality control.

Cogiscan, www.cogiscan.com