SI 7.47 software release has improved downlink function for solder paste inspection (SPI), automated AOI assurance, and includes new µBGA analysis, among other features. Has closed-loop interfaces to MPM and Panasonic printers and extended connections to DEK and Ekra printers. Now supports print process without barcodes. Integrated Verification facilitates simple assurance of AOI inspection program quality by automatically saving all defect images acquired at the verification station and making them available for future optimization or generation of new inspection plans. Extends µBGA inspection by an analysis with features combination that conjoins and evaluates completely different features. New converter changes all relevant parameters of the inspection pattern automatically, at the press of a button. 

Viscom, www.viscom.com

Solder saver is for use with SnPb and Pb-free wave soldering machines. Design changes include a separate activation switch; user can hold it in one hand and activate it with the other. Has an adjustable handle to reach solder pots in wave soldering machines. Can recycle dross; scoops hot dross from surface of the wave solder pot. Dross oxides are separated from the solder by high-speed rotary process system. Works on a continuous process basis.

Aprotec Instrumentation, aprotecinstrumentation.co.uk
 

Chemask HT is a fast curing, peelable temporary spot mask formulated for long-term heat protection at elevated temperatures. May be used to protect pins, posts, contacts and edge connections in the solder reflow oven or during conformal coating processes. Chemask Aqua solder masking agent is a high-temp. temporary spot mask that protects component-free areas from molten solder during wave soldering. Is water-soluble, designed to be removed with open and closed loop aqueous cleaning systems, low foaming, and has no effect on deionized water system resin beds.

Chemtronics, www.chemtronics.com

Solder Ball Placement Kit, part of the convection rework accessory range, enables repeatable and consistent rework of small components. Includes tools necessary to rework small chip components:

* 2000 each of 0.04mm, 0.06mm, 0.08mm, and 0.10mm solder balls with container.
* Four ESD-safe carbon fiber reinforced oilers; black 0.2mm, blue 0.3mm, green 0.5mm, and red 0.8mm.
* One part positioning matrix and squeegee.
* One PEEK spudger.
* One bent tweezers.
* One half tweezers.
* One 5000 grit sharpening stone.

About Metcal, www.metcal.com/sbpkit