Automated Flash Program Generator (AFPG) supports all in-system programming options. Is a tool for automatic generation of scripts for universal in-system programming of non-volatile memory such as flash devices, and also microcontrollers with integrated flash and via boundary scan. ISP programs mounted devices directly in native environment. Supports universal in-system programming of NAND flash devices, phase change memories, OneNAND components, FPGA embedded instruments, connected processors and via boundary scan. Provides a graphical definition of the command sequence, various possibilities for bad block handling, multi-site support and a block library.
Goepel electronic, www.goepel.com
SMT 88 series underfills enable a faster cure while at room temperature. Are adhesives that reportedly combine advantages of fast cure in UV adhesives and reliability of capillary underfill. Can be underfilled at room temperature without preheating a substrate. Advantages include void-free underfill, easy rework, easy dispensing, outstanding reliability, and excellent mechanical resistance. Can be used for chip scale packaging, ball grid array devices, package-on-package, land grid array, and flip chip applications. Suitable for bare chip protection in packages such as memory cards, chip carriers, hybrid circuits and multichip modules.
Yincae Advanced Materials, www.yincae.com
MDP-300 combines flip chip, thermosonic, and thermocompression bonding in a single, small footprint. Includes synchronous head motion that enables bond head and dispenser to work in parallel. Is said to increase bond quality and enhance overall throughput. Supports up to 300mm (12”) wafer substrates. Connects to SMT machines.
Panasonic Factory Solutions Co. of America, www.panasonicfa.com
Vision Mini Xi industrial compact smart camera with embedded Ethernet is for close-range industrial auto ID, inspection, and other machine vision applications. Is reportedly the smallest fully-integrated smart camera with embedded Ethernet, measuring 25.4mm x 45.7mm x 53.3mm. Weighs 3.2oz. Features serial connectivity, a 24-volt interface, and optically isolated I/O. Can handle dot peen marks on power-train components, laser markings on medical devices or printed circuit boards, and printed barcodes on packaging and labels.
Microscan, www.microscan.com
Horus 3D measurement system measures volume and dimension of nearly any type of substance, part, component, or die. Can measure transparent and shiny materials and difficult-to-measure objects at production speeds. Is for semiconductor applications and electronics manufacturing and assembly applications, including board-level SMT. Can measure flux and solder balls using wide field of view optics. Can be used as inline inspection machine.
Koh Young Technology, www.kohyoung.com
2004D multi-purpose dispensers combine 3-axis robots with digital dispense controllers for SMT assembly tasks. Provide point-to-point, linear, or curved-arc application of solder pastes, solder masks, conductive epoxies, and other adhesives. Benchtop units weigh fewer than 100lbs.; can store up to 10,000 different dispensing routines created through the use of a handheld teach pendant. Can import CAD and graphics file formats and 3D interpolation of arc and line data points. Feature high-torque drive mechanism for speeds to 800mm/sec. and linear guide rails for a repeatability of ±0.01mm per axis. Have 100mm of z-axis stroke and braking system that can hold up to a 6kg payload without power.
Manncorp, www.manncorp.com
Press Releases
- Robert C. Donovan Joins DISTRON CORPORATION, Marking the Third Generation in Family Leadership
- Incap UK Invests in SMT Technology as Part of Long-Term Operational Development
- Evolve Manufacturing Celebrates 100 Years of Combined Leadership in Medical Device Manufacturing; Noreen King Comments
- STI Celebrates Christy Hill’s 20 Years of Dedicated Service; David Raby Comments