Dow Corning EA-7100 adhesive is based on silicone chemistry. Enables strong bonds to a variety of substrates. One-part, heat-cure adhesive cures rapidly and at lower temperatures from inside out. Forms strong bonds to metals, ceramics, glass, laminates, and plastics. Reportedly has up to 50% faster cure time than conventional heat-cure platinum catalyzed silicone adhesive systems; achieves full cure within 15 min. at 100°C. Designed for automotive electronics.

Dow Corning, https://www.dowcorning.com/

535-11M-7 UV cured epoxy was developed to pass the reliability requirements in disk drive, camera module, photonics and circuit assembly applications. Is an ultra-low stress, lower glass transition temp. version of 535-10M-1 UV cure adhesive. Can be used for lens bonding in camera modules, chip encapsulation in smart cards, and general bonding applications in photonics assembly. Reportedly cures rapidly when exposed to high-intensity UV light. Is a low outgassing, flexible, high-strength epoxy adhesive that does not contain antimony.

Engineered Material Systems, www.emsadhesives.com

PSV5000 automated programming system combines programming technology with intelligent system integration. Includes pick-and-place technology and vision system for precise alignment and placement. Supports integrated fiber laser marking. Rated for delivering up to 1300 parts per hour.  

Supports all device types, including FPGAs, CPLDs, microcontrollers and flash memories (including serial flash, eMMC, NAND and NOR devices) with tape and tray configurations with up to 6 programmers (24 individual sockets) in a compact footprint. Supports Serial Number Server software. 

Data I/O, dataio.com/PSV5000 

P-series, for atomic layer deposition of thin-film coatings, uses sequential, self-limiting and surface-controlled gas phase chemical reactions to apply ultrathin, uniform conformal coatings on printed circuit boards. Is production-scalable. Is said to deposit a dense, tight, uniform conformal coating.

Picosun, www.picosun.com