Corstat XD provides buried shielding and a cured outer layer furnished in novel corrugated material. Durable, UV-cured outer layer said to give a shiny, sealed finish while reducing FOD. Provides a buried shielding layer for ESD protection.

Conductive Containers, www.corstat.com  

Dow Corning EA-4600 hot melt room temp. vulcanization black adhesive is for assembly of consumer electronics and other high-volume manufacturing operations. Is formulated to dispense easily and achieve instant green strength. Is a reactive material that can be applied as a liquid melt in <0.5-mm-wide bonding lines. Cools quickly and cures at room temp. to become a viscoelastic polymer that provides adhesion to common plastic and metal substrates. Offers service temp. from -40° to 150°C. Softens when exposed to high temp.; reverts to typical properties after cooling. Incorporates UV markers to support automated UV inspection of finished parts. Can be reworked within 24 hr. of application. Is a solventless, one-component, moisture-cure silicone material.

Dow Corning, www.dowcorning.com

No. 963 is a 250°F, electrically-heated, vertical conveyor oven currently used for curing epoxy.  Workspace dimensions measure 30” x 65” x 83”. 30 kW are installed in Incoloy-sheathed tubular elements to heat the oven chamber, while a 6000 CFM, 5-HP recirculating blower provides vertical upward airflow to the workload. Features 4” insulated walls, aluminized steel exterior and interior, top-mounted heat chamber, two independent doors, and 25 product trays, each 24” x 6”, supported by roller chain and driven by a ¾ HP drive motor, controlled by a variable frequency drive. Controls include a digital indicating temperature controller, recirculating blower airflow safety switch, manual reset excess temperature controller with separate contactors, and a tower light to indicate machine status. Is built to JIC/NEMA 12 electrical standards.  

The Grieve Corp., www.grievecorp.com

Considus dry storage system offers protection for sensitive components and assemblies. Is used when storage under defined conditions of humidity or active component drying is required. Can be used for electronic components, partially assembled electronic modules, printed circuit boards, foils, wafers and components with oxidation-sensitive surfaces. Three dehumidification technologies are available:  adsorption dehumidification; nitrogen dehumidification, and compressed-air dehumidification.  Achieves <3% relative humidity less than one minute after door closed. Allows humidity-sensitive components in accordance with IPC/JEDEC-STD-033 to be stored indefinitely.

Asys Group, http://www.asys.de/agweb/america/press-release/considus